International Linear Collider
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Associated production of and , including their EFT interpretation
No full textA summary of recent ATLAS measurements of associated top production at the LHC is presented including inclusive and differential SM cross-sections. Many results are either improvements over ones made previously or make novel observations. These processes also provide limits on new physics characterised by EFT operators
The role of strangeness in heavy-quark hadronisation from small to large collision systems with ALICE
No full textProduction measurements of strange hadrons originating from the hadronisation of charm quarks (prompt) and from beauty-hadron decays (nonprompt) offer a unique tool to study the heavy-quark hadronisation across different collision systems. This contribution discusses the final results of the ALICE Collaboration obtained by measuring strange D mesons in pp, p–Pb, and Pb–Pb collisions collected during the LHC Run 2. The first measurement of the production of orbitally excited charm-strange mesons in pp collisions is also reported. Additionally, the production measurements of prompt Ds+ mesons are compared to those of non-strange mesons across the different collision systems, along with the measurement of non-prompt Ds+ mesons in heavy-ion collisions. Lastly, the first studies of strange and non-strange D mesons using the large data sample of pp collisions at √s = 13.6 TeV harvested from the start of LHC Run 3 are presented
A New Stress-Relieving Layer in ATLAS ITk Strip Detector Modules
No full textThe Inner Detector system of the ATLAS detector is being entirely replaced with a new all-silicon detector known as the Inner Tracker (ITk) to prepare for high particle-rate conditions at the High Luminosity LHC. The innermost layers of the ITk will be composed of silicon pixels, while the outer layers will consist of silicon strips. The basic building block of the ITk Strip detector is the “module,” composed of front-end electronics glued to a silicon microstrip sensor. A critical problem was encountered during pre-production of ITk Strip modules wherein some silicon sensors crack due to thermal stresses when mounted to local support structures and brought to cold operating temperatures. A potential solution is being trialed in which the modules are redesigned to include a new layer of soft glue between the front-end electronics and the silicon sensor to absorb thermal stresses. This redesign necessitates a new R&D phase of the project, during which new modules must be assembled and proven to satisfy quality assurance and quality control criteria before ITk Strip modules can proceed to production. This presentation explores the technical challenges of incorporating the stress-relieving layer into the module assembly process, and evaluates the impact of the redesign on prototype modules. Results from quality assurance and quality control testing are shown
