1,721,019 research outputs found

    Intégration en technologie CMOS d'un modulateur plasmonique à effet de champ CMOS Integration of a field effect plasmonic modulator

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    Compact and low energy consumption integrated optical modulator is urgently required for encoding information into optical signals. To that respect, the use of plasmon modes to modulate light is of particular interest when compared to the numerous references describing silicon based optical modulators. Indeed, the high field confinement properties of those modes and the increased sensitivity to small refractive index changes of the dielectric close to the metal can help decrease the characteristic length scales of the devices, towards to that of microelectronics.This thesis investigates the realization of Si field-effect plasmonic modulator integrated with a silicon-on insulator waveguide (SOI-WG) using the standard CMOS technology. The material aspects and also the technological steps required in order to realize an integrated plasmonic modulator compatible with requirements of CMOS technology were investigated. First, we demonstrate a Metal-Nitride-Oxide-Semiconductor (MNOS) stack for applications in electro-optical plasmonic devices, so that a very low optical losses and reliable operation is achieved. This objective is met thanks to a careful choice of materials: (i) copper as a metal for supporting the plasmonic mode and (ii) stoechiometric silicon nitride as an ultrathin low optical loss diffusion barrier to the copper. Final electrical reliability is above 95% for a 3 nm thick Si3N4 layer, leakage current density below 10-8 A.cm-2 and optical losses as low as 0.4 dB.μm-1 for a 13 nm thick insulator barrier, in agreement with the losses of the fundamental plasmonic mode estimated by 3D FDTD calculations, using the optical constant of Cu measured from ellipsometry. After demonstrating the MNOS as an appropriate structure for electro-optical CMOS plasmonics, we fabricate a vertical Metal-Insulator-Si-Metal (MISM) waveguide integrated with an SOI-WG, where the back metal was fabricated by flipping and molecular bonding of the original SOI wafer on a Si carrier wafer. The active device area varies from 0.5 to 3 μm2, 0.5 μm width and length varying from 1 to 6 μm.An efficient and simple way to couple light from Si-WG to vertical MISM PWG was experimentally realized by inserting a Metal-Insulator-Si-Insulator (MISI) coupling section between the two waveguides. We demonstrate that such couplers operates at 1.55 μm with the highest efficiency geometry corresponds to a compact length of 0.5 μm with coupling loss of just 2.5 dB (50 %) per facets. This value is 3 times smaller compared to the case of direct coupling (without any MISI section). High-k dielectrics are demonstrated as promising solution to reduce both the MISM absorption loss and the operation voltage. Given that interest, we experimental demonstrate an electrical reliable high-k stack for future applications to the MOS plasmonic modulators.A few μm long plasmonic modulator is experimentally investigated. Devices show leakage current below 10 fA through the copper electrodes based MOS capacitance. The accumulation capacitance (few fF) was found to scale with the surface of the device, in consistent with the expected equivalent oxide thickness of the MOS stack of our modulator. A low electro-absorption (EA) modulation showing capacitive behaviour was experimentally demonstrated in agreement with simulations. Finally, low energy consumption devices 6 fJ per bit was demonstrated.Dans la réalisation de circuits intégrés hybrides électroniques - photoniques pour les réseaux télécom, les modulateurs intégrés plasmoniques pourront jouer un role essentiel de codage de l'information en signaux optiques. Cette thése montre la réalisation d'une approche modulateur plasmonique a effet de champ, intégrée en silicium en utilisant les technologies CMOS standards. Ce modulateur MOS plasmonique présente diverses propriétés intéressantes, a savoir un confinement optique fort, permettant une augmentation de l'interaction lumiére matiére. Ces modulateurs plasmoniques permettent aussi de réduire l'inadéquation entre la taille des dispositifs en photonique Si et celle de l' électronique, ce qui permet d'envisager une convergence de leur fabrication en technologie VLSI sur une meme puce. Le modulateur étudié dans ce mémoire repose sur l'accumulation de porteurs dans un condensateur MOS a grille cuivre integer dans un guide d'onde en silicium, nécessitant aux technologies front end et back end Cu d etre combinés de quelques nanométres l'une de l'autre. Nous présentons aussi de nouveaux designs pour injecter de la lumiére a partir de guide d'onde SOI dans un guide a nanostructure plasmonique et les mesures d'une modulation électro-optique dans les structures MOS plasmonique

    Intégration en technologie CMOS d'un modulateur plasmonique à effet de champ CMOS Integration of a field effect plasmonic modulator

    No full text
    Compact and low energy consumption integrated optical modulator is urgently required for encoding information into optical signals. To that respect, the use of plasmon modes to modulate light is of particular interest when compared to the numerous references describing silicon based optical modulators. Indeed, the high field confinement properties of those modes and the increased sensitivity to small refractive index changes of the dielectric close to the metal can help decrease the characteristic length scales of the devices, towards to that of microelectronics.This thesis investigates the realization of Si field-effect plasmonic modulator integrated with a silicon-on insulator waveguide (SOI-WG) using the standard CMOS technology. The material aspects and also the technological steps required in order to realize an integrated plasmonic modulator compatible with requirements of CMOS technology were investigated. First, we demonstrate a Metal-Nitride-Oxide-Semiconductor (MNOS) stack for applications in electro-optical plasmonic devices, so that a very low optical losses and reliable operation is achieved. This objective is met thanks to a careful choice of materials: (i) copper as a metal for supporting the plasmonic mode and (ii) stoechiometric silicon nitride as an ultrathin low optical loss diffusion barrier to the copper. Final electrical reliability is above 95% for a 3 nm thick Si3N4 layer, leakage current density below 10-8 A.cm-2 and optical losses as low as 0.4 dB.μm-1 for a 13 nm thick insulator barrier, in agreement with the losses of the fundamental plasmonic mode estimated by 3D FDTD calculations, using the optical constant of Cu measured from ellipsometry. After demonstrating the MNOS as an appropriate structure for electro-optical CMOS plasmonics, we fabricate a vertical Metal-Insulator-Si-Metal (MISM) waveguide integrated with an SOI-WG, where the back metal was fabricated by flipping and molecular bonding of the original SOI wafer on a Si carrier wafer. The active device area varies from 0.5 to 3 μm2, 0.5 μm width and length varying from 1 to 6 μm.An efficient and simple way to couple light from Si-WG to vertical MISM PWG was experimentally realized by inserting a Metal-Insulator-Si-Insulator (MISI) coupling section between the two waveguides. We demonstrate that such couplers operates at 1.55 μm with the highest efficiency geometry corresponds to a compact length of 0.5 μm with coupling loss of just 2.5 dB (50 %) per facets. This value is 3 times smaller compared to the case of direct coupling (without any MISI section). High-k dielectrics are demonstrated as promising solution to reduce both the MISM absorption loss and the operation voltage. Given that interest, we experimental demonstrate an electrical reliable high-k stack for future applications to the MOS plasmonic modulators.A few μm long plasmonic modulator is experimentally investigated. Devices show leakage current below 10 fA through the copper electrodes based MOS capacitance. The accumulation capacitance (few fF) was found to scale with the surface of the device, in consistent with the expected equivalent oxide thickness of the MOS stack of our modulator. A low electro-absorption (EA) modulation showing capacitive behaviour was experimentally demonstrated in agreement with simulations. Finally, low energy consumption devices 6 fJ per bit was demonstrated.Dans la réalisation de circuits intégrés hybrides électroniques - photoniques pour les réseaux télécom, les modulateurs intégrés plasmoniques pourront jouer un role essentiel de codage de l'information en signaux optiques. Cette thése montre la réalisation d'une approche modulateur plasmonique a effet de champ, intégrée en silicium en utilisant les technologies CMOS standards. Ce modulateur MOS plasmonique présente diverses propriétés intéressantes, a savoir un confinement optique fort, permettant une augmentation de l'interaction lumiére matiére. Ces modulateurs plasmoniques permettent aussi de réduire l'inadéquation entre la taille des dispositifs en photonique Si et celle de l' électronique, ce qui permet d'envisager une convergence de leur fabrication en technologie VLSI sur une meme puce. Le modulateur étudié dans ce mémoire repose sur l'accumulation de porteurs dans un condensateur MOS a grille cuivre integer dans un guide d'onde en silicium, nécessitant aux technologies front end et back end Cu d etre combinés de quelques nanométres l'une de l'autre. Nous présentons aussi de nouveaux designs pour injecter de la lumiére a partir de guide d'onde SOI dans un guide a nanostructure plasmonique et les mesures d'une modulation électro-optique dans les structures MOS plasmonique

    CMOS Integration of field effect plasmonic modulators

    No full text
    Dans la réalisation de circuits intégrés hybrides électroniques - photoniques pour les réseaux télécom, les modulateurs intégrés plasmoniques pourront jouer un role essentiel de codage de l'information en signaux optiques. Cette thése montre la réalisation d'une approche modulateur plasmonique a effet de champ, intégrée en silicium en utilisant les technologies CMOS standards. Ce modulateur MOS plasmonique présente diverses propriétés intéressantes, a savoir un confinement optique fort, permettant une augmentation de l'interaction lumiére matiére. Ces modulateurs plasmoniques permettent aussi de réduire l'inadéquation entre la taille des dispositifs en photonique Si et celle de l' électronique, ce qui permet d'envisager une convergence de leur fabrication en technologie VLSI sur une meme puce. Le modulateur étudié dans ce mémoire repose sur l'accumulation de porteurs dans un condensateur MOS a grille cuivre integer dans un guide d'onde en silicium, nécessitant aux technologies front end et back end Cu d etre combinés de quelques nanométres l'une de l'autre. Nous présentons aussi de nouveaux designs pour injecter de la lumiére a partir de guide d'onde SOI dans un guide a nanostructure plasmonique et les mesures d'une modulation électro-optique dans les structures MOS plasmoniquesCompact and low energy consumption integrated optical modulator is urgently required for encoding information into optical signals. To that respect, the use of plasmon modes to modulate light is of particular interest when compared to the numerous references describing silicon based optical modulators. Indeed, the high field confinement properties of those modes and the increased sensitivity to small refractive index changes of the dielectric close to the metal can help decrease the characteristic length scales of the devices, towards to that of microelectronics.This thesis investigates the realization of Si field-effect plasmonic modulator integrated with a silicon-on insulator waveguide (SOI-WG) using the standard CMOS technology. The material aspects and also the technological steps required in order to realize an integrated plasmonic modulator compatible with requirements of CMOS technology were investigated. First, we demonstrate a Metal-Nitride-Oxide-Semiconductor (MNOS) stack for applications in electro-optical plasmonic devices, so that a very low optical losses and reliable operation is achieved. This objective is met thanks to a careful choice of materials: (i) copper as a metal for supporting the plasmonic mode and (ii) stoechiometric silicon nitride as an ultrathin low optical loss diffusion barrier to the copper. Final electrical reliability is above 95% for a 3 nm thick Si3N4 layer, leakage current density below 10-8 A.cm-2 and optical losses as low as 0.4 dB.μm-1 for a 13 nm thick insulator barrier, in agreement with the losses of the fundamental plasmonic mode estimated by 3D FDTD calculations, using the optical constant of Cu measured from ellipsometry. After demonstrating the MNOS as an appropriate structure for electro-optical CMOS plasmonics, we fabricate a vertical Metal-Insulator-Si-Metal (MISM) waveguide integrated with an SOI-WG, where the back metal was fabricated by flipping and molecular bonding of the original SOI wafer on a Si carrier wafer. The active device area varies from 0.5 to 3 μm2, 0.5 μm width and length varying from 1 to 6 μm.An efficient and simple way to couple light from Si-WG to vertical MISM PWG was experimentally realized by inserting a Metal-Insulator-Si-Insulator (MISI) coupling section between the two waveguides. We demonstrate that such couplers operates at 1.55 μm with the highest efficiency geometry corresponds to a compact length of 0.5 μm with coupling loss of just 2.5 dB (50 %) per facets. This value is 3 times smaller compared to the case of direct coupling (without any MISI section). High-k dielectrics are demonstrated as promising solution to reduce both the MISM absorption loss and the operation voltage. Given that interest, we experimental demonstrate an electrical reliable high-k stack for future applications to the MOS plasmonic modulators.A few μm long plasmonic modulator is experimentally investigated. Devices show leakage current below 10 fA through the copper electrodes based MOS capacitance. The accumulation capacitance (few fF) was found to scale with the surface of the device, in consistent with the expected equivalent oxide thickness of the MOS stack of our modulator. A low electro-absorption (EA) modulation showing capacitive behaviour was experimentally demonstrated in agreement with simulations. Finally, low energy consumption devices 6 fJ per bit was demonstrated

