1,721,513 research outputs found
From learning to partnership : multinational R&D cooperation in developing countries
No full textThis paper is a first attempt to analyse the determinants of inter-firm R&D agreements
between advanced and developing countries, i.e. between firms with asymmetric endowments
of knowledge. It shows that international dispersion of R&D activity by multinationals also concerns developing countries, particularly the NICs. Indeed, both our theory and empirical evidence show that R&D can be carried out via aml-length agreements, even between partners with asymmetric endowments of knowledge. The paper develops a theoretical model which
brings together some of the central assumptions of the literature on R&D cooperation and of the literature on hierarchical transfer of technology. A multinational has the option between
setting up a subsidiary and competing with a local firm in a duopoly, or implementing an
agreement and share monopoly profits. The two firms, if they choose the agreement, may also cooperate in R&D. The model shows that R&D cooperation increases both the profitability and the stability of the agreement. The latter as far as it affects the long term relationship of trust between the partners. The model also shows that R&D cooperation is more likely when
asymmetries in R&D efficiency between the partners are not loo large. Spillovers have an ambiguous role. They must be largc enough to induce firms to form an arm-length agreement, but if they are too large they discourage R&D cooperation. The empirical analysis is based on a data set of international arm-length agreements. By testing a dichotomous choice model it
supports some of the key theoretical results and assumptions: R&D agreements are particularly likely to emerge when firms have a nun-hierarchical relationship, in knowledge intensive industries and when technological asymmetries between home and host countries are not too large. Indeed most R&D agreements are concentrated in the NlCs which have relatively advanced industrial bases and capabilitie
Going Beyond Counting First Authors in Author Co-citation Analysis
Full text linkThe present study examines one of the fundamental aspects of author co-citation analysis (ACA) - the way co-citation
counts are defined. Co-citation counting provides the data on which all subsequent statistical analyses and mappings
are based, and we compare ACA results based on two different types of co-citation counting - the traditional type that
only counts the first one among a cited work's authors on the one hand and a non-traditional type that takes into
account the first 5 authors of a cited work on the other hand. Results indicate that the picture produced through this non-traditional author co-citation counting contains more coherent author groups and is therefore considerably clearer. However, this picture represents fewer specialties in the research field being studied than that produced through the traditional first-author co-citation counting when the same number of top-ranked authors is selected and analyzed. Reasons for these effects are discussed
Metallization and nanostructuring of semiconductor surfaces by galvanic displacement processes
No full textThe deposition of metals on semiconductors encompasses a broad range of technologically important processes, with applications ranging
from electronic devices to chemical sensors. Recent years have witnessed a surge of research activities in galvanic displacement processes on
semiconductor substrates. After a brief review of the fundamental aspects underlying galvanic displacement processes on semiconductor surfaces,
this paper discusses applications to micro- and nanoscale devices, including schemes developed for the metallization and nanopatterning of
semiconductor substrates with high selectivity and with optimal interfacial properties
Gold deposition by Galvanic displacement on semiconductor sufraces: effect of substrate on adhesion
No full textThin gold films are grown on Si and Ge substrates by galvanic displacement from fluoride-containing solutions.
The physical and chemical properties of the metal-semiconductor interface are characterized by a variety of
techniques, including photoelectron spectroscopy, atomic force microscopy, and electron microscopy. Displaced
gold films exhibit strong adhesion to germanium substrates but not to silicon. This behavior is explained by
the presence of a chemical bond at the Au-Ge interface, which is not observed in the Au-Si system. The
implications of these findings for semiconductor metallization by galvanic displacement methods are discussed
Selective metallization of silicon micromechanical devices
No full textA new wet process for selective copper deposition on silicon surfaces is employed to achieve conformal metallization of silicon
micromechanical devices. The method is based on galvanic displacement of the metal from a fluoride-containing bath. The plating
bath also comprises a complexing agent, a surfactant and an anti-stress additive. Surface passivation of the displaced Cu film is
effected by dodecanethiol self assembled monolayer coating. This surface passivation is found effective in reducing adhesion of
micro-electromechanical systems
EQUITY, DEVELOPMENT, AND CLIMATE CHANGE CONTROL
No full textThe paper analyzes the effects of different equity principles on the decision of developing
countries to join a world coalition whose aim is to control greenhouse gas emissions. A
game-theoretic framework is proposed to assess the incentives for different countries to sign
an international treaty on climate change control. Then, the effects of different equity rules
on these incentives are evaluated by using a dynamic integrated growth and climate model.
Policy proposals based on transfers from developed to developing countries are also analyzed
Adhesion evaluation of immersion plating copper films on silicon by microindentation measurements
No full textAdhesion of copper films on silicon is investigated by microindentation measurements. Load–displacement tests with loads in
the range of 1–1000 mN are performed on immersion plating copper films deposited on Si(100) from fluoride containing
solutions, with or without adhesion-promoting additives. The results are analyzed with the aid of a composite hardness model for
soft films on hard substrates. The composite Vickers microhardness is influenced by the adhesion of the copper film to the
substrate: stronger adhesion corresponds to higher composite hardness and more extended deformation zone at the filmysubstrate
interface. Thus, microhardness measurements provide a useful way to quantify the effect of solution additives (such as ascorbic
acid or sodium sulfite) and heat treatment on copper film adhesion, and to rank additives accordingly
Selective Deposition of Thin Copper Films onto Siliconwith Improved Adhesion
No full textA novel copper deposition method has been developed to plate silicon surfaces. Continuous copper films are obtained galvanically
on p- or n-type, single- or polycrystalline silicon. The films possess homogeneous structure, smooth surface, and improved adhesion
to the substrate. The plating bath comprises an aqueous solution containing a copper compound, ascorbic acid, ammonium fluoride,
and an antistress agent. With this process, the use of seed layers to improve adhesion between metal and semiconductor is avoided
Variations on the Author
Full text link“Variations on the Author” discusses two of Eduardo Coutinho’s recent films (Um Dia na Vida, from 2010, and Últimas Conversas, posthumously released in 2015) and their contribution to the general question of documentary authorship. The director’s filmography is characterized by a consistent yet self-effacing form of authorial self-inscription: Coutinho often features as an interviewer that rather than express opinions propels discourses; an interviewer that is good at listening. This mode of self-inscription characterizes him as an author who is not expressive but who is nonetheless markedly present on the screen. In Um Dia na Vida, however, Coutinho is completely absent form the image, while Últimas Conversas, on the contrary, includes a confessional prologue that moves the director from the margins to the center of his films. This article examines the ways in which these works stand out in the filmography of a director who offers new insights into the notion of cinematic authorship
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