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    4170 research outputs found

    Mathematische Modelle und operatives Cost Engineering

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    Semesterbegleitendes Lernen und Prüfen mit digitalen Aufgaben in der Mathematik

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    In diesem Beitrag werden digitale Übungsaufgaben und digitale Prüfungen als ein zukunftsorientiertes Lehr-Lernszenario vorgestellt. Die Möglichkeiten digitaler Übungsaufgaben generell und im speziellen mit STACK (Sangwin, 2013) werden aufgezeigt und diskutiert. Insbesondere werden das Konzept und die Durchführung einer digitalen semesterbegleitenden Prüfung für die Ingenieur-Mathematik mit drei Komponenten im Sommersemester 2024 vorgestellt. Die Ergebnisse sowie eine Befragung der Studierenden zu dieser Prüfungsform werden dargestellt und analysiert

    Emission Testing of Flex Fuel Vehicles up to M100/E100: Upgradation of Existing Test Facility for Vehicles below 3.5-ton GVW for Testing Methanol or Ethanol Operated Vehicles

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    This paper is focused on enhancing the existing dilute emission measurement system to accommodate the emission testing of vehicles operating with gasoline blends with methanol and ethanol, dedicated M100/E100 etc. India is moving towards achieving the E20 blend on the pan-country level by April 2025 with the initiations of NITI Aayog and exploring alternate fuels like 100% methanol and ethanol. Government of India is now focused on introducing the flex fuel vehicle (FFV) technology that supports the usage of higher ethanol blends. As per CMVR guidelines for M and N category vehicles with a gross vehicle weight less than 3,500 kg; a dilute emission measurement system is used to evaluate tailpipe pollutants and fuel economy. Most of the present emission systems are compatible with testing the vehicle till M15 and E20 blends. Beyond this percentage, usage of a test facility for M100, E100, and other flex-fuel vehicles, require certain modifications in existing test facility to maintain the precision and reliability of the results considering higher water content in exhaust and effect of condensation on emission measurement due to dilution. The modifications needed, implementation and their impact are experimentally briefed in the present paper

    GMP3: Learning-Driven, Bellman-Guided Trajectory Planning for UAVs in Real-Time on SE(3)

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    We propose GMP3, a multiphase global path planning framework that generates dynamically feasible three-dimensional trajectories for unmanned aerial vehicles (UAVs) operating in cluttered environments. The framework extends traditional path planning from Euclidean position spaces to the Lie group SE(3), allowing joint learning of translational motion and rotational dynamics. A modified Bellman-based operator is introduced to support reinforcement learning (RL) policy updates while leveraging prior trajectory information for improved convergence. GMP3 is designed as a distributed framework in which agents influence each other and share policy information along the trajectory: each agent refines its assigned segment and shares with its neighbors via a consensus-based scheme, enabling cooperative policy updates and convergence toward a path shaped globally even under kinematic constraints. We also propose DroneManager, a modular ground control software that interfaