10 research outputs found

    Modelling of the Elementary Steps Involved in the Aluminum Electrochemical Deposition from Ionic Liquid Based Solution: The BMImCl/AlCl3 System

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    The energy hierarchy, of the main chemical species involved in the reaction mechanism relevant to the electrodeposition of aluminum in 1-Butyl-3-methylimidazolium chloride/aluminum trichloride solution (BMImCl/AlCl3), is studied by using ab-initio based theoretical calculations. Eventually, a reasonable theoretical estimate of energies, involved in the principal reactions ruling the aluminum electrodeposition from BMImCl ionic liquid solutions, is obtained. For screening purposes (geometry optimization and Hessian calculations) the CAMB3LYP density functional, DFT, has been used. Then single point (exploiting CAMB3LYP optimized geometries) energy data are obtained at the Moller-Plesset (MP2) level of the theory. They are used to cross-check DFT results. A reaction mechanism emerges in which, although the species AlCl4- is formed with very high efficiency from the neutral species AlCl3, the competing reaction AlCl4- + AlCl3 (sic) Al2Cl7- points to an almost complete conversion of aluminum to the dimeric form into bulk solution. This is observed in the absence and, most importantly, in the presence of a coordinating BMIm(+) cation. In this respect, the presence of BMIm(+) does not seem to affect significantly the equilibrium between the monomeric and dimeric forms of aluminum. This outcome is very interesting because the dimeric species is directly reduced to yield the metal aluminum. Indeed, a larger concentration of Al2Cl7- gives due reason for a more effective electrodeposition process, as it is experimentally observed in the ionic liquid medium. (C) The Author(s) 2019. Published by ECS

    On the Electrochemical Growth of a Crystalline p‐n Junction From Aqueous Solutions

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    Our society largely relies on inorganic semiconductor devices which are, so far, fabricated using expensive and complex processes requiring ultra-high vacuum equipment. Here we report on the possibility of growing a p–n junction taking advantage of electrochemical processes based on the use of aqueous solutions. The growth of the junction has been carried out using the Electrochemical Atomic Layer Deposition (E-ALD) technique, which allowed to sequentially deposit two different semiconductors, CdS and Cu2S, on an Ag(111) substrate, in a single procedure. The growth process was monitored in situ by Surface X-Ray Diffraction (SXRD) and resulted in the fabrication of a thin double-layer structure with a high degree of crystallographic order and a well-defined interface. The high-performance electrical characteristics of the device were analysed ex-situ and show the characteristic feature of a diode

    Electrodeposited white bronzes on brass: Corrosion in 3.5 % sodium chloride solution

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    White bronzes are electrodeposited coatings applied on brass as surface finishes. We report a comparative study on the corrosion resistance in chloride aqueous environment of two white bronzes, a Zn-bearing and a Zn-free. Corrosion tests showed that both materials provide protection to brass, but the Zn-free is more cathodic and performs better in the test environment, following a different corrosion mechanism. We also explored the effect of the coating thickness on the corrosion parameters. We found that the more cathodic OCPs were achieved with coatings exceeding 1 μm, while the 0.5 μm coatings show OCPs closer to the brass substrate.This research was funded by Regione Toscana for POR CreO Fesr 2014–2020 GADGET project (CUP CIPE: D55F17000230009), “ Ente Cassa di Risparmio di Firenze ” Grant Number n. 2013.0878 and Regione Toscana POR FESR 2014-2020 for the project FELIX (Fotonica ed Elettronica Integrate per l’Industria), Grant Number 6455

    Poster Session 4

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