1,720,993 research outputs found
Plasma-enhanced atomic layer deposition of Ru-TiN thin films for copper diffusion barrier metals
No full textRuthenium-titanium nitride (Ru-TiN) thin films were grown by plasma-enhanced atomic layer deposition (PEALD) at a growth temperature of 200 degrees C. For the Ru - TiN PEALD, Ru and TiN were sequentially deposited to intermix TiN with Ru. The composition of Ru - TiN films was controlled by changing the number of deposition cycles allocated to Ru, while the number of deposition cycles for TiN was fixed to one cycle. The microstructures of Ru - TiN films changed from polycrystalline to amorphous, as the intermixing ratio of Ru increased in the deposited Ru - TiN films. The resistivity of the Ru - TiN film was abruptly increased by adding Ru at the first stage, but after showing a peak resistivity, it decreased with the intermixing ratio of Ru in the films. Especially, the film of Ru-0.67 -(TiN)(0.33) showed an electrical resistivity of 190 mu Omega cm. As a Cu diffusion barrier layer, amorphous Ru - TiN films showed a superior copper diffusion barrier property to TiN or Ru itself, which had a polycrystalline structure. Moreover, Ru - TiN films showed a good adhesion to both chemical vapor deposition copper and an underlayer of SiO2. (C) 2006 The Electrochemical Society.This work was supported by the project of System IC 2010.
Korea Advanced Institute of Science and Technology assisted in meeting the publication costs of this article
Going Beyond Counting First Authors in Author Co-citation Analysis
Full text linkThe present study examines one of the fundamental aspects of author co-citation analysis (ACA) - the way co-citation
counts are defined. Co-citation counting provides the data on which all subsequent statistical analyses and mappings
are based, and we compare ACA results based on two different types of co-citation counting - the traditional type that
only counts the first one among a cited work's authors on the one hand and a non-traditional type that takes into
account the first 5 authors of a cited work on the other hand. Results indicate that the picture produced through this non-traditional author co-citation counting contains more coherent author groups and is therefore considerably clearer. However, this picture represents fewer specialties in the research field being studied than that produced through the traditional first-author co-citation counting when the same number of top-ranked authors is selected and analyzed. Reasons for these effects are discussed
Variations on the Author
Full text link“Variations on the Author” discusses two of Eduardo Coutinho’s recent films (Um Dia na Vida, from 2010, and Últimas Conversas, posthumously released in 2015) and their contribution to the general question of documentary authorship. The director’s filmography is characterized by a consistent yet self-effacing form of authorial self-inscription: Coutinho often features as an interviewer that rather than express opinions propels discourses; an interviewer that is good at listening. This mode of self-inscription characterizes him as an author who is not expressive but who is nonetheless markedly present on the screen. In Um Dia na Vida, however, Coutinho is completely absent form the image, while Últimas Conversas, on the contrary, includes a confessional prologue that moves the director from the margins to the center of his films. This article examines the ways in which these works stand out in the filmography of a director who offers new insights into the notion of cinematic authorship
Appropriate Similarity Measures for Author Cocitation Analysis
Full text linkWe provide a number of new insights into the methodological discussion about author cocitation analysis. We first argue that the use of the Pearson correlation for measuring the similarity between authors’ cocitation profiles is not very satisfactory. We then discuss what kind of similarity measures may be used as an alternative to the Pearson correlation. We consider three similarity measures in particular. One is the well-known cosine. The other two similarity measures have not been used before in the bibliometric literature. Finally, we show by means of an example that our findings have a high practical relevance.information science;Pearson correlation;cosine;similarity measure;author cocitation analysis
Dispelling the Myths Behind First-author Citation Counts
Full text linkWe conducted a full-scale evaluative citation analysis study of scholars in the XML research field to explore just how different from each other author rankings resulting from different citation counting methods actually are, and to demonstrate the capability of emerging data and tools on the Web in supporting more realistic citation counting methods. Our results contest some common arguments for the continued
use of first-author citation counts in the evaluation of scholars, such as high correlations between author rankings by first-author citation counts and other citation
counting methods, and high costs of using more realistic citation counting methods that are not well-supported by the ISI databases. It is argued that increasingly available digital full text research papers make it possible for citation analysis studies to go beyond what the ISI databases have directly supported and to employ more
sophisticated methods
koamabayili/VECTRON-author-checklist: VECTRON author checklist
No full textWe have done our best to complete the author checklist relating to the use of animals in the hut study. Note that the objective for the hut study was to evaluate the IRS treatment applications for residual efficacy against Anopheles mosquitoes, including the local An. coluzzii mosquito population. Cows were only used to attract mosquitoes into the huts and no tests were carried out directly on the cows. The author checklist is intended for use with studies where experiments are carried out on animals, which is why we have had such difficulty in completing this for the hut study, as many of the questions do not relate to how the cows were used
Copper chemical vapour deposition using copper(I) hexafluoroacetylacetonate trimethylvinylsilane
No full textThe effects of the deposition temperature on the microstructure and the electrical resistivity of copper films prepared by chemical vapour deposition (CVD) were studied at the deposition temperatures between 160 degrees C and 330 degrees C. Copper films were prepared on titanium nitride (TiN) substrates in a low-pressure warm-wall reactor using copper(I) hexafluoroacetylacetonate trimethylvinylsilane, Cu (hfac) (TMVS), as the precursor. The activation energy for the deposition was found to be 45.4 kJ mol(-1) at the total pressure of 66.7 Pa. The films deposited at below 200 degrees C, where the deposition is limited by surface reaction, were dense and had low resistivity of approximately 2 mu Omega cm. Moreover, they exhibited excellent step coverage. However, the films deposited at above 200 degrees C, where the mass transport processes become important, were composed of poorly connected globular grains, resulting in considerably high resistivities and rough surfaces. Effects of the deposition temperature on the grain size and the preferred orientation of the films were also investigated
Author-wise bibliometric analysis based on entropy.
No full textAuthor-wise bibliometric analysis based on entropy.</p
- …
