608 research outputs found

    Vertex-Detector R&D for CLIC

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    A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors via low-mass interconnects. The power dissipation of the readout chips is reduced by means of power pulsing, allowing for a cooling system based on forced gas flow. In this paper the CLIC vertex-detector requirements are reviewed and the current status of R&D on sensors, readout and detector integration is presented.A detector concept based on hybrid planar pixel-detectortechnology is under development for the CLIC vertex detector. Itcomprises fast, low-power and small-pitch readout ASICs implementedin 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors vialow-mass interconnects. The power dissipation of the readout chipsis reduced by means of power pulsing, allowing for a cooling systembased on forced gas flow. In this paper the CLIC vertex-detectorrequirements are reviewed and the current status of R&D on sensors,readout and detector integration is presented.A detector concept based on hybrid planar pixel-detector technology is under development for the CLIC vertex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin sensors via low-mass interconnects. The power dissipation of the readout chips is reduced by means of power pulsing, allowing for a cooling system based on forced gas flow. In this paper the CLIC vertex-detector requirements are reviewed and the current status of R&D on sensors, readout and detector integration is presented

    Design and tests of the silicon sensors for the ZEUS micro vertex detector

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    To fully exploit the HERA-II upgrade, the ZEUS experiment has installed a Micro Vertex Detector (MVD) using n-type, single-sided, silicon mu-strip sensors with capacitive charge division. The sensors have a readout pitch of 120 mum, with five intermediate strips (20 mum strip pitch). The designs of the silicon sensors and of the test structures used to verify the technological parameters, are presented. Results on the electrical measurements are discussed. A total of 1123 sensors with three different geometries have been produced by Hamamatsu Photonics K.K. Irradiation tests with reactor neutrons and Co-60 photons have been performed for a small sample of sensors. The results on neutron irradiation (with a fluence of 1 x 10(13) 1 MeV equivalent neutrons/cm(2)) are well described by empirical formulae for bulk damage. The Co-60 photons (with doses up to 2.9 kGy) show the presence of generation currents in the SiO2-Si interface. a large shift of the flatband voltage and a decrease of the hole mobility

    The CLIC Vertex Detector

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    The precision physics needs at TeV-scale linear electron-positron colliders (ILC and CLIC) require a vertex-detector system with excellent flavour-tagging capabilities through a meas- urement of displaced vertices. This is essential, for example, for an explicit measurement of the Higgs decays to pairs of b-quarks, c-quarks and gluons. Efficient identification of top quarks in the decay t → W b will give access to the ttH-coupling measurement. In addition to those requirements driven by physics arguments, the CLIC bunch structure calls for hit tim- ing at the few-ns level. As a result, the CLIC vertex-detector system needs to have excellent spatial resolution, full geometrical coverage extending to low polar angles, extremely low material budget, low occupancy facilitated by time-tagging, and sufficient heat removal from sensors and readout. These considerations challenge current technological limits. A detector concept based on hybrid pixel-detector technology is under development for the CLIC ver- tex detector. It comprises fast, low-power and small-pitch readout ASICs implemented in 65 nm CMOS technology (CLICpix) coupled to ultra-thin planar or active HV-CMOS sensors via low-mass interconnects. The power dissipation of the readout chips is reduced by means of power pulsing, allowing for a cooling system based on forced gas flow. This contribution reviews the requirements and design optimisation for the CLIC vertex detector and gives an overview of recent R&D achievements in the domains of sensors, readout and detector integration

    Vertex-Detector R&D for CLIC

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    Silicon Pixel R&D for CLIC

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    Progress on Detector R&D for CLIC 2019–2025

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    Stringent requirements are imposed on the CLIC detector technologies, addressed by broad and ambitious R&D programs exploiting synergies with other projects and progress in technologies available from industry. This note summarizes the evolution since the 2019 update of the European Strategy for Particle Physics, with a focus on the most critical sub-detector systems. The impact of an improved machine design for the initial 380 GeV accelerator stage on the detector is also discussed

    Vertex-Detector R/D for CLIC

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    Visual Field Indices for the Nasal Step: Different Calculation Procedures and Their Correlation with the Clinical Classification of Visual Field Defects

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    We calculated normal values for the normal population of the Octopus G1 program (n=836) and values for defective fields due to glaucoma and other diseases (n=147) to determine indices for a nasal step in the interpretation of glaucomatous visual fields. We used different calculation procedures and correlated the results with the clinical evaluation of the visual field. All indices tested were able to detect and quantify nasal steps in defective fields and to separate them from normal findings (area under curve of Receiver Operating Characteristic curves 0.963 to 0.999). Indices calculated excluding sensitivity values of positions with the greatest distance from the horizontal meridian or weighting of sensitivity values according to their closeness to the horizontal meridian showed the best results (auc=0.999). We can thus conclude that the calculation of an index for nasal step is a simple and effective adjunct to any interpretation system for visual fields. </jats:p

    Detector challenges at the CLIC multi-TeV e+e- collider

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    The beam parameters of the proposed CLIC concept for a linear electron-positron collider with a centre-of-mass energy of up to 3 TeV pose challenging demands for the design of the detector systems. This paper introduces the CLIC machine and the requirements for the detectors and gives an overview of the ongoing detector studies
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