1,721,472 research outputs found
Pola Konsumsi Makanan Satwika Pada Bhakta Hare Krishna di Sri Sri Krishna Balarama Ashram Denpasar
No full textFood is a means of survival. In terms of food, humans have each associated with food consumption patterns. In this research, what is interesting is that Bhakta Hare Krishna in Sri Sri Krishna Balarama Ashram Denpasar has a different food consumption pattern than the general public. Bhakta Hare Krishna in Sri Sri Krishna Balarama Ashram Denpasar does not provide food containing meat, fish, and eggs. This food consumption pattern is called the satwika food consumption pattern. About the observations in this paper related to the pattern of consumption of satwika food at Bhakta Hare Krishna in Sri Sri Krishna Balarama Ashram Denpasar.In further observation of functional choice theory and structural functionalism became a knife of analysis to reveal patterns of consumption of satwika food at Bhakta Hare Krishna at Sri Sri Krishna Balarama Denpasar Ashram.
Bhakta Hare Krishna applies the pattern of consumption of satwika food based on the applicable provisions, rational choice of devotees, and functional for life both physical and spiritual life. Satwika food consumption patterns indicate five agreed components (1) how to obtain satwika food ingredients, (2) types of satwika food ingredients, (3) satwika food menu, (4) how to process satwika food, and (5) how to serve satwika food. As well as the implications obtained from the application of the satwika food consumption patterns have physical, mental and spiritual implications.
Keywords: Satwika Food Consumption Pattern, Bhakta Hare Krishna, Sri Sri Krishna Balarama Ashram DenpasarMakanan merupakan sarana untuk bertahan hidup. Dalam hal makanan, manusia memiliki kebudayaan masing-masing mengenai pola konsumsi makanan. Pada penelitian ini, yang menarik adalah Bhakta Hare Krishna di Sri Sri Krishna Balarama Ashram Denpasar memiliki pola konsumsi makanan tersendiri yang berbeda dengan masyarakat pada umumnya. Bhakta Hare Krishna di Sri Sri Krishna Balarama Ashram Denpasar tidak mengkonsumsi makanan yang mengandung daging, ikan, dan telur. Pola konsumsi makanan ini disebut dengan pola konsumsi makanan satwika. Adapun pengamatan dalam tulisan ini adalah terkait dengan pola konsumsi makanan satwika pada Bhakta Hare Krishna di Sri Sri Krishna Balarama Ashram Denpasar. Dalam pengamatan lebih lanjut teori pilihan rasional dan fungsionalisme struktural menjadi pisau analisis untuk mengungkap pola konsumsi makanan satwika pada Bhakta Hare Krishna di Sri Sri Krishna Balarama Ashram Denpasar.
Secara hasil pengamatan ini diperoleh hal-hal yang mendorong Bhakta Hare Krishna menerapakan pola konsumsi makanan satwika didasari oleh aturan yang berlaku, pilihan rasional bhakta, dan fungsional terhadap kehidupan baik kehidupan jasmani maupun spiritual. Pola konsumsi makanan satwika menunjukkan lima komponen yang berlaku diantaranya (1) cara memperoleh bahan makanan satwika, (2) jenis-jenis bahan makanan satwika, (3) menu makanan satwika, (4) cara mengolah makanan satwika, dan (5) cara menghidangkan makanan satwika. Serta implikasi yang diperoleh dari penerapan pola konsumsi makanan satwika berimplikasi terhadap fisik, mental dan spiritual.
Kata Kunci: Pola Konsumsi Makanan Satwika, Bhakta Hare Krishna, Sri Sri Krishna Balarama Ashram Denpasa
VII. Causes leading to the deputation of a Burmese political mission to the Court of Cochin-China (1822-1824) and its results
No full textSaxena Sri Krishna. VII. Causes leading to the deputation of a Burmese political mission to the Court of Cochin-China (1822-1824) and its results. In: Bulletin de l'Ecole française d'Extrême-Orient. Tome 45 N°2, 1952. pp. 573-579
Hampi ಹಂಪೆ (Vijayanagara District, Karnataka). Sri Krishna Temple ಶ್ರೀಕೃಷ್ಣ ದೇವಾಲಯ, balipīṭha.
