5,107 research outputs found
A study on the competition and cooperation in IC channel
No full text碩士本研究以競合行為之非零和賽局(Non-zero-sum Games)分析IC原廠與通路商的競合關係，引用通路管理文獻Stern and El-Ansary(1972) 通路權力的定義、Morgan and Hunt (1994)提出關係行銷之模式，為理論基礎。由於現今IC通路市場在呈現完全競爭的情況下，IC原廠與通路商的既競爭又合作的互動過程就如同一場賽局。本研究選取兩個事件對通路商與IC原廠進行深度訪談，發展出研究架構。推出主要命題如下：
命題一: IC通路中原來之通路商會因為穩定之寡佔市場面臨破壞
與新的潛在進入者之產生而採取合作之關係
命題二: IC通路商之間合作關係之建立在於可以滿足彼此之間的欠
缺、需求與互補而形成互賴關係，並將促使往「雙贏」的
方向發展。
命題三: IC通路關係中持續保有合作空間的廠商，其生存能力將更
為強盛並擁有較佳的發展優勢。
命題四: IC通路中屬於通用料之零組件，只有掌握關鍵人際關係
後，報價才會俱有較大之競爭力。
結論: IC通路夥伴關係應從長遠利益思考，勿落入「輸贏」或「雙
輸」的情境中，唯有以創造共同之利益為出發點，方能共榮
共存形成「雙贏」In this study, the nonzero-sum game theory of co-opetitive behaviors is introduced for the competitive relationship between the original IC manufacturers and distributors, while the definition of channel power proposed by Stern and El-Ansary (1972) and the relationship marketing model proposed by Morgan and Hunt (1994) are brought in as theoretical bases. As today’s IC channel market is in a state of total competition, the competitive and yet cooperative interactions between IC manufacturers and distributors are like a game. Two events, for which distributors and IC manufacturers are interviewed in depth, and are selected for the construction of research framework. The following proposituons come up:
Proposituon 1: The agents in the IC distribution channels will start a cooperative relationship due to possible destruction of market monopoly and entry of potential new entrants.
Proposituon 2: The cooperation between IC distributors is based on the satisfaction with what one another lacks, what one another needs and what one can provide for one another, thus leading to the dependence on one another as well as a driving force to urge them going in the “win-win” direction.
Proposituon 3: Those who continuously maintain a room for cooperation in IC distribution channels tend to have stronger survivability and better advantage for development.
Proposituon 4: For parts and components that are common materials in IC distribution channels, the price quotes become more competitive only if there is a tighter relationship with some key persons.
Conclusion: An IC channel partnership should aim for the future. Do not position yourself in a “lose-win” or “lose-lose” dilemma. A “win-win” situation only occurs when every partner starts to think for long term.目錄
目錄------------------------------------------I
表目錄---------------------------------------II
圖目錄---------------------------------------IV
第一章 緒論--------------------------------1
第一節 研究背景與動機----------------------1
第二節 研究目的----------------------------9
第三節 研究範圍---------------------------10
第四節 研究流程---------------------------10
第五節 研究限制---------------------------11
第二章 文獻探討-----------------------------12
第一節 台灣半導體產業發展與沿革-----------12
第二節 IC零組件產業環境-------------------18
第三節 通路與營運績效---------------------23
第四節 競合策略之賽局理論-----------------33
第三章 研究設計-----------------------------39
第一節 研究方法---------------------------39
第二節 研究架構---------------------------39
第四章 研究方法-----------------------------43
第一節 個案公司背景與營運策略-------------43
第二節 通路個案事件描述-------------------52
第二節 競合理論分析-----------------------75
第五章 討論、結論、管理意涵與建議-----------77
第一節 討論、結論-------------------------77
第二節 管理意涵與建議---------------------84
第三節 研究限制---------------------------86
參考文獻------------------------------------87
附錄----------------------------------------92
表目錄
表1- 1 2006年台灣前十大IC 製造業者----------3
表1- 2 2007年前三季台灣IC產業產值-----------5
表1- 3 2007年前三季營運成果回顧與展望-------6
表2- 1 導體產品類別------------------------12
表2- 2 IC之種類、功能、特性(色)、應用------14
表2- 3 IC Design House 之類別------------- 16
表2- 4 台灣半導體工業之沿革----------------17
