1,721,013 research outputs found
Going Beyond Counting First Authors in Author Co-citation Analysis
Full text linkThe present study examines one of the fundamental aspects of author co-citation analysis (ACA) - the way co-citation
counts are defined. Co-citation counting provides the data on which all subsequent statistical analyses and mappings
are based, and we compare ACA results based on two different types of co-citation counting - the traditional type that
only counts the first one among a cited work's authors on the one hand and a non-traditional type that takes into
account the first 5 authors of a cited work on the other hand. Results indicate that the picture produced through this non-traditional author co-citation counting contains more coherent author groups and is therefore considerably clearer. However, this picture represents fewer specialties in the research field being studied than that produced through the traditional first-author co-citation counting when the same number of top-ranked authors is selected and analyzed. Reasons for these effects are discussed
Variations on the Author
Full text link“Variations on the Author” discusses two of Eduardo Coutinho’s recent films (Um Dia na Vida, from 2010, and Últimas Conversas, posthumously released in 2015) and their contribution to the general question of documentary authorship. The director’s filmography is characterized by a consistent yet self-effacing form of authorial self-inscription: Coutinho often features as an interviewer that rather than express opinions propels discourses; an interviewer that is good at listening. This mode of self-inscription characterizes him as an author who is not expressive but who is nonetheless markedly present on the screen. In Um Dia na Vida, however, Coutinho is completely absent form the image, while Últimas Conversas, on the contrary, includes a confessional prologue that moves the director from the margins to the center of his films. This article examines the ways in which these works stand out in the filmography of a director who offers new insights into the notion of cinematic authorship
Appropriate Similarity Measures for Author Cocitation Analysis
Full text linkWe provide a number of new insights into the methodological discussion about author cocitation analysis. We first argue that the use of the Pearson correlation for measuring the similarity between authors’ cocitation profiles is not very satisfactory. We then discuss what kind of similarity measures may be used as an alternative to the Pearson correlation. We consider three similarity measures in particular. One is the well-known cosine. The other two similarity measures have not been used before in the bibliometric literature. Finally, we show by means of an example that our findings have a high practical relevance.information science;Pearson correlation;cosine;similarity measure;author cocitation analysis
Integrated resonant magnetic field sensor
No full textElectrical Engineering, Mathematics and Computer Scienc
Dispelling the Myths Behind First-author Citation Counts
Full text linkWe conducted a full-scale evaluative citation analysis study of scholars in the XML research field to explore just how different from each other author rankings resulting from different citation counting methods actually are, and to demonstrate the capability of emerging data and tools on the Web in supporting more realistic citation counting methods. Our results contest some common arguments for the continued
use of first-author citation counts in the evaluation of scholars, such as high correlations between author rankings by first-author citation counts and other citation
counting methods, and high costs of using more realistic citation counting methods that are not well-supported by the ISI databases. It is argued that increasingly available digital full text research papers make it possible for citation analysis studies to go beyond what the ISI databases have directly supported and to employ more
sophisticated methods
Low-Cost and Low-Temperature Integration Methods for System-in-Package
No full textPackaging has evoluted for years with the sole purpose of protecting the electronics from the environment and providing a suitable operating environment. Integration became a necessity and technologies as System-in-Package emerged and enabled the integration of components built with different technologies within a single package. All this evolution lead to technologies as Wireless Sensor Networks (WSNs), networks composed of nodes which at the time contain sensors to monitor environmental variables like temperature, humidity, pressure, location, etc. in different locations at the same time. The nodes communicate the obtained data to a main location or share it with nearby nodes. WSNs are the perfect example of a technology that requires a SiP approach since it is composed by an antenna and a radio chip to provide communication skills, one or more sensors to provide sensing skills, a microcontroler to provide processing capabilities and a battery to provide electrical energy to the system. New technologies create new needs. In the areas of logistics and asset management those new needs will be created by the technology proposed in the PLEISTER (Packaged