1,721,216 research outputs found
Projekt Standortspiele
Full text linkAlbers W, Ostmann A, Richter WF, Rosenmüller J. Projekt Standortspiele. Working Papers. Institute of Mathematical Economics. Vol 74. Bielefeld: Center for Mathematical Economics; 1978
Projekt Standortspiele. 2. Bericht
Full text linkAlbers W, Huttel G, Ostmann A, et al. Projekt Standortspiele. 2. Bericht. Working Papers. Institute of Mathematical Economics. Vol 107. Bielefeld: Center for Mathematical Economics; 1981
Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs
No full textThis work was supported by Center for Electronic
Packaging Materials of Korea Science and Engineering
Foundation
Effects of Cu contents in Pb-free solder alloys on interfacial reactions and bump reliability of Pb-free solder bumps on electroless Ni-P under-bump metallurgy
No full textUsing the screen-printed solder-bumping technique on the electroless plated Ni-P under-bump metallurgy (UBM) is potentially a good method because of cost effectiveness. As SnAgCu Pb-free solders become popular, demands for understanding of interfacial reactions between electroless Ni-P UBMs and Cu-containing Pb-free solder bumps are increasing. It was found that typical Ni-Sn reactions between the electroless Ni-P UBM and Sn-based solders were substantially changed by adding small amounts of Cu in Sn-based Pb-free solder alloys. In Cu-containing solder bumps, the (Cu,Ni)(6)Sn(5) phase formed during initial reflow, followed by (Ni,Cu)(3)Sn(4) phase formation during further reflow and aging. The Sn3.5Ag solder bumps showed a much faster electroless Ni-P UBM consumption rate than Cu-containing solder bumps: Sn4.0Ag0.5Cu and Sn0.7Cu. The initial formation of the (Cu,Ni)(6)Sn(5) phase in SnAgCu and SnCu solders significantly reduced the consumption of the Ni-P UBM. The more Cu-containing solder showed slower consumption rate of the Ni-P UBM than the less Cu-containing solder below 300degreesC heat treatments. The growth rate of the (Cu,Ni)(6)Sn(5) intermetallic compound (IMC) should be determined by substitution of Ni atoms into the Cu sublattice in the solid (Cu,Ni)(6)Sn(5) IMC. The Cu contents in solder alloys only affected the total amount of the (Cu,Ni)(6)Sn(5) IMC. More Cu-containing solders were recommended to reduce consumption of the Ni-based UBM. In addition, bump shear strength and failure analysis were performed using bump shear test.This work was supported by the Center for
Electronic Packaging Materials, Korea Science and
Engineering Foundation
Going Beyond Counting First Authors in Author Co-citation Analysis
Full text linkThe present study examines one of the fundamental aspects of author co-citation analysis (ACA) - the way co-citation
counts are defined. Co-citation counting provides the data on which all subsequent statistical analyses and mappings
are based, and we compare ACA results based on two different types of co-citation counting - the traditional type that
only counts the first one among a cited work's authors on the one hand and a non-traditional type that takes into
account the first 5 authors of a cited work on the other hand. Results indicate that the picture produced through this non-traditional author co-citation counting contains more coherent author groups and is therefore considerably clearer. However, this picture represents fewer specialties in the research field being studied than that produced through the traditional first-author co-citation counting when the same number of top-ranked authors is selected and analyzed. Reasons for these effects are discussed
Variations on the Author
Full text link“Variations on the Author” discusses two of Eduardo Coutinho’s recent films (Um Dia na Vida, from 2010, and Últimas Conversas, posthumously released in 2015) and their contribution to the general question of documentary authorship. The director’s filmography is characterized by a consistent yet self-effacing form of authorial self-inscription: Coutinho often features as an interviewer that rather than express opinions propels discourses; an interviewer that is good at listening. This mode of self-inscription characterizes him as an author who is not expressive but who is nonetheless markedly present on the screen. In Um Dia na Vida, however, Coutinho is completely absent form the image, while Últimas Conversas, on the contrary, includes a confessional prologue that moves the director from the margins to the center of his films. This article examines the ways in which these works stand out in the filmography of a director who offers new insights into the notion of cinematic authorship
Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy
No full text"This work was supported by Center for Electronic
Packaging Materials of Korea Science and Engineering
Foundation.
Appropriate Similarity Measures for Author Cocitation Analysis
Full text linkWe provide a number of new insights into the methodological discussion about author cocitation analysis. We first argue that the use of the Pearson correlation for measuring the similarity between authors’ cocitation profiles is not very satisfactory. We then discuss what kind of similarity measures may be used as an alternative to the Pearson correlation. We consider three similarity measures in particular. One is the well-known cosine. The other two similarity measures have not been used before in the bibliometric literature. Finally, we show by means of an example that our findings have a high practical relevance.information science;Pearson correlation;cosine;similarity measure;author cocitation analysis
Dispelling the Myths Behind First-author Citation Counts
Full text linkWe conducted a full-scale evaluative citation analysis study of scholars in the XML research field to explore just how different from each other author rankings resulting from different citation counting methods actually are, and to demonstrate the capability of emerging data and tools on the Web in supporting more realistic citation counting methods. Our results contest some common arguments for the continued
use of first-author citation counts in the evaluation of scholars, such as high correlations between author rankings by first-author citation counts and other citation
counting methods, and high costs of using more realistic citation counting methods that are not well-supported by the ISI databases. It is argued that increasingly available digital full text research papers make it possible for citation analysis studies to go beyond what the ISI databases have directly supported and to employ more
sophisticated methods
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