表2- 5 IC通路產業近年重大整合案------------18
表2- 6 電子零組件通路業務型態--------------20
表2- 7 行銷通路定義------------------------23
表2- 8 通路成員之互動模式------------------24
表2- 9 信任的定義--------------------------27
表2- 10 承諾的定義-------------------------28
表2- 11 囚犯困境報酬表---------------------35
表2- 12 競合理論相關文獻-------------------38
表3- 1 個案訪談對象------------------------41
表3- 2 個案訪談時間表----------------------42
表4- 1 A公司94年度~96年度損益表------------44
表4- 2 94 D公司94年度~96年度損益表---------47
表4- 3 A原廠與D原廠比較表------------------49
表4- 4 B通路商與C通路商比較表--------------51
表4- 5 研究者的分析------------------------54
表4- 6 研究者的分析------------------------56
表4- 7 研究者的分析------------------------57
表4- 8 研究者的分析------------------------58
表4- 9 研究者的分析------------------------60
表4- 10 研究者的分析-----------------------61
表4- 11 研究者的分析-----------------------67
表4- 12 B、C、G三通路商所採取之策略--------69
表4- 13 研究者的分析-----------------------69
表4- 14 研究者的分析-----------------------73
表5- 1 事件一回應整理表--------------------80
表5- 2 事件二回應整理表--------------------82
圖目錄
圖1- 1 半導體產業供應鏈---------------------4
圖1- 2 半導體及設備之市場與產業結構---------4
圖1- 3 通路商與供應商、競爭者間之競合關係---8
圖1- 4 本研究流程圖------------------------11
圖2- 1 半導體產品分類圖示------------------13
圖2- 2 IC產業結構示意圖--------------------15
圖2- 3 半導體產業的供應鏈關係--------------18
圖2- 4 Hunt and Nevin 之權力理論-----------26
圖2- 5 賽局中參賽者的網絡關係--------------37
圖3- 1 研究架構----------------------------40
圖3- 2 訪談流程圖--------------------------41
圖4- 1 A原廠人力資源-----------------------45
圖4- 2 A原廠營業額-------------------------45
圖4- 3 D原廠人力資源-----------------------48
圖4- 4 D原廠營業額-------------------------48
圖4- 5 事件二參與者之人際網絡圖------------64學號: 795610277, 學年度: 9
The Performance evaluation of Taiwan IC Design Industry
No full text過去幾年，台灣IC 設計產業是一蓬勃發展之明星產業，其帶動並提升台灣IC產業之價值鍊，為國家之經濟做出高附加價值之貢獻。台灣IC 設計產業為何有如此傲人之績效？其是歷史之偶然或是有其他之原因，此正是本論文探討之起點。故從管理會計之角度來研究是否該產業在績效評估制度上有良好之設計與發展，使得該產業之產品開發得以獲致成央C本論文企圖更進一步了解該產業之研發部門績效是否與該產業之財務績效之間具有明顯之關係。
本研究從文獻探討中，整理並定義衡量績效評估制度完整程度之三個構面，分別是整合程度、評估程序及激勵誘因等。是否績效評估制度愈完整，其愈有助於達成其產品開發之最終績效？故本研究進一步探討台灣IC 設計產業績效評估制度之完整程度與研發部門績效之間的關係。當然，若研發部門績效良好，其或雪|反映在該公司之財務表現上。所以本研究最後即嘗試探討研發部門績效與公司財務績效之間的關係。
本研究並彙整台灣IC 設計產業績效評估制度之完整程度現況、其績效評估之現行作法及其產品開發之成它]素之相關資訊，做為台灣IC 設計產業之業者參考，以利其檢視公司之績效評估制度是否落後於產業之水準，並可改善其產品開發之績效。綜合本研究之發現有以下之主要結論：
1. 台灣IC設計業者產品開發之績效評估非常重視市場導向及滿足顧客需求。
2. 台灣IC設計業者認為其績效評估制度對產品開發績效具有顯著相關，且其績效評估制度有其影響力與重要價值。
3. 台灣IC設計業者之績效評估制度，非常依賴財務之激勵誘因，例如員工分紅及員工認股權。
4. 績效評估制度之激勵誘因與公司成立時間、資本額有顯著相關。
5. 台灣IC設計業者之財務績效與整體研發部門績效並無顯著相關。In recent years, IC design industry has been prosperous in Taiwan. IC design industry not only lifts the value chain of IC industry, but also makes a high value-added contribution to Taiwan’s economy. Why does IC design industry have such an outstanding performance? Is it because of historically haphazard or of any other reasons? In this thesis, there are two major topics to be discussed. First, from managerial accounting point of view, is better R&D performance based on performance evaluation system in IC design industry? Secondly, is any significant relationship between the performance of a R&D department and the financial performance of a company in this industry.
From literature review, the research defines the integration degree of performance evaluation system with three dimensions：integration level、valuation process and motivational incentive. Is more completeness of performance evaluation system, more success of R&D performance? This thesis will be deeply probed into the relationship between the completeness of performance evaluation system and the performance of a R&D department in Taiwan’s IC design industry. Besides, management team concerns whether good performance in R&D department reflects on the financial performance of a company.
