25 research outputs found
Auto-assemblage assisté par capillarité et collage direct
No full textAmong the various techniques allowing to assemble both mechanically and electrically stacked chips, the direct bonding of Cu-SiO2 mixed surfaces is the most promising option to date. Thanks to this method, the interconnection density of 106/cm² aimed by the industry is achievable, while providing a low contact resistivity and excellent reliability.Current assemblies’ processes are based on Pick&place tools thanks to which the dies are mechanically placed.Nevertheless, these tools have difficulties to council high throughput and high alignment accuracy. This thesis proposes to address this issue through the development of a process of self-assembly assisted by capillary forces and direct bonding.Through the use of capillaries forces, it is possible to achieve spontaneously chips alignment: it is called self-assembly. The first part of this manuscript presents a synthetic analysis of the different assemblies and interconnections technics and decides on the maturity of each process.As the same time, this section allows to introduce the SiO2 -SiO2 bonding mechanisms underlying the assembly method developed in this manuscript.A specific chip design is then established in a second part allowing deploying self-assemblies with SiO2 full sheet chips.The ability of the chip to confine the liquid film appears as the driving element of the self- alignment process. Self- assemblies with alignment values lower than one micrometer are obtained while maintaining a repeatable process. The introduction of numerical simulations to model the self-alignment effect is presented in the third part. This model was then generalized has polygonal shaped chips. Finally the last part presents the transfer of the self- assembly process on SiO2-Cu patterned chips.The use of this kind of chip has enabled to validate the electrical viability of the self-assembly process.Parmi les différentes techniques permettant d'assembler à la fois mécaniquement et électriquement les puces empilées, le collage direct de surfaces mixtes Cu-SiO2 représente l'option la plus prometteuse à ce jour. En effet, cette méthode permet d'atteindre la densité d'interconnexions de 10^6/cm² visée par l'industrie, tout en offrant une faible résistivité de contact et une excellente fiabilité. Les méthodes d’assemblages actuelles reposent sur l’utilisation d’outils de Pick&place par l’intermédiaire desquels les puces sont positionnées mécaniquement. Cette technique rencontre néanmoins de plus en plus de difficultés à concilier précision d’alignement et cadence d’assemblage. Cette thèse propose d’adresser cette problématique au travers de la mise au point d’un procédé d’auto-assemblage assisté par capillarité et collage direct. Grâce à l’utilisation des forces de capillarités, il est possible de réaliser l’alignement des puces de façon spontanée : on parle alors d’auto-assemblage. La première partie de ce manuscrit présente une analyse synthétique des méthodes d’assemblages et d’interconnexions existantes et statue sur l’état de maturité de chaque procédé. Cette partie permet par la même occasion d’introduire les mécanismes de collages SiO2-SiO2 sur lesquels repose la méthode d’assemblage développée dans ce manuscrit. Un design de puce permettant la mise en œuvre du procédé d’auto-assemblage est ensuite établit dans la seconde partie. La capacité de la puce à confiner le film de liquide apparait comme l’élément moteur du processus d’auto-alignement. Des auto-assemblages présentant des valeurs d’alignement inférieur au micromètre sont ainsi obtenus, tout en conservant un procédé répétable. La mise en place de simulations numériques permettant de modéliser l’effet d’auto-alignement est présenté dans la troisième partie. Ce modèle a ensuite été généralisé a des puces de formes polygonales. Enfin la dernière partie présente le transfert du procédé d’auto-assemblage a des puces présentant des surfaces de cuivre et d’oxyde de silicium. L’utilisation de ce type de puce a notamment permis de valider la viabilité électrique du processus d’auto-assemblage
Self-assembly assisted by capillarity and direct bonding
