6,822 research outputs found
Obstructive sleep apnea increases the risk of bladder pain syndrome/interstitial cystitis: A population-based matched-cohort study
No full textAims ;Previous studies indicated a possible association between bladder pain syndrome/interstitial cystitis (BPS/IC) and sleep disorders including sleep abnormalities with delayed onset of sleep, waking up before needed, and snoring. Nevertheless, no previous study has reported the association between obstructive sleep apnea (OSA) and BPS/IC. In this retrospective cohort study, we examined the risk of BPS/IC among subjects with OSA during a 3-year follow-up in Taiwan using a population-based dataset. ;Methods ;This study comprised 2,940 study subjects with OSA, and 29,400 randomly selected comparison subjects. We individually followed-up each sampled subject (n = 32,340) for a 3-year period to identify those subjects who subsequently received a diagnosis of BPS/IC. A Cox proportional hazards regression model was constructed to estimate the risk of subsequent BPS/IC following a diagnosis of OSA. ;Results ;Incidences of BPS/IC during the 3-year follow-up period were 13.61 (95% confidence interval [CI] = 7.37-23.13) and 3.60 (95% CI = 2.06-4.39) for subjects with and those without OSA, respectively. After adjusting for diabetes, hypertension, coronary heart disease, obesity, hyperlipidemia, chronic pelvic pain, irritable bowel syndrome, fibromyalgia, chronic fatigue syndrome, depression, panic disorder, migraines, sicca syndrome, allergies, endometriosis, asthma, tobacco use disorder, and alcohol abuse, the stratified Cox proportional hazards regressions revealed that the hazard ratio for BPS/IC among subjects with OSA was 3.71 (95% CI = 1.81-7.62, P < 0.001) that of comparison subjects. ;Conclusions ;This study provides epidemiological evidence of a link between OSA and a subsequent BPS/IC diagnosis. We suggest that clinical practitioners treating subjects with OSA be alert to urinary complaints in this population. Neurourol. Urodynam. 33:278-282, 2014. (c) 2013 Wiley Periodicals, Inc
中國IC設計市場之分析 : 對臺灣IC業者之機會與挑戰
No full text碩士根據中國信息產業發展研究中心 (China Center of Information Industry Development, CCID)統計，中國內需市場龐大，目前已是多項電子產品全球前三大消費市場；而在相對低廉土地、勞力…等成本優勢下，中國亦是全球主要電子產品生產基地。因此，由需求及供給所誘發的內含晶片需求亦呈現強勁的成長力道，驅動中國IC市場迅速成長。
但因目前中國的IC技術水準較落後、自製率偏低，仍不足以滿足內需市場，超過80%以上的IC需要進口。這種供需關係的缺口差距，正好吸引包括歐、美、日、韓以及台灣IC廠商，紛紛提早進入中國市場卡位。
台灣的IC設計產業，相較於中國本土業者，在行銷與產品創新經驗、類比與通訊等關鍵技術上均擁有絕對的優勢。再加上貼近中國市場，能較歐美業者快速反應後端客戶所遭遇之困難，協助找尋解決方案，勢必能在中國IC市場快速成長之際佔有一席之地。
本研究經由對影響IC設計產業之國際因素(全球市場現況與未來成長性)及中國因素（科技基礎建設、市場成長動力、政府政策、人力資源、產業群聚等）的討論，再加上對個案公司專業經理人的深度訪談，從政策法令面以及產業面提出建議，以作為未來台灣政府產業政策制定以及IC設計業者進入中國市場投資之決策考量。According to the statistic of China Center of Information Industry Development, it indicated that China possesses a tremendous internal demanding market, and is located in world third consumer market for many electronic products currently. Given the advantages of relatively low cost of land, labor, etc, China predominate the world primary electronic output production base. Therefore, the embed chips demand induced by the demand and supply demonstrate a robust development strength, thus, drive China IC market to grow rapidly.
However, in present, China IC know-how level is relatively lagging, and the self-production rate is low, making it insufficiently fulfill its internal market demands; 80% and above of the IC products inquire import. This supply–demand discrepancy appeals many overseas IC firms, include, Europe, America, Japan, Korea and Taiwan, enter China markets advance earlier.
