1,720,952 research outputs found
Fast Etching of Molding Compound by an Ar/O2/CF4 Plasma and Process Improvements for Semiconductor Package Decapsulation
No full textDecapsulation of a SOT23 semiconductor package with 23 um copper wire bonds is conducted with an especially designed microwave induced plasma system. It is found that a 30%-60% CF4 addition in the O2/CF4 etchant gas results in high molding compound etching rate. Si3N4 overetching which is encountered in plasma decapsulation is solved by an improved etching process. Critical processing parameters are investigated and 350 um thick molding compound on top of the die is removed selectively by pure plasma etching for 6 minutes, which is at least 10 times faster than conventional plasma etchers.MicroelectronicsElectrical Engineering, Mathematics and Computer Scienc
Going Beyond Counting First Authors in Author Co-citation Analysis
Get PDFThe present study examines one of the fundamental aspects of author co-citation analysis (ACA) - the way co-citation
counts are defined. Co-citation counting provides the data on which all subsequent statistical analyses and mappings
are based, and we compare ACA results based on two different types of co-citation counting - the traditional type that
only counts the first one among a cited work's authors on the one hand and a non-traditional type that takes into
account the first 5 authors of a cited work on the other hand. Results indicate that the picture produced through this non-traditional author co-citation counting contains more coherent author groups and is therefore considerably clearer. However, this picture represents fewer specialties in the research field being studied than that produced through the traditional first-author co-citation counting when the same number of top-ranked authors is selected and analyzed. Reasons for these effects are discussed
A temperature oscillation instrument to determine pyroelectric properties of materials at low frequencies: Towards elimination of lock-in methods
No full textPyroelectric properties of materials can be accurately determined by applying a new digital signal processing method on the discrete sampled data obtained with a temperature oscillation technique. The pyroelectric coefficient is calculated from the component of the generated current 90? out of phase with respect to the sinusoidal temperature wave. The novelty of the proposed approach lies in the signal analysis procedure which implements a simple Fast Fourier transform that filters residual noise through convolution, and calculates the phase difference between the peaks of the temperature and current waves. The new idea requires relatively simple hardware and enables very accurate measurement of the pyroelectric coefficient of materials at ultra low frequencies, 1–250 mHz, without using costly lock-in amplifiers.Aerospace Structures & MaterialsAerospace Engineerin
Variations on the Author
Get PDF“Variations on the Author” discusses two of Eduardo Coutinho’s recent films (Um Dia na Vida, from 2010, and Últimas Conversas, posthumously released in 2015) and their contribution to the general question of documentary authorship. The director’s filmography is characterized by a consistent yet self-effacing form of authorial self-inscription: Coutinho often features as an interviewer that rather than express opinions propels discourses; an interviewer that is good at listening. This mode of self-inscription characterizes him as an author who is not expressive but who is nonetheless markedly present on the screen. In Um Dia na Vida, however, Coutinho is completely absent form the image, while Últimas Conversas, on the contrary, includes a confessional prologue that moves the director from the margins to the center of his films. This article examines the ways in which these works stand out in the filmography of a director who offers new insights into the notion of cinematic authorship
Appropriate Similarity Measures for Author Cocitation Analysis
Get PDFWe provide a number of new insights into the methodological discussion about author cocitation analysis. We first argue that the use of the Pearson correlation for measuring the similarity between authors’ cocitation profiles is not very satisfactory. We then discuss what kind of similarity measures may be used as an alternative to the Pearson correlation. We consider three similarity measures in particular. One is the well-known cosine. The other two similarity measures have not been used before in the bibliometric literature. Finally, we show by means of an example that our findings have a high practical relevance.information science;Pearson correlation;cosine;similarity measure;author cocitation analysis
Analysis and experimental validation of the figure of merit for piezoelectric energy harvesters
No full textPiezoelectric energy harvesters are at the front of scientific research as enablers of renewable, sustainable energy for autonomous wireless sensor networks. Crucial for this disruptive technology is the achievable output power. Here we show, analytically, that the maximum output energy per unit volume, under a single sinusoidal excitation, is equal to 1/(4 - 2k2) × 1/2dgX2, where k2 is the electromechanical coupling coefficient, d and g are the piezoelectric charge and voltage coefficient, respectively, and X is the applied stress. The expression derived is validated by the experimentally measured output energy for a variety of piezoelectric materials over an unprecedented range of more than five orders of magnitude. As the prefactor 1/(4 - 2k2) varies only between 1/2 and 1/4 the figure of merit for piezoelectric materials for energy harvesters is not k2, as commonly accepted for vibrational harvesters, but dg. The figure of merit does not depend on the compliance, or Young's modulus. Hence we argue that commonly used brittle inorganic piezoelectric ceramics can be replaced by soft, mechanically flexible polymers and composite films, comprising inorganic piezoelectric materials embedded in a polymer matrix.Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.Novel Aerospace MaterialsStructural Integrity & CompositesEMSD EEMCS Project engineer
Dispelling the Myths Behind First-author Citation Counts
Get PDFWe conducted a full-scale evaluative citation analysis study of scholars in the XML research field to explore just how different from each other author rankings resulting from different citation counting methods actually are, and to demonstrate the capability of emerging data and tools on the Web in supporting more realistic citation counting methods. Our results contest some common arguments for the continued
use of first-author citation counts in the evaluation of scholars, such as high correlations between author rankings by first-author citation counts and other citation
counting methods, and high costs of using more realistic citation counting methods that are not well-supported by the ISI databases. It is argued that increasingly available digital full text research papers make it possible for citation analysis studies to go beyond what the ISI databases have directly supported and to employ more
sophisticated methods
Plasma Etching for Failure Analysis of Integrated Circuit Packages
Get PDFPlastic integrated circuit packages with copper wire bonds are decapsulated by a Microwave Induced Plasma system. Improvements on microwave coupling of the system are achieved by frequency tuning and antenna modification. Plasmas with a mixture of O2 and CF4 showed a high etching rate around 2 mm3/min. The role of O2 and CF4 in etching molding compound is described. Plastic package with 38 um Cu bond wires and a 2 mm * 3.5 mm die inside is fully decapsulated in 20 minutes. Cu wires remain undamaged after decapsulation proving the efficiency of this method.MicroelectronicsElectrical Engineering, Mathematics and Computer Scienc
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