    Going Beyond Counting First Authors in Author Co-citation Analysis

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    The present study examines one of the fundamental aspects of author co-citation analysis (ACA) - the way co-citation counts are defined. Co-citation counting provides the data on which all subsequent statistical analyses and mappings are based, and we compare ACA results based on two different types of co-citation counting - the traditional type that only counts the first one among a cited work's authors on the one hand and a non-traditional type that takes into account the first 5 authors of a cited work on the other hand. Results indicate that the picture produced through this non-traditional author co-citation counting contains more coherent author groups and is therefore considerably clearer. However, this picture represents fewer specialties in the research field being studied than that produced through the traditional first-author co-citation counting when the same number of top-ranked authors is selected and analyzed. Reasons for these effects are discussed

    Variations on the Author

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    “Variations on the Author” discusses two of Eduardo Coutinho’s recent films (Um Dia na Vida, from 2010, and Últimas Conversas, posthumously released in 2015) and their contribution to the general question of documentary authorship. The director’s filmography is characterized by a consistent yet self-effacing form of authorial self-inscription: Coutinho often features as an interviewer that rather than express opinions propels discourses; an interviewer that is good at listening. This mode of self-inscription characterizes him as an author who is not expressive but who is nonetheless markedly present on the screen. In Um Dia na Vida, however, Coutinho is completely absent form the image, while Últimas Conversas, on the contrary, includes a confessional prologue that moves the director from the margins to the center of his films. This article examines the ways in which these works stand out in the filmography of a director who offers new insights into the notion of cinematic authorship

    Appropriate Similarity Measures for Author Cocitation Analysis

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    We provide a number of new insights into the methodological discussion about author cocitation analysis. We first argue that the use of the Pearson correlation for measuring the similarity between authors’ cocitation profiles is not very satisfactory. We then discuss what kind of similarity measures may be used as an alternative to the Pearson correlation. We consider three similarity measures in particular. One is the well-known cosine. The other two similarity measures have not been used before in the bibliometric literature. Finally, we show by means of an example that our findings have a high practical relevance.information science;Pearson correlation;cosine;similarity measure;author cocitation analysis

    Dispelling the Myths Behind First-author Citation Counts

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    We conducted a full-scale evaluative citation analysis study of scholars in the XML research field to explore just how different from each other author rankings resulting from different citation counting methods actually are, and to demonstrate the capability of emerging data and tools on the Web in supporting more realistic citation counting methods. Our results contest some common arguments for the continued use of first-author citation counts in the evaluation of scholars, such as high correlations between author rankings by first-author citation counts and other citation counting methods, and high costs of using more realistic citation counting methods that are not well-supported by the ISI databases. It is argued that increasingly available digital full text research papers make it possible for citation analysis studies to go beyond what the ISI databases have directly supported and to employ more sophisticated methods

    Author Index

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