No full textParmi les différentes techniques permettant d'assembler à la fois mécaniquement et électriquement les puces empilées, le collage direct de surfaces mixtes Cu-SiO2 représente l'option la plus prometteuse à ce jour. En effet, cette méthode permet d'atteindre la densité d'interconnexions de 10^6/cm² visée par l'industrie, tout en offrant une faible résistivité de contact et une excellente fiabilité. Les méthodes d’assemblages actuelles reposent sur l’utilisation d’outils de Pick&place par l’intermédiaire desquels les puces sont positionnées mécaniquement. Cette technique rencontre néanmoins de plus en plus de difficultés à concilier précision d’alignement et cadence d’assemblage. Cette thèse propose d’adresser cette problématique au travers de la mise au point d’un procédé d’auto-assemblage assisté par capillarité et collage direct. Grâce à l’utilisation des forces de capillarités, il est possible de réaliser l’alignement des puces de façon spontanée : on parle alors d’auto-assemblage. La première partie de ce manuscrit présente une analyse synthétique des méthodes d’assemblages et d’interconnexions existantes et statue sur l’état de maturité de chaque procédé. Cette partie permet par la même occasion d’introduire les mécanismes de collages SiO2-SiO2 sur lesquels repose la méthode d’assemblage développée dans ce manuscrit. Un design de puce permettant la mise en œuvre du procédé d’auto-assemblage est ensuite établit dans la seconde partie. La capacité de la puce à confiner le film de liquide apparait comme l’élément moteur du processus d’auto-alignement. Des auto-assemblages présentant des valeurs d’alignement inférieur au micromètre sont ainsi obtenus, tout en conservant un procédé répétable. La mise en place de simulations numériques permettant de modéliser l’effet d’auto-alignement est présenté dans la troisième partie. Ce modèle a ensuite été généralisé a des puces de formes polygonales. Enfin la dernière partie présente le transfert du procédé d’auto-assemblage a des puces présentant des surfaces de cuivre et d’oxyde de silicium. L’utilisation de ce type de puce a notamment permis de valider la viabilité électrique du processus d’auto-assemblage.Among the various techniques allowing to assemble both mechanically and electrically stacked chips, the direct bonding of Cu-SiO2 mixed surfaces is the most promising option to date. Thanks to this method, the interconnection density of 106/cm² aimed by the industry is achievable, while providing a low contact resistivity and excellent reliability.Current assemblies’ processes are based on Pick&place tools thanks to which the dies are mechanically placed.Nevertheless, these tools have difficulties to council high throughput and high alignment accuracy. This thesis proposes to address this issue through the development of a process of self-assembly assisted by capillary forces and direct bonding.Through the use of capillaries forces, it is possible to achieve spontaneously chips alignment: it is called self-assembly. The first part of this manuscript presents a synthetic analysis of the different assemblies and interconnections technics and decides on the maturity of each process.As the same time, this section allows to introduce the SiO2 -SiO2 bonding mechanisms underlying the assembly method developed in this manuscript.A specific chip design is then established in a second part allowing deploying self-assemblies with SiO2 full sheet chips.The ability of the chip to confine the liquid film appears as the driving element of the self- alignment process. Self- assemblies with alignment values lower than one micrometer are obtained while maintaining a repeatable process. The introduction of numerical simulations to model the self-alignment effect is presented in the third part. This model was then generalized has polygonal shaped chips. Finally the last part presents the transfer of the self- assembly process on SiO2-Cu patterned chips.The use of this kind of chip has enabled to validate the electrical viability of the self-assembly process
Repositioning the graphic designer as researcher
No full textIn academic terms, the discipline of graphic design is relatively young. Consequently the position of the discipline within academic territory, and the role of the designer, continue to be debated. In part, these debates have been a product of attempts to define and defend the discipline’s borders from within, in order to establish a sense of the role of graphic design and the graphic designer as commensurate with other disciplines both within and beyond art and design. In recent years graphic designers have variously been defined as ‘authors’, ‘producers’ and ‘readers’, yet none of these definitions seem to have provided any kind of productive or lasting impact within the academy. This paper suggests that rather than continue to seek territorial definitions and positions from within, it could be more productive to look beyond the confines of the discipline. Gaining a broader, interdisciplinary perspective on, and understanding of, qualitative research methods from other disciplines may enable the graphic designer to more fully position his or her practice within the wider academy. Such a perspective could help facilitate the repositioning and redefinition of the graphic designer as ‘researcher’ - a move that would be productive in relation to the future development of postgraduate research within the discipline
Authorship, Entrepreneurialism and Experimental design
