1,220 research outputs found
The prints of J.N. Darling
No full textThis is the bibliographic record of the book entitled The Prints of J.N. Darling by Amy N. Worthen that is in the NCTC Conservation Library collection. J.N. "Ding" Darling is an extraordinary example of the artist at work in conservation education. After he guided the funding for the Migratory Bird Hunting Stamp Act through Congress, Ding Darling sketched his concept of a suitable image for the First Federal Duck Stamp. Bibliographic record: Personal Author: Worthen, Amy N. Title: The prints of J.N. Darling / Amy N. Worthen ; Brunnier Gallery and Museum. Edition: 1st Iowa State University Press ed. Publication info: Ames, Iowa : Iowa State University Press, 1991. Physical descrip: 126 p. ; 29 cm. General Note: "First published in 1984 on the occasion of the exhibition The Prints of J.N. Darling, August 29-October 7, 1984"--T.p. verso
Bouwen met de natuur
No full textEerste plan van Svasek voor een kustuitbreiding tussen Hoek van Holland en Scheveningen, gebruikmakend van natuurlijke processsen. In dit document is voor het eerst de term "bouwen met de natuur" (building with nature") gebruikt. " De hier gepresenteerde beschouwingen hebben als doel een bijdrage te leveren aan de thans opgeleefde diskussie over de kustlokaties als onderdeel van de regionale en provinciale ruimtelijke ordening. Gepoogd is om van het begin af aan het natuurgebeuren ten grondslag te leggen aan de planning. De kennis van de kustmorfologie is in Nederland in voldoende mate aanwezig om bij het ontwerpen van kustplannen met de natuur en niet tegen de natuur in te kunnen werken.
Google et la bibliothèque mondiale
No full text@article{AC-LECROSNIER-2005, author = {Le Crosnier, H. and Jeanneney, J.N. and Saal, A.}, title = {Google et la bibliothèque mondiale}, journal = {Vacarme}, year = {2005}, month = {mai}, pages = {50-54} }National audienc
Correlación de los estilos de crianza de los padres de familia y la autonomía de los niños de 5 años del aula rosada del j.n n°215 en la ciudad de trujillo, en el año 2013
No full textLa presente investigación titulada: “Correlación de los estilos de crianza de los padres de familia y la autonomía de los niños de 5 años del aula rosada del J.N N°215 en la ciudad de Trujillo, en el año 2013”, tiene como fin primordial demostrar el nivel de autonomía que tienen los niños respecto a los estilos de crianza de los padres de familia. La investigación es de tipo descriptiva donde se aplicó un cuestionario a los padres de familia y una escala valorativa a los niños. Las muestras estuvo conformada por 22 padres de familia y 22 niños de 5 años del J.N 215 de la ciudad de Trujillo. En primera instancia se procedió aplicar el cuestionario a los padres de familia. En segundo momento se aplicó el cuestionario al grupo de niños. Los resultados obtenidos muestran que existe relación entre el estilo de crianza de los padres frente a la autonomía de los niños
Characterization of a Compton camera setup with monolithic LaBr<sub>3</sub>(Ce) absorber and segmented GAGG scatter detectors
No full textThe purpose of this study is to perform a first characterization and proof of principle investigation of a Compton camera setup composed by a scatterer component consisting of a pixelated GAGG crystal read out by a SiPM multi-pixel photon counter (MPPC) and an absorber component consisting of a monolithic LaBr3 (Ce) scintillator read out by a 256-fold multianode photomultiplier (PMT). The rationale of the study is to develop a Compton camera system as a future ion beam range verification device during particle therapy, via prompt gamma imaging. The properties to be investigated are the reconstruction efficiency and accuracy achievable with this system for detecting prompt-\gamma rays. The Compton camera system described has been tested with a laboratory radioactive Cesium137 source, in a certain geometrical configuration. The readout system is based on individual spectroscopy (NIM+VME) electronic modules, digitizing energy and time signals. The data have been analyzed to produce an input for the image reconstruction, performed using the MEGAlib toolkit software.Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.RST/Medical Physics & Technolog
Author Correction: Human neutrophils phagocytose and kill Acinetobacter baumannii and A. pittii
No full textAdrián Fernández was omitted from the author list in the original version of this Article. This has been corrected in the PDF and HTML versions of the Article, and in the accompanying Supplementary Information file. The updated Author List now reads: María Lázaro-Díez, Itziar Chapartegui-González, Santiago Redondo-Salvo, Chike Leigh, David Merino, David San Segundo, Adrián Fernández, Jesús Navas, José Manuel Icardo, Félix Acosta, Alain Ocampo-Sosa, Luis Martínez-Martínez & José Ramos-Vivas The Author Contributions section now reads: J.R.V. conceived the experiments, J.R.V and D.S.S. designed the experiments, M.L.D., I.C.G., S.R.S., C.L., D.M., A. F., F.A., A.O.S., J.M.I. and J.R.V. performed the experiments, M.L.D., I.C.G., J.N., F.A., J.M.I. L.M.M. and J.R.V. analyzed the data, A.O.S., D.S.S., J.N., F.A., J.M.I. contributed with reagents/materials/analysis tools, J.R.V. wrote the paper. All authors reviewed the manuscript.1,244,379Q1Q1SCI
Wafer-level packaging technology for RF applications based on a rigid low-loss spacer substrate