Taiwan IC design industry, compare to the China industry, has absolute advantages in marketing and product innovative experience, analog communication, as well as some critical know how. In addition, Taiwan is closer to the China market than Europe of America practitioners; therefore, Taiwan is able to respond to the difficulties encountered by its back-end customer more rapidly, thus, Taiwan certainly will remain a great share in China’s IC market while China market grow speedily on its own.
This research will provide some suggestions for strategic decree and industrial aspect by discussing the influence of international variables (current world market status and future development) and China variables (know how construct, market development dynamic, government policy, human resource, industrial cluster) to the IC design industry, as well as by depth interviewing with case company managers; for the consideration of future Taiwan government policy and IC design practitioner investment in China market.目錄
目錄-----Ⅰ
表目錄---Ⅳ
圖目錄---Ⅵ
第一章 緒論-----1
第一節 研究動機-----1
第二節 研究目的-----2
第三節 研究限制與架構-----3
第四節 文獻探討-----5
第二章 積體電路(IC)產業分析-----10
第一節 積體電路(IC)概述-----10
壹、IC之定義-----10
貳、IC產業價值鏈-----16
参、IC產業特性-----21
第二節 IC產業成長之關鍵成功因素-----24
壹、市場需求-----24
貳、金融市場-----24
參、政府政策-----24
肆、產業鏈完整---24
伍、高階人力-----25
陸、智慧財產權保護-----25
第三節 全球IC市場前景-----27
壹、全球成長-----27
貳、主要市場-----28
第三章 中國IC設計產業分析-----35
第一節 中國IC市場概況-------35
壹、IC設計-----36
貳、IC製造-----39
參、IC封測-----42
第二節 中國IC設計產業現狀與前景-----45
壹、科技基礎建設-----45
貳、市場成長動力-----46
参、人力資源---------53
肆、政府產業政策-----55
伍、產業群聚---------57
第三節 中國IC設計產業未來發展之挑戰-----69
壹、缺乏自主研發技術-----69
貳、融資管道不足---------70
參、員工福利機制不健全---71
肆、對創投產業的限制-----71
伍、人才培育量勝於質-----72
陸、智慧財產權保護-------73
第四節 台灣IC設計產業在中國的機會-----74
第四章 外商在中國設立IC設計公司之程序與規範-----77
第一節 外商在中國設立企業之規範與程序-----77
壹、設立企業之範圍與項目-----77
貳、設立企業之形式 ----------78
參、設立企業之程序-----------80
肆、設立企業應注意之問題-----84
第二節 IC設計公司在中國申請認定之程序-----85
壹、主管機關-----85
貳、認定條件-----86
參、認定程序-----86
第三節 台灣IC設計產業赴中國投資之相關規定-----90
壹、法令依據-----90
貳、投資定義-----90
參、投資方式-----91
肆、出資種類-----91
伍、中國投資申請案審查程序-----91
陸、中國投資上限規定-----------95
第五章 成功案例分析-以M公司為例-----96
第一節 訪談背景-----96
壹、LCD控制IC市場概況-----96
貳、個案公司簡介----------99
第二節 個案公司訪談內容-----100
第三節 IC設計公司進入中國市場模式分析-----105
壹、政策法令面-----107
貳、產業面---------107
第六章 結論與建議------109
第一節 研究結論------109
第二節 後續研究方向建議-----112
參考文獻-----113
表目錄
表1-1 IC 產業特性彙整表-------------------------------------------- 6
表1-2 IC 產業關鍵成功因素彙整表------------------------------------ 8
表1-2 IC 產業關鍵成功因素彙整表(續)-------------------------------- 9
表2-1 MPU/MCU/DSP 之差異------------------------------------------- 12
表2-2 2003～2007 年全球微元件細分項產值---------------------------- 12
表2-3 2003～2007 年全球記憶體市場規模------------------------------ 14
表2-4 2003～2007 年全球類比IC 市場預測------------------------------ 15
表2-5 全球IC 區域市場規模----------------------------------------- 27
表2-6 2003～2007 年台灣IC 市場規模---------------------------------- 34
表3-1 中國IC 市場規模與產值--------------------------------------- 37
表3-2 2005 年中國IC 市場前十大廠商 V.S.中國本土IC 設計前十大廠商--- 38
