1,721,034 research outputs found
Innovative methodologies for the didactics of fashion portfolio: a field research experience
No full text
Culture, fashion and communication design in time of emergency. Communication and design strategies for the sustainable improvement of the fashion and textile production in the Indian subcontinent.
No full textWithin the scenario of contemporary design, we daily observe experiments to redefine the meaning and value of products and give rise to renewed consumer attitudes, with a more ethical approach, according to the logic of circular economy and inclusive practices. The territory takes value from the tradition and the identity of the place, the so-called genius loci, and becomes a symbol for local values through the enhancement of traditional knowledge. In this proficient competition between territories, design becomes the element of dialogue between different societies and cultures.
Today, the prevailing system of the fashion industry has created many environmental, social, and ethical issues behind the glamorous facade. How to reduce fabric waste during the design process has become an urgent requirement for fashion designers, specifically in countries with an outstanding industrial production as India. Even while the country progresses with power looms and modern designs, India still continues to protect its handloom legacy, traditions and culture to sustain the craft and keep it revived. The essay tackles the duality between branding and environmental sustainability for a fashion project developed at GD Goenka University on the theme of capsule collections between textile tradition and green experimentation
RF-MEMS wafer-level packaging using through-wafer interconnect
No full textIn this paper, development of a wafer-level packaging (WLP) process suitable for RF–MEMS applications is presented. The packaging concept is based on a high-resistivity silicon capping substrate that is wafer-level bonded to an RF–MEMS device wafer providing MEMS device protection and vertical electrical signal interconnect. The capping substrate contains Cu-plated through-wafer electrical vias and optional through-substrate cavities allowing for hybrid integration. The RF–MEMS device wafer and the capping substrate are bonded using either solder reflow or an electrically conductive adhesive. After solder bump formation and singulation, this packaging solution results in surface-mount technology compatible components. Moreover, the presented WLP solution allows hybrid integration of additional IC dies that are flip-chip bonded within the capping substrate cavities
Design through the layers: Smart textiles for contemporary design solutions and sustainable consumption processes
No full text"As individual consumers, one of the most responsible actions we can take to protect
the planet is to extend the life of the things we already use."
Taking under advisement the indication of Rose Marcario, CEO of Patagonia, the
Salewa Metro System project aims to analyse and understand which aesthetic,
functional and technical characteristics must be integrated in a garment to ensure
maximum longevity, counteracting the trend towards massive consumption of
contemporary society. Today the textile and fashion industry is the least sustainable
and most polluting among the entire industrial system, both considering the
production side where "every phase of its production chain threatens our planet"
(Shen, 2014), and that of consumption, which hardly adopts or induces habits that
contribute to the cause of a more equitable fashion system. Starting from a stylistic and product analysis of the so-called "vintage" sector, the aesthetic and functional
characteristics that allow a garment to remain desirable, regardless of the fashion
cycles, have been defined. Quality, functionality, style and sustainability are critical
factors both from an environmental and also a commercial point of view, if we
consider the ever-increasing sensitivity of the market to issues related to the
protection of the planet. In the hyper-connected contemporary society, the ever-
increasing search for technologies and materials related to well-being and health, in
contrast with an extremely tiring urban environment, have been analysed together
with the latest growing fashion trends as “athleisure”, where the demand for stylistic
freedom, comfort and sporting performance is central. The Salewa Metro System
project is a collection of urban and sporty, convertible and multifunctional outerwear
composed of three layers of fabric that can be coupled according to the conditions of
the external environment. The technical analysis of the layering system, that is the
technical garments with which mountaineers are equipped, has generated the
guidelines for the development of a collection that starts from pure technical
performance, smoothing out the most extreme accents (useful only in situations of
extreme meteorological hostility) to then propose itself to an urban and low mountain
market. The use of smart materials and nano textile technologies has made it possible
to create a layered system of garments with different functions that can always
guarantee the best conditions in which to make the human body work. Used correctly,
a good sequence of layers provides protection from environmental atmospheric
agents and pollutants, perfect skin transpiration as well as the conservation and
dissipation of body heat. The project was carried out in collaboration with the Salewa
sportswear company, and the garments are designed to remain intact as long as
possible, prepared for care, repairs and replacement of parts. They remain
aesthetically attractive in the long term thanks to the classic stylistic choices that can
be modified according to the occasion. They are always upgradeable in performance:
the individual textile components are always replaceable. They tolerate aging well,
have a long-life cycle and hit the market objectives together with increasingly design
inputs for a more sustainable fashion process
RF-MEMS Wafer-Level Packaging Using Through-Wafer Via Technology
No full textIn this paper, we present wafer-level packaging (WLP) solution for RF-MEMS applications based on through-wafer via (TWV) technology in high-resistivity silicon (HRS). A pre-processed HRS capping wafer containing recesses and vertical Cu-plated TWV interconnect is, after alignment, bonded to the RF-MEMS wafer providing environmental protection and easy signal access. Optionally, cavities can be formed simultaneously with TWV in the capping wafer, which allows hybrid co-integration of additional IC dies while maintaining overall thickness of the resulting SMT compatible package. This cavity can also be used for a first-level wafer-to-wafer alignment accuracy check. After bonding, the s-parameter measurement at giga hertz level shows little influence introduced by the capping substrate
Procedura di controllo e archivio dei nuovi edifici in cemento armato: prime applicazioni
No full textStudio di una metodologia per il controllo dei progetti e la formazione di un archivio dei nuovi edifici in cemento armato
No full text
Going Beyond Counting First Authors in Author Co-citation Analysis
Full text linkThe present study examines one of the fundamental aspects of author co-citation analysis (ACA) - the way co-citation
counts are defined. Co-citation counting provides the data on which all subsequent statistical analyses and mappings
are based, and we compare ACA results based on two different types of co-citation counting - the traditional type that
only counts the first one among a cited work's authors on the one hand and a non-traditional type that takes into
account the first 5 authors of a cited work on the other hand. Results indicate that the picture produced through this non-traditional author co-citation counting contains more coherent author groups and is therefore considerably clearer. However, this picture represents fewer specialties in the research field being studied than that produced through the traditional first-author co-citation counting when the same number of top-ranked authors is selected and analyzed. Reasons for these effects are discussed
- …