Label Electronics Including Sensing Talkative Enhanced Radio). This thesis is the product of working on low-temperature and low-cost packaging solutions for the PLEISTER project. In the vision of the PLEISTER project, a group of Wireless Sensor Network nodes can form a self-contained network capable of monitoring itself; that is to say, if a node joins/leaves the network, this will be noticed automatically and reported to other nodes. Furthermore, the network can sense and monitor status information as location, temperature, humidity, among others. In addition, the methods proposed and developed within the frame of the PLEISTER project are extended for their application on packaging solutions for microfluidics. Accelerated testing is used to test the compatibility of the different materials used within determined packaging solution and accelerate the possible failures. Failure analysis techniques are used to locate and analyse the failures. What concerns the Wireless Sensor Network nodes, the packaging solutions are developed from two points of view, the practical approach and the research approach. The practical approach uses technologies already tested and available in the market to propose a packaging solution while the research approach investigates the use of new methods to propose a packaging solution for WSN nodes. Two topics are developed during the research approach: the use of Electrically Conductive Adhesives (ECAs), as a replacement for ultrasonic welding and soldering, to electrically and mechanically attach the Li-ion batteries to the electronics, and the use of inkjet printing technology to print interconnection lines directly on top of the battery and therefore replace the substrate material by the battery. What concerns the ECAs, the contact resistance of glued bonds is higher than the contact resistance of welded bonds. When welding, the oxide layer of the material is completely removed and when gluing, the oxide layer is not totally removed due to the instant contact of the surface with oxygen prior to gluing and after removing the oxide. When low-temperatures are desired during the fabrication process and welding is not possible, gluing is a good option. If used for long time, the contacts corrode due to the presence of humidity and the composition of the joined materials (aluminum and silver) causing an increase in the contact resistance; however, biased tests prove that the increased contact resistance may not be a problem, depending on the currents required by the application. Furthermore, inkjet printing of reliable interconnection lines directly on Li-ion batteries is possible. The packaging foil from the Li-ion battery presented in this work is hydrophobic and therefore a plasma treatment is desired to improve the wettability of the surface. Silver inks present good electrical performance, the resistivity and microstructure is not affected by different ageing processes and there is no indication of silver migration; however, the adhesion can be improved and optimized according to the ink-substrate combination to be used. The application requires inks that cure at less than 155 °C; the lines must be printed before forming the battery. UV curable or room temperature curable inks are desired; in this case, the lines can be printed after forming the battery. In the second part, packaging solutions for microfluidic applications are developed. A packaging concept to integrate electronics and nano/microfluidic chips in one device is developed. For this, the use of PCB material as substrate and mechanical support for the chips is suggested. The use of TMMF dry film resist to create channels on top of the PCB material and chips is proposed. The inlaying of the chips in the PCB material is experimentally researched as well as the lamination of the microfluidic channels. Furthermore, inkjet printing is used to print electrical interconnection lines from the pads on the chip to the tracks on the PCB. Inlaying the chips in the PCB is the most critical part of the process, the chip and the PCB have to be at the same level and the space between the chip and the PCB must be controlled to ensure that the profile of the surface on which the channels and interconnection lines are fabricated, is as flat as possible. The printed lines should be printed before laminating the channels since the ink cures at 125 °C. UV inks and room temperature curing inks are desired. Laminating TMMF channels is possible, however the baking temperatures during the fabrication process need to be ramped slowly to avoid cracks in the TMMF laminated over the chips. Furthermore, since the channels are wide (more than 500 µm), the sealing of the channels has to be performed at room temperature; this causes a weak seal and thus the devices should be used carefully. The integration methods developed and researched in this thesis can be expanded to a broad range of applications.Electronic InstrumentationElectrical Engineering, Mathematics and Computer Scienc
Bio-fuel Composition Sensing: Multi domain spectroscopy to determine the composition of bio-fuel mixtures
No full textElectrical Engineering, Mathematics and Computer ScienceMicroelectronicsElectronic Instrumentatio
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