No full text<p>Hampi ಹಂಪೆ (Vijayanagara District, Karnataka). Sri Krishna Temple ಶ್ರೀಕೃಷ್ಣ ದೇವಾಲಯ, balipīṭha, as documented 2007.</p>
Fracture analysis of carbon fiber/epoxy matrix interface through microbond and cruciform tests
Full text linkIn fiber-reinforced polymeric-matrix composites, the fiber/matrix interface plays a key role in transferring loads from the fibers to the matrix through shear. In this project, we investigate numerically two tests, used to characterize the normal and shear interfacial failure of a carbon fiber/epoxy matrix system.
The first part of this study is devoted to the simulation of the microbond test, in which, a drop of epoxy deposited on a carbon fiber is subjected to a longitudinal load, which eventually leads to the shear failure of the interface. An axisymmetric finite element analysis is carried out with ABAQUS [2] CAE to extract the parameters (failure strength, fracture toughness, friction coefficient and the final displacement to failure), that define the cohesive failure model used to simulate the initiation and propagation of the crack front along the interface. Emphasis is placed in this study on characterizing the interfacial failure properties of three composite systems, defined by the surface treatment of the carbon fiber. Special care is taken to capture accurately, the shape of the epoxy bead, and in particular, the meniscus created by surface tension effect during the deposition of the bead on the carbon fiber. The nonlinear finite element analysis also takes into consideration, the residual stresses present along the fiber/matrix interface due to the mismatch in the coefficient of thermal expansion between the fiber and the matrix.
The parameters defining the bilinear cohesive failure law are extracted through a comparison between numerical predictions and experimental measurements of the axial force vs. displacement curve. The cohesive model is then validated by simulating the shear failure of other bead/ fiber systems with the same surface treatment. Results show a very strong dependence of the interfacial failure strength and fracture toughness on the surface treatment of the carbon fiber. The numerical analysis also investigates the sensitivity of the solution on the cohesive model parameters.
The second part of this study involves a detailed 3D linear finite element analysis, again using ABAQUS [2] CAE, of the cruciform test, which aims at extracting the transverse (normal) failure property of the fiber/matrix interface. The focus of the work is placed on investigating the effect of key geometrical parameters, such as the thickness of the cruciform specimen and the gap between the fiber and the face-sheets, on the ratio between the maximum transverse traction acting on the fiber and the maximum principal stress present along the fillet of the cruciform. This ratio plays a critical role in determining the location of the failure process, and therefore, the success of the experiment. We show numerically that, while the thickness of the specimen does not seem to affect that ratio, decreasing the distance between the fiber and the face-sheets strongly favors a fiber/matrix interface failure.Submission original under an indefinite embargo labeled 'Open Access'. The submission was exported from vireo on 2016-07-07 without embargo termsThe student, Sri Krishna Potukuchi, accepted the attached license on 2015-12-18 at 16:51.The student, Sri Krishna Potukuchi, submitted this Thesis for approval on 2015-12-18 at 17:18.This Thesis was approved for publication on 2015-12-22 at 15:34.DSpace SAF Submission Ingestion Package generated from Vireo submission #9025 on 2016-07-07 at 13:26:36Made available in DSpace on 2016-07-07T19:52:35Z (GMT). No. of bitstreams: 2
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Previous issue date: 2015-12-2
Evaluation of silver and copper sintering of first level interconnects for high power LEDs
No full textSilver sintering, well known in power electronic applications, is migrating into optoelectronic assembly, to replace other interconnect materials like the eutectic Au80Sn20 or SnAgCu solder. Sintering offers an interconnect that can be formed at low temperature while at the same time can operate at high temperature. The goal of the research of this paper is to develop a sintered interconnect which can replace traditional AuSn or SnAgCu (SAC) solder, offering low thermal resistance, sufficient shear strength and thermo-mechanical fatigue resistance. Silver offers excellent thermal properties and can be an effective replacement in case of low mechanical stress applications. But copper is in case of applications with high thermo-mechanical stress the material of choice due to its higher yield strength and in general due to lower material cost.
Process conditions in case of silver sintering under pressure and pressureless silver sintering have been established. A stable interconnect matching the reference SAC305 solder in terms of mechanical and thermal performance has been realized returning shear strength values averaging 59MPa for silver sintering under pressure and 42MPa for pressureless sintering as against the reference SAC305 solder averaging 56MPa. The thermal performance, measured by transient thermal analysis (TTA) reveal the lower thermal resistance of 0,8K/W and 0,5K/W for silver sintering under pressure and pressureless silver sintering respectively, as against the reference SAC305 solder as expected based on the thermal conductivity of the material. Particles size, binding material, bonding force and bonding atmosphere are shown to have a major impact on the quality of the silver sintered interconnect. Pastes consisting sub-micron and nanoscale silver particles provide less porous interconnect compared to paste containing solely micron sized particles in case of pressureless sintering.
A major challenge with regards to copper nano-powder based sintering is to ensure sufficient penetration of the reducing gas during the sintering process. This is observed also in terms of the mechanical (4MPa) as well as the thermal performance. The paste used in the experiments has not sufficient reducing agents. Based on the results strategies to improve the activation need to be developed for the binder chemistry
Going Beyond Counting First Authors in Author Co-citation Analysis
Full text linkThe present study examines one of the fundamental aspects of author co-citation analysis (ACA) - the way co-citation
counts are defined. Co-citation counting provides the data on which all subsequent statistical analyses and mappings
are based, and we compare ACA results based on two different types of co-citation counting - the traditional type that
only counts the first one among a cited work's authors on the one hand and a non-traditional type that takes into
account the first 5 authors of a cited work on the other hand. Results indicate that the picture produced through this non-traditional author co-citation counting contains more coherent author groups and is therefore considerably clearer. However, this picture represents fewer specialties in the research field being studied than that produced through the traditional first-author co-citation counting when the same number of top-ranked authors is selected and analyzed. Reasons for these effects are discussed
Formic acid and formate salts for chemical vapor deposition of copper on glass substrates at atmospheric pressure
No full textChemical vapor deposition (CVD) typically occurs at pressures below 100 kPa because the quality of the produced film usually degrades at higher pressures. Two different approaches of CVD are presented in this study to successfully deposit thin films of copper on glass substrates at atmospheric pressure. The CVD processes occurred as a result of sublimation and thermal decomposition of Cu formate salts. The chemical composition and morphology of the deposited layers were investigated using X-ray diffraction, infrared spectroscopy, and scanning electron microscopy. The thickness of the layers was increased with a series of deposition cycles and was analysed using X-ray fluorescence spectroscopy and profilometry. The best results were obtained using Cu formate powder as the starting material and operating under a N2 atmosphere at 240 °C and 1 atm. A thickness of 600 nm was obtained after 10 deposition cycles. The resistivity values of Cu films were 2.6 × 10-7 and 8 × 10-8 Ω m after 5 and 10 cycles of deposition, respectively
Thermomechanical Stress in GaN LED Soldered on Copper Substrate Evaluated by Raman Measurements and Computer Modelling
No full textThermomechanical stress due to tensile and compressive strain is a critical aspect in packaging technology. Residual
thermomechanical stress due to large difference in coefficients of thermal expansion between materials generates reliability
problems not only at the bonded interfaces but also for the lifetime of the active regions of high power semiconductors. Raman
spectroscopy is a non-destructive method to investigate the residual stress in semiconductors. Blue LEDs based on gallium
nitride bonded to a silicon carrier by a gold layer were soldered with eutectic gold-tin solder on a copper substrate. The bond
line thickness was varied by application of a bond force between 0 and 21 N and the thickness of the copper substrate was
chosen between 1 and 0.2 mm. The Raman shift of the E2
H phonon mode in the GaN layer was measured between -50° and
180°C. The temperature and assembly depending Raman shifts were analysed using literature data to access the residual
thermomechanical stress. The stress was mapped through the surface to measure its homogeneity. Finite analysis simulation
were performed for further analysi
Variations on the Author
Full text link“Variations on the Author” discusses two of Eduardo Coutinho’s recent films (Um Dia na Vida, from 2010, and Últimas Conversas, posthumously released in 2015) and their contribution to the general question of documentary authorship. The director’s filmography is characterized by a consistent yet self-effacing form of authorial self-inscription: Coutinho often features as an interviewer that rather than express opinions propels discourses; an interviewer that is good at listening. This mode of self-inscription characterizes him as an author who is not expressive but who is nonetheless markedly present on the screen. In Um Dia na Vida, however, Coutinho is completely absent form the image, while Últimas Conversas, on the contrary, includes a confessional prologue that moves the director from the margins to the center of his films. This article examines the ways in which these works stand out in the filmography of a director who offers new insights into the notion of cinematic authorship
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