The research summarized the status of performance evaluation system of Taiwan IC industry, the methods of performance evaluation system and its major successful factors of product development. This research will help IC design house to examine whether its performance evaluation system is far beyond the industry’s general standard and to improve its performance evaluation system. The major findings of this research can be concluded as follows:
1. The performance evaluation of R&D activities is based highly on market oriented and customer satisfaction
2. There is a significant relationship between performance evaluation system and the performance of a R&D department
3. The performance evaluation highly rely on financial motivational incentive such as employee stock bonus and employee stock option plan.
4. Motivational incentive of performance evaluation system has a significant relationship with company history and the amount of paid-in capital.
5. Unfortunately, There is no any significant relationship between the performance of an R&D performance and financial performance of a company.謝詞 ……….…………………….………………………………………………...三
中文摘要 …….…………....……………………………………………..………..四
英文摘要 …………………………………………..………………………..…….五
目錄 …………………………..……………………………………….…………..七
表次 …………………………………………………….…………..……………..九
圖次 …………………………………………………………………..……….......十
第一章 緒論 ……………………………………………………………………1
第一節 研究動機 …………………………………………………………1
第二節 研究目的 …………………………………………………………2
第三節 研究範圍及限制 …………………………………………………3
第四節 研究步驟 …………………………………………………………4
第二章 文獻探討 ………………………………………………………………6
第一節 績效衡量之變數 …………………………………………………6
第二節 高科技產業之績效衡量特性 ……………………………………6
第三節 績效衡量制度之完整性 …………………………………………7
第四節 部門績效與公司財務績效之關聯性 ……………………………9第五節 研發部門績效與公司財務績效之關聯性………………………10
第三章 台灣IC設計產業介紹 ………………………………………………12
第一節 台灣半導體產 ………………………………………………… 12
第二節 台灣IC設計業之關鍵地位 ……………………………………13
第三節 台灣IC設計業之發展契機 ……………………………………16
第四章 研究方法 ………………………………………………………………17
第一節 產業選擇與其樣本 ………………………………………………17
第二節 問卷設計與回收 …………………………………………………17
第三節 研究架構 …………………………………………………………19
第四節 研究假設 …………………………………………………………20
第五節 研究統計方法 ……………………………………………………23
第六節 信度與效度分析 …………………………………………………23
第五章 研究結果分析 …………………………………………………………26
第一節 回收樣本之基本背景統計 ………………………………………26第二節 績效評估作法之統計 ……………………………………………30
第三節 產品開發之成永鶬鉹尷R ………………………………………39
第四節 績效評估制度之完整性統計 ……………………………………41
第五節 產品開發部門之績效統計 ………………………………………48
第六節 績效評估制度完整性與產品開發部門績效間之相關分析 ……49
第七節 績效評估制度完整性與公司成立時間、資本額、營業額、
產品開發人數及產品開發專案數之相關分析 …………………52
第八節 研發部門績效與公司財務績效之相關分析 ……………………55
第六章 結論 ……………………………………………………………………57
第一節 研究結論 …………………………………………………………57
第二節 研究成果之運用 …………………………………………………66
第三節 研究建議 …………………………………………………………67
中文參考文獻 ……………………………………………………………………68
英文參考文獻 ……………………………………………………………………6
The Competition Analysis for the IC Design Industry of Taiwan and China
No full textChina has become the largest global IC market demand since 2004, mainly because China is the main production base of electronic products and global demand coupled with the domestic market, the annual amount of IC imports is much higher than oil. Because such a huge market demand coupled with incentives and guidance China government economic plans, resulting in rapid rise of China's IC design industry.In addition to the IC output value less than the United States and Taiwan, China has become the third worldwide. Obviously semiconductor industry is becoming the focus and fostering industry of China, especially in that part of the Fabless IC design. TSINGHUA UniGroup in addition to the acquisition of the China domestic chip manufacturing Spreadtrum and RDA Microelectronics in 2013, and the sales CEO Charles of Inotera join the TSINGHUA UniGroup and TSINGHUA UniGroup share the 25% stake of PTI that Taiwan IC packaging and testing house in 2015. TSINGHUA UniGROUP previously announced to acquire Micron, but there is no result and then they announced to share MediaTek recently and will contribute to merge with Spreadtrum and RDA, and threatened Taiwan's government if not open the China investment in Taiwan semiconductor will try to block Taiwan's semiconductor market in China, so abviously China to strengthen independent supply of the semiconductor can not be ignored. Taiwan IC design house face red supply chain and red capital market (red double effect), acquisitions, mergers, and poaching. It is the important topic how to think about the future and to open up new ideas.