No full textAs mobile portable devices such as cellular system/phones, smart handheld devices and laptop computers acquire wireless connectivity there is a growing demand for greater levels of RF integration. The holy grail of integration is to have a whole set of different components integrated into one chip. However, for RF front-end the problem is the passive device integration. Moreover, protection of noise-sensitive analog circuits from "noisy" digital circuits becomes increasingly difficult for highly integrated components. To meet these challenges new enabling packaging technologies may be considered. The cost of wireless communications systems is often quoted as a most important driver. Thus, wafer-level packaging (WLP) may be considered as a promising solution to cost-effective RF system manufacturing, due to substantial cost savings with WLP's massively parallel processing and testing potential. In this thesis a wafer-level packaging concept based on a rigid spacer technology is proposed, that addresses both the issue of high-Q passive device integration and of on-chip isolation.Electrical Engineering, Mathematics and Computer Scienc
Enhanced Techniques for the Design and Characterization of RF Power Amplifiers
No full textElectrical Engineering, Mathematics and Computer Scienc
A Scalable Mextram Model for Advanced Bipolar Circuit Design
No full textIn this thesis, a referenced based scaling approach and its parameter extraction for the bipolar transistor model Mextram is proposed. It is mainly based on the physical properties of the Mextram parameters, which scale with the junction temperature and geometry of the bipolar transistor. The scalable electrical parameter in the scaling rules is normalized to a reference parameter at reference temperature and geometry. The scalable model is implemented in AHDL Verilog-A language, which can be used in many commercial simulators. Along with the scalable model, a unified extraction procedure for temperature and geometry parameters of the scalable model has been implemented in an IC-CAP model file using an example of high-speed SiGe HBT technology as a case study. The essential feature of the extraction methodology is a direct extraction of the temperature and geometry parameters from the measured electrical characteristics. The electrical model parameters as the reference parameters are extracted only once for a single reference temperature and geometry. No additional tool for temperature and geometry parameter extraction is needed. As a result, the accuracy is improved and the scalable model library generation time is greatly reduced.Electrical Engineering, Mathematics and Computer Scienc
Substrate Crosstalk Suppression Using Wafer-Level Packaging: Metalized Through-Substrate Trench Approach
No full textThe demand for miniaturization technology has been increasing over the last decades. Consumer electronics end-users often, if not always, go for more functionality and practicality. This is translated into systems that are more complex and yet smaller in size such as smart cellular phones and portable audio/video systems. System on Chip (SoC) is still a solution preferred by many. The SoC comprises of many different circuit blocks that fall into two categories namely analog/RF and digital. The integration of the analog/RF circuitry and digital circuitry on the same silicon substrate has yet another challenge to cope with. The noise generated from the switching activity of the digital circuitry is injected into the silicon substrate, which then can propagate to the sensitive analog/RF circuitry. Such substrate noise can significantly degrade the functionality of the analog/RF circuitry, thus deteriorating the performance of the entire electronic system. In this thesis, a method to isolate the noise generating circuit block from the noise sensitive circuit block is proposed and demonstrated. The proposed method is based on through-substrate trench isolation scheme to suppress the substrate noise. The idea behind this isolation scheme is to create a full through-substrate trench that physically separates the noise agressor from the victim. This idea is very simple and effective. The through-substrate trench is achieved by means of wafer-level packaging (WLP) technology and consists of only a few additional fabrication steps that can readily be incorporated in the WLP processing flow. In a few words, it can be described as follows: the silicon substrate is first bonded to a spacer substrate, e.g. AF-45 glass or High-Resistivity Polycrystalline Silicon (HRPS). Then, the bonded wafer stack is turned upside down before being thinned down. The next step is to create the through-substrate trench by means of KOH etching. At this stage, we now have an air-filled through-substrate trench. This isolation scheme can be further improved by metalizing the trench resulting in a backside metal plane. The backside metal can then be connected to ground to drain the substrate noise. This is called grounded-metalized through-substrate trench. In this work, we have successfully fabricated and measured several devices, i.e. control device (without isolation), air-filled trench device, and metalized trench device. At 50 MHz air-filled trench provides around 55 dB isolation with respect to control device, whereas the metalized-trench provides additional isolation of 7 dB. At 10 GHz air-filled trench provides around 10 dB isolation with respect to control device, whereas the metalized-trench provides additional isolation of 23 dB. At 40 GHz air-filled trench provides around 2 dB isolation with respect to control device, whereas the metalized-trench provides additional isolation of 20 dB.Microelectronics & Computer EngineeringElectrical Engineering, Mathematics and Computer Scienc
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