No full textThis paper responds to recent calls in design literature for a return to design
authorship, and the appropriation from fine art of theories of relational aesthetics
(Poyner 2005, Mermoz 2006). I suggest that before looking to art as a model, it is
useful to retrace various divergent moments in the authorship and entrepreneurialism
debates in graphic design. This paper describes how these debates polarise the
designer-as-author as antithetical to the designer-as-service-provider, and as such
omit a third term, experimental design. I discuss an example of experimental design,
Re-magazine by Jop van Bennekom, in terms of how such design challenges the
promises of “total control” or autonomy that is identified by many as a key motivation
in practices of graphic authorship and entrepreneurialism (Heller 1998, 2006, Lupton
2003, Margolin 2003, Tremlow 2006). I interpret issue nine of Re-magazine as an
allegory that questions design’s pursuit of autonomy. Rather than confuse the distinct
specificities of fine art and design practices in an unexamined adoption of relational
aesthetics, as Poyner and Mermoz suggest, I propose that design must first reflect on
its own products and practices
ASO Author Reflections: Preoperative Biliary Drainage Before Pancreatic Surgery
No full textInternational audienc
Realising the geo/graphic landscape of the everyday: a practice led investigation into an interdisciplinary geo/graphic design process
No full textThis research proposes that the ‘geo/graphic’ design process—an original synthesis of cultural geographic and graphic design theory and practice—offers much to geographers and graphic designers in relation to the understanding and representation of place, and the potential of print based graphic design to create interactive, multi-linear spaces of exploration for the reader.
The understanding and representation of place is a central issue within cultural geography, with place itself a complex notion defined in contemporary geographic terms as ongoing and relational. This problematises both understanding and representation, as places, in a sense, are never ‘fixed’. Addressing this, and the contention that much of place evades representation, many geographers have begun to use methods that site the researcher, and their understanding, in more embodied, experiential ways within place, and are drawing on ‘creative’ methods such as film-making or sound recording. Yet, the predominant representation of place within geography remains the academic text, with few attempts to explore the communicative possibilities of type and image in this context. So, the pages of academic journals remain conventional, though research methods develop in multi-sensory ways. This research bridges the apparent divide between methods of exploring and representing place, and in doing so positions the graphic designer as researcher and develops a process that engages with the understanding and representation of place in a holistic way. Foregrounding graphic design practice, it highlights design interventions that re-situate the page as an experiential place.
A qualitative, naturalistic and reflective methodological approach is taken, drawing on social science methods and design practice. Ethnographic methods inspire a series of print based design test projects, each conveying a particular version of the London borough of Hackney—the testing ground for the research. Analysis of the design test projects, establishes key elements of the research and practice, thus articulating the specifics of the ‘geo/graphic’ design process
OCD -Machine learning based metrology for copper pad surface for hybrid bonding integration
No full textInternational audienceIn the context of 3D hybrid bonding architectures, ensuring the flatness of metallic pads before bonding is critical. The control of this flatness is important and the dimension to be measured is very small (~nm) compared to the dimensions of the pattern (~µm). Traditional control methods, such as Atomic Force Microscopy (AFM), offer high precision but lack the throughput required for high-volume manufacturing. Spectroscopic reflectometry (SR) presents an attractive metrological method due to its speed and larger measurement coverage. This study investigates the sensitivity of SR to dishing of copper pad across wafers with different thicknesses. We evaluate the ability of using a Deep Neural Network (DNN) model trained on raw spectra to predict copper dishing, using AFM as the reference measurement. Additionally, we assess whether the model can generalize to new batches of wafers and capture process variations. Our results, initially based on five wafers, are extended to fifteen wafers in total, allowing us to examine the capabilities of the model to predict the dishing of copper pads across varying experimental conditions