Research design mainly adopt the viewpoint of Diamond Model to analyze and discuss the Fabless IC design house competitiveness between China and Taiwan,and industry cluster effect to analyze the future situation, and then AHP analysis model to make qualitative and quantitative analysis , so as to strengthen the analytical evidence. In addition, the selection will be several financial statements of listed Fabless IC design house at stock exchange market in Taiwan and China to analyze the actual financial situation, and depends on the analysis to judge the current status, possible crises and development situation in the future.
China Fabless IC design house with red supply chain and the China government fully support Fabless IC design industry will seriously impact the ecosystem of Taiwan Fabless IC design industry. This research is to analyze the competitiveness between China and Taiwan Fabless IC design house and the state may face in the future, and based on the analysis results give this industry the appropriate recommendations and possible future direction of development. The results of this research is that China Fabless IC design house rising will be the inevitable result because of strong domestic demand and strong government support. The factor conditions, demand conditions, related and supporting industries, and film strategy structure rivalry of Porter\ue2s Diamond Model to observe the results are shown the Diamond Model belongs to the positive cycle. That being so, it will be imperative and important how to deal with and face about this case
Plant age-related resistance to Ralstonia solanacearum, the causal agent of bacterial wilt.
No full textPredictors of treatment response and length of stay for inpatients with major depression.
No full textA Study Of Technology Transfer Mechanism For IC Packing Process
No full textThe current packaging trend toward smaller and thinner package has pushed the manufacturing technology to the limit. Due to fast development of encapsulation technology, the need for shortening factory time and upgrading technological ability are vital to promote companys\ue2 competitiveness. Most of IC packing factory are expanding resources to adapt on the technology development needs. Technology transfer methods are utilized to effectively cope with the technology trend.
This research takes technology suppliers, characters of the technology and receivers of technology as three major independent variables. In other words, the negative effect of the absorptive capacity can be reduced effectively by using proper technology transfer mechanism and thus achieving satisfactory performance. In the technology transfer process , in-depth factors other than existing procedures and rules are considered. This will affect the effectiveness and goals of the transfer. Besides, the technology characteristics and technology transfer performance are related to each other. The knowledge and ability to technology transfer with shorter gap between technology provider and accepter, help developing new products and improving management process with consolidated firm competitiveness and has become the significant theme of the 21st century.
Keyword: Technology transfer\ue3IC Packag
Fiber type and myosin heavy chain compositions of adult pretarsal orbicularis oculi muscle.
No full textToward an inner connection of SNe Ic, SLSNe Ic, XRF connected SNe, SNe Ic-BL, and GRB connected SNe
No full textType Ic supernovae can be classified as normal supernovae Ic, type Ic super-luminous supernovae, X-ray flash-connected supernovae, broad-line supernovae Ic, and gamma-ray burst-connected supernovae. Here we suggest an inner connection for all kinds of supernovae Ic which is based on whether a pair of jets are successfully launched: a normal supernovae Ic is a normal core collapsar without jets launched; a gamma-ray burst-associated supernovae Ic is a core collapsar with relativistic jets launched and successfully breaking out the envelope of the progenitor; an X-ray flash-associated supernovae Ic is a core collapsar with jets launched but can only develop a relativistic shock breakout; a broad-line supernovae Ic is an off-axis gamma-ray burst or an X-ray flash-associated supernova; and a type Ic super-luminous supernovae is close to the X-ray flash-connected supernovae Ic, but the shock breakout is not relativistic and most of the jet energy is deposited into the supernova component. Based on the luminosity-distance diagram, we derived the luminosity function of all different types of supernovae Ic as a whole. We also show that the normal supernovae Ic and gamma-ray burst-connected supernovae Ic have similar accumulative distributions.link_to_subscribed_fulltex
Innovative Design of Gravity Single Site IC Test Handler
No full textThe purpose of this research is to develop a systematic methodology for the innovative design of Gravity Single Site IC Test Handler. First, basic characteristics of Gravity Single Site IC Test Handler are deduced. Next, all possible variants of function structure are synthesized by using the functional analysis method. Next, a system of kinematic notation is used to generate the principle solutions of each function in a functional structure and all possible design concepts of Gravity Single Site IC Test Handler are created. Then, promising design concepts are evaluated by using the decision matrix method. Finally, feasible design concepts of Gravity Single Site IC Test Handler are provided, and then optimum Gravity Single Site IC Test Handler can be synthesized by using the theory of kinematic design. Based on the foreging, four innovative design conceps of Gravity Single Site IC Test Handler are created step by step. The results of this work are of benefit to the development and innovative design for new Gravity Single Site IC Test Handler\ue
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