表3-3 2005 年中國本土IC 設計前十大廠商主要產品---------------------- 39
表3-4 2005 年中國IC 製造生產線數目---------------------------------- 40
表3-5 中國主要晶圓代工廠情況-------------------------------------- 41
表3-6 中國主要IC 封測業者----------------------------------------- 44
表3-7 1995～2004 年中國高新技術產業開發區發展概況------------------ 46
表3-8 中國發展數位及高解析度電視相關晶片業者---------------------- 48
表3-9 中國發展手機相關晶片業者------------------------------------ 50
表3-10 中國發展WLAN 及電力載波聯網相關業者------------------------ 51
表3-11 中國發展USB 及MP3 等相關晶片業者---------------------------- 53
表3-12 長江三角洲地區主要IC 設計廠商------------------------------ 59
表3-12 長江三角洲地區主要IC 設計廠商(續)-------------------------- 60
表3-13 長江三角洲地區晶圓代工廠產能概況--------------------------- 61
表3-13 長江三角洲地區晶圓代工廠產能概況(續)----------------------- 62
表3-14 長江三角洲地區主要IC 封測廠商------------------------------ 63
表3-14 長江三角洲地區主要IC 封測廠商(續)-------------------------- 64
表3-15 京津塘地區主要IC 設計廠商---------------------------------- 66
表3-16 京津塘地區主要晶圓代工廠商--------------------------------- 67
表3-17 京津塘地區主要IC 封測廠商---------------------------------- 68
表3-18 2005 年兩岸資本市場概況------------------------------------- 70
表3-19 2004 年兩岸創業投資產業概況--------------------------------- 72
表3-20 台灣IC 設計產業未來發展SWOT 分析---------------------------- 75
表5-1 全球液晶電視市場規模預測------------------------------------ 98
表5-2 全球LCD 控制IC 市場規模預測---------------------------------- 98
圖目錄
圖1-1 研究架構--------------------------------------------------- 4
圖2-1 半導體產品分類---------------------------------------------- 10
圖2-2 IC 產品類別-以產品特性區分---------------------------------- 16
圖2-3 IC 產業變革過程--------------------------------------------- 17
圖 2-4 IC 產業價值鏈----------------------------------------------- 19
圖2-5 2003~2007 年美洲IC 市場規模--------------------------------- 29
圖2-6 2003~2007 年歐洲IC 市場規模--------------------------------- 29
圖2-7 2003~2007 年日本IC 市場規模--------------------------------- 31
圖2-8 2003~2007 年韓國IC 市場規模--------------------------------- 32
圖2-9 2003~2007 年中國IC 市場規模--------------------------------- 33
圖3-1 中國半導體市場 V.S.全球半導體市場--------------------------- 35
圖3-2 2003~2009 年中國IC 市場規模--------------------------------- 36
圖3-3 中國IC 製造生產規模----------------------------------------- 40
圖3-4 中國IC 封測市場規模----------------------------------------- 43
圖3-5 中國IC 設計產業產值預測------------------------------------- 47
圖3-6 中國手機市場規模預測---------------------------------------- 49
圖3-7 中國MP3 播放器市場銷售量及成長率預測------------------------ 52
圖3-8 中國MP3 播放器市場銷售值及成長率預測------------------------ 52
圖3-9 2001~2004 年長江三角洲地區IC 生產規模----------------------- 58
圖3-10 2001~2004 年長江三角洲地區IC 產業廠商家數------------------ 58
圖3-11 2001~2004 年京津塘地區IC 生產規模-------------------------- 65
圖4-1 外資企業設立程序-------------------------------------------- 83
圖4-2 中國IC 設計企業認定程序------------------------------------- 89
圖4-3 中國投資申請案審查程序-------------------------------------- 93
圖4-4 赴中國投資申請案件審理作業流程------------------------------ 94
圖4-5 中國投資上限規定-------------------------------------------- 95學號: 693480237, 學年度: 9
Improvements in vision-related quality of life with AcrySof IQ SN60WF aspherical intraocular lenses.
