1,720,984 research outputs found

    Diamond and diamond-like carbon MEMS

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    Diamond and diamond-like carbon (DLC) thin films possess a number of unique and attractive material properties that are unattainable from Si and other materials. These include high values of Young's modulus, hardness, tensile strength and high thermal conductivity, low thermal expansion coefficient combined with low coefficients of friction and good wear resistance. As a consequence, they are finding increasing applications in micro-electro-mechanical systems (MEMS). This paper reviews these distinctive material properties from an engineering design point of view and highlights the applications of diamond and DLC materials in various MEMS devices. Applications of diamond and DLC films in MEMS are in two categories: surface coatings and structural materials. Thin diamond and DLC layers have been used as coatings mainly to improve the wear and friction of micro-components and to reduce stiction between microstructures and their substrates. The high values of the elastic modulus of diamond and DLC have been exploited in the design of high frequency resonators and comb-drives for communication and sensing applications. Chemically modified surfaces and structures of diamond and DLC films have both been utilized as sensor materials for sensing traces of gases, to detect bio-molecules for biological research and disease diagnosis

    Comparison of microtweezers based on three lateral thermal actuator configurations

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    Thermal actuator-based microtweezers with three different driving configurations have been designed, fabricated and characterized. Finite element analysis has been used to model the device performance. It was found that one configuration of microtweezer, based on two lateral bimorph thermal actuators, has a small displacement (tip opening of the tweezers) and a very limited operating power range. An alternative configuration consisting of two horizontal hot bars with separated beams as the arms can deliver a larger displacement with a much-extended operating power range. This structure can withstand a higher temperature due to the wider beams used, and has flexible arms for increased displacement. Microtweezers driven by a number of chevron structures in parallel have similar maximum displacements but at a cost of higher power consumption. The measured temperature of the devices confirms that the device with the chevron structure can deliver the largest displacement for a given working temperature, while the bimorph thermal actuator design has the highest operating temperature at the same power due to its thin hot arm, and is prone to structural failure

    Three types of planar structure microspring electro-thermal actuators with insulating beam constraints

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    A new concept of using an electrically insulating beam as a constraint is proposed to construct planar spring-like electro-thermal actuators with large displacements. On the basis of this concept, three types of microspring actuators with multi-chevron structures and constraint beams are introduced. The constraint beams in one type (the spring) of these devices are horizontally positioned to restrict the expansion of the active arms in the x-direction, and to produce a displacement in the y-direction only. In the other two types of actuators (the deflector and the contractor), the constraint beams are positioned parallel to the active arms. When the constraint beams are on the inner side of the active arms, the actuator produces an outward deflection in the y-direction. When they are on the outside of the active arms, the actuator produces an inward contraction. Finite-element analysis was used to model the performances. The simulation shows that the displacements of these microspring actuators are all proportional to the number of the chevron sections in series, thus achieving superior displacements to alternative actuators. The displacement of a spring actuator strongly depends on the beam angle, and decreases with increasing the beam angle, the deflector is insensitive to the beam angle, while the displacement of a contractor actuator increases with the beam angle

    Modelling and fabrication of microspring thermal actuator

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    A new spring type microelectrothermal actuator with greatly enhanced displacement is proposed. Instead of using a single long chevron actuator, several chevrons are folded into a number of sections to become a spring-like actuator. Insulating beams with a very low thermal expansion coefficient are used to form cross-linkages thereby avoiding displacement in the x-direction. As the actuator is heated up under bias, thermal expansion of the material leads to displacement in the y-direction only. FEMLAB simulation shows that for each device, the displacement linearly increases with increasing arm length. By introducing folded arms, the device size is substantially decreased whilst still delivering a large displacement, which is proportional to the number of arms. Hence the displacement that can be achieved by thermal actuation is significantly increased. For instead, the displacement for chevron with l=400µm is ~17µm and the size of ~800_50µm. A spring actuator consists of four chevrons with l=100um, it delivers a 12.5µm displacement with a size of only ~220_100µm. As comparing with a single chevron actuator with l=100µm, the folded spring delivers almost 4 times the displacement. A 2-mask stages process is used to fabricate the device. A freestanding electroplated Ni spring arms without the cross-linkages has already been fabricated

    Young's modulus of electroplated Ni thin film for MEMS applications

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    The Young's modulus of an electroplated nickel (Ni) thin film suitable for microelectromechanical applications has been investigated as a function of process variables: the plating temperature and current density. It was found that the Young's modulus is approximately 205 GPa at plating temperatures less than 60 °C, close to that of bulk Ni, but drastically drops to approximately 100 GPa at 80 °C. The inclusion of ammonium and sulphate ions by hydrolysis is believed to be responsible for the sharp drop. The Young's modulus of 205 GPa is for a Ni film plated at J=2 mA/cm2 and it decreases to 85 GPa as the plating current density is increased to 30 mA/cm2. The results imply that at low current density, the plating speed is slow and there is sufficient time for the as-plated Ni atoms to rearrange to form a dense coating. At high currents, the plating speed is high, and the limited mass transport of Ni ions leads to a less dense coating

    Going Beyond Counting First Authors in Author Co-citation Analysis

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    The present study examines one of the fundamental aspects of author co-citation analysis (ACA) - the way co-citation counts are defined. Co-citation counting provides the data on which all subsequent statistical analyses and mappings are based, and we compare ACA results based on two different types of co-citation counting - the traditional type that only counts the first one among a cited work's authors on the one hand and a non-traditional type that takes into account the first 5 authors of a cited work on the other hand. Results indicate that the picture produced through this non-traditional author co-citation counting contains more coherent author groups and is therefore considerably clearer. However, this picture represents fewer specialties in the research field being studied than that produced through the traditional first-author co-citation counting when the same number of top-ranked authors is selected and analyzed. Reasons for these effects are discussed

    Variations on the Author

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    “Variations on the Author” discusses two of Eduardo Coutinho’s recent films (Um Dia na Vida, from 2010, and Últimas Conversas, posthumously released in 2015) and their contribution to the general question of documentary authorship. The director’s filmography is characterized by a consistent yet self-effacing form of authorial self-inscription: Coutinho often features as an interviewer that rather than express opinions propels discourses; an interviewer that is good at listening. This mode of self-inscription characterizes him as an author who is not expressive but who is nonetheless markedly present on the screen. In Um Dia na Vida, however, Coutinho is completely absent form the image, while Últimas Conversas, on the contrary, includes a confessional prologue that moves the director from the margins to the center of his films. This article examines the ways in which these works stand out in the filmography of a director who offers new insights into the notion of cinematic authorship

    Uniformity control of Ni thin film microstructures deposited by through-mask plating

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    The thickness uniformity within a specimen and the cross-sectional profiles of electroplated individual Ni microstructures have been investigated as a function of the electroplating conditions. It was found that the uniformity and profiles of microstructures could be controlled by varying the process conditions. A uniform thickness distribution and microstructures with flat profiles could be obtained at optimal plating conditions of 8 mA/cm2 and 60°C. Above this optimal plating current density, the microstructure has a rabbit-ears profile, and the thickness of a narrow microstructure is thicker than that of wide ones. Below this current density, the microstructure has a cap-like cross-sectional profile, and a narrow structure is thinner than wide ones. Increasing the plating temperature enhances the nonuniformity, whereas other process parameters have insignificant effects on it. The current crowding observed in patterned specimens is responsible for the rabbit-ears profile of individual microstructures, while a combination of the fluidic friction on the sidewall of the photoresist and the electrophoresis of the ions in the solution are believed to be responsible for the abnormal cap-like profile of individual microstructures and the thinning effect on narrow microstructures
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