102,093 research outputs found
Microelectronics Reliability - SPECIAL ISSUE 29th EUROPEAN SYMPOSIUM ON THE RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS, Aalborg, Denmark, 1–5 October 2018
No full textINIBITORI DI PCSK9 : ESPERTI A CONFRONTO G. Iannuzzo: L’esperto di ultrasuoni
No full textConvegno Società Italiana per lo studio dell'Aterosclerosi (sezione Campania
Microelectronics Reliability - SPECIAL ISSUE 23rd EUROPEAN SYMPOSIUM ON THE RELIABILITY OF ELECTRON DEVICES, FAILURE PHYSICS AND ANALYSIS, Cagliari, Italy, 1–5 October 2012
No full textSelf-Sustained Turn-OFF Oscillation of Cascode GaN HEMTs:Occurrence Mechanism, Instability Analysis, and Oscillation Suppression
No full textThis article presents a comprehensive study on the occurrence mechanism, instability analysis, and suppression methods of self-sustained turn-off oscillation, which occurs on cascode gallium nitride high electron mobility transistors (cascode GaN HEMTs). In the beginning, the oscillation waveforms are analyzed, which indicate that the occurrence of the oscillation is determined by test circuit instability. Based on the double pulse test, the impact of the load current I_L, dc bus voltage V-{text{DC}} and gate resistance R-{G} on the self-sustained oscillation is identified. To investigate the instability of the resonant circuit, a small-signal ac model of the resonant circuit is derived. Based on the model, the influences of various parameters on the self-sustained oscillation are analyzed. The analyses reveal the possible methods which can suppress the oscillation. The effectiveness of the proposed methods is validated by the experimental data and simulation results in the end. </p
Proposed design platform for intensive structural computational analysis
No full textESMC- 7th EUROMECH Solid Mechanics Conference – Lisbona 7-11 Settembre 2009 (Riassunto esteso
Expected Life and Failure Model in IGBT Modules under Vibration-Induced Stress: A Case Study
No full textThis article presents a case study on a gel-filled insulated gate bipolar transistor (IGBT) module under mechanical vibration, focusing on its failure mechanism and proposing a life model. First, we used finite element analysis (FEA) with ANSYS to predict the critical stress points, which turned out to be the bond wire feet. Second, we validated these findings to a high degree through experimental tests using a vibrating chamber. In both approaches, a strong correlation is found between the failure rate and the vibration profile, where wear rate increases as one approaches the bond wires' resonance frequency. In experimental tests, all samples happened to fail at the same location, i.e., the upper side foot of terminal bond wires. This result matches the simulation predictions, as these bond wires are the ones with the lowest resonance frequency, hence the closest to the real-world vibrations. A comparison between simulation and experimental results suggest that silicone gel adds to the system a beneficial low-pass behavior that is expected to extend bond wires lifespan
Manifold learning by a deep Gaussian process autoencoder
No full textThe paper presents a novel manifold learning algorithm, the deep Gaussian process autoencoder (DPGA), based on deep Gaussian processes. Deep Gaussian process autoencoder algorithm has the following two main characteristics. The former is a bottleneck structure, borrowed by variational autoencoders and the latter is based on the so-called doubly stochastic variational inference for deep Gaussian processes architecture (DSVI). The main novelties of the paper consist in DGPA algorithm and the experimental protocol for evaluating it. In fact, to the best of our knowledge, deep Gaussian processes algorithms have not been applied to manifold learning, yet. Besides, an experimental protocol is introduced, the so-called manifold learning performance protocol (MLPP), to compare quantitatively the geometric preserved properties of manifold learning projections of the proposed deep Gaussian process autoencoder with the ones of state-of-the-art manifold learning algorithms. Extensive experimental tests on eleven synthetic and five real datasets show that deep Gaussian process autoencoder compares favorably with the other manifold learning competitors
Editorial
No full textThis special issue of Microelectronics Reliability contains the
papers presented at the 23rd European Symposium on the Reliability
of Electron Devices, Failure Physics and Analysis, (ESREF 2012)
which was held in Cagliari (Sardinia), Italy, from October 1 to 5,
2012.
Since 1990, ESREF traditionally focuses on the latest research
findings in Quality and Reliability of materials, devices, and circuits
for microelectronics. It provides the annual European forum, where
researchers coming from all over the world present the results of
their researches related to the various aspects of the reliability
management and define the state of the art in advanced analysis
techniques for present and future semiconductor applications,
with a particular attention to specification, technology and manufacturing,
test, control and analysis
Small dense low-density lipoprotein in familial combined hyperlipidemia: Independent of metabolic syndrome and related to history of cardiovascular events.
No full text1. Atherosclerosis. 2009 Mar;203(1):320-4. Epub 2008 Jul 12. Small dense low-density lipoprotein in familial combined hyperlipidemia: Independent of metabolic syndrome and related to history of cardiovascular events. Pauciullo P, Gentile M, Marotta G, Baiano A, Ubaldi S, Jossa F, Iannuzzo G, Faccenda F, Panico S, Rubba P. Department of Clinical and Experimental Medicine, University Federico II Medical School, Nuovo Policlinico, Edificio 1, Via Pansini 5 - 80131 - Naples, Italy. [email protected] INTRODUCTION: It is unclear whether small dense low-density lipoprotein (sdLDL) are associated with familial combined hyperlipidemia (FCHL), independently of the metabolic syndrome (MS). It is also unclear whether sdLDL are related to history of cardiovascular (CVD) events in FCHL patients, independently of MS. PATIENTS AND METHODS: Serum levels of sdLDL, expressed as percentage of total LDL cholesterol (LDL score), were determined in 137 probands with FCHL and in 133 normolipidemic, normotensive, normoglycemic healthy subjects. RESULTS: In binary logistic regression age- and gender-adjusted LDL score values above the 90th and 95th percentiles of the values in the control group (10.23 and 13.11%, respectively) were found to be significant predictors of FCHL status, independently of MS diagnosis (p=0.007 and p<0.0001, respectively). Values of the LDL score above the 90th and the 95th percentile of the control group resulted to be significantly related to FCHL status, even after adjustment for the components of MS (p=0.006 and p=0.001, respectively). Among FCHL patients, values of the LDL score above 95th percentile of the values in the control group were found to be significantly related to personal and/or family history of CVD events, independently of age, gender, total cholesterol, apolipoprotein (apo) B, and MS status (p=0.016). The same significant relationship was found adjusting for all components of MS (p=0.034). CONCLUSIONS: High concentrations of sdLDL are highly specific markers of FCHL, independently of concomitant MS. In FCHL patients high levels of sdLDL are related to history of CVD events, independently of MS, total cholesterol and apo B. PMID: 18760784 [PubMed - indexed for MEDLINE
Effect of carbon nanotube and functionalized liquid rubber on mechanical and electrical properties of epoxy adhesives for aircraft structures
No full textNew electrical conductive adhesives based on Multi Wall Carbon Nanotubes (MWCNTs) and functionalized liquid rubber have been designed and characterized. The elastomeric domains play a very relevant role in enhancing flexibility and mechanical performance of the adhesive formulation. Lap shear adhesion tests have shown enhancements in the stress up to 69% for the sample containing 25 phr of elastomeric phase in the matrix. The inclusion of MWCNTs in the toughened adhesive can be advantageously employed for further enhancing adhesive properties simultaneously imparting electrical conductivity, which results of 11 orders of magnitude higher than the unfilled formulation
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