No full textA nationwide population-based study on bladder pain syndrome/interstitial cystitis and ED
No full textAs bladder pain syndrome/interstitial cystitis (BPS/IC) has been demonstrated to proceed through the inflammatory pathways to cause endothelial dysfunction, and endothelial dysfunction is a major factor in the development of ED, it is possible that BPS/IC may be associated with ED. This study set out to investigate the putative association between ED and BPS/IC by using a population-based data set and case-control design in Taiwan. We obtained the data from Taiwan's National Health Insurance Research Database. Cases included 32 856 ED patients >= 18-years old and 164 280 matched controls. Conditional logistic regression analyses were performed to compare the odds ratios (OR) and corresponding 95% confidence intervals (CIs) of having been previously diagnosed with BPS/IC in cases and controls. Among the total sample of 197 136 subjects, the prevalence of prior BPS/IC was 0.05%. The prevalence of prior BPS/IC was 0.10% and 0.04% for cases and controls, respectively (P<0.001). Conditional logistic regression analysis revealed that when compared with controls, the OR of prior BPS/IC for cases was 1.75 (95% CI=1.12-2.71) after adjusting for monthly income, geographic location, hypertension, diabetes, coronary heart disease, hyperlipidemia, renal disease, obesity, depressive disorder, alcohol abuse/alcohol-dependence syndromes and the number of outpatient visits within 1 year before index date. Subjects aged between 18 and 39 were additionally found to have the highest ORs for prior BPS/IC among cases when compared with controls (OR = 10.40; 95% CI = 2.93-36.94). There was an association between BPS/IC and ED. The youngest cases with ED were found to have the strongest magnitudes of association with BPS/IC
Plant age-related resistance to Ralstonia solanacearum, the causal agent of bacterial wilt.
No full textIntegrate Collaborative Project and Intellectual Asset Management for IC Design Industry
Full text linkOwning to the rapid growth of consumer electronics market, there are urgent needs for better control over IC design projects, reuses of design knowledge (e.g., silicon intellectual property - SIP), and design collaboration in a virtual design platform. In order to provide IC industry a well-integrated design environment, this research proposes an information platform which combines the project management module, the design knowledge management module and the collaborative working environment for the IC industry. With the help of the project management module, the R&D team leaders can better control its partners' and its own schedules to shorten the time to market. Moreover, the design knowledge (SIP) management module provides the IC companies and their partners a knowledge exchange environment to enrich the design chain productivity and efficiency. Finally, the integration of collaborative working environment is the propeller to enable collaborative design. With the collaborative project and knowledge management platform, IC companies gain competitive advantages when working as a virtual design team
Paleoseismology of the Rueisuei segment of the Longitudinal Valley fault, eastern Taiwan
No full textFiber type and myosin heavy chain compositions of adult pretarsal orbicularis oculi muscle.
No full textThe Study of Information Sharing for Time-based Competition\uef\ubcThe Empirical Analysis on Supply Chain Information Integration in Taiwan IC Industry
No full textWith rapid growth for years, Taiwan IC industry has played an important position in the world. In addition to the growth, close interaction and cooperation among firms have become the characteristics of Taiwan IC industry. Currently, time-based competition has been one of the most important factors for business success, and the competition in the 21st century relies on strategic supply chain management. Through interfirm collaboration by sharing information among supply chain partners, some activities originally performed in an individual firm are replaced by firms with core competency. In performing these activities, the competitive advantages through the supply chain information integration are gradually recognized.
The objective of this article is to realize the current situation and future plan of inter-organizational information sharing (IOIS) in Taiwan IC industry. From literature, there are lots of factors that influence the success of IOIS, this paper focuses on some areas, such as benefits from IOIS, motivations of IOIS, risks from IOIS, strategic or operational reasons, IT maturity among firms, key success factors of IOIS, and the initiator of industrial IOIS. Through questionnaire survey, we collect and analyze various viewpoints from companies of Taiwan IC industry supply chain, including IC design houses, IC fabs, assembly and testing houses, assembly material and equipment suppliers.
After the empirical analysis, we compare the findings with literatures. We conclude that the IOIS, namely networked IOIS, in Taiwan IC industry proceeds toward reciprocal interdependencies between organizations. The coordination mechanisms count on standards, rules, and mutual adjustment. Initially, the networked IOIS will tend to be much less structured and the potential for conflict may be higher. At present, because of lack of reliable and mature information connection among firms, the intensive information technology support is needed.
Finally, based on the findings, we summarize the characteristics and present the model of IOIS for Taiwan IC industry supply chain. Then, some suggestions are arisen for industry reference, including mutual benefit realization and cooperation willingness, protection of business confidential and data security, integration of enterprise systems and industrial standard messages, proposal of IC industry association to be the coordinator or initiator of IOIS, step by step implementation according to priorities of information type, and integration of information flow with manufacturing goods flow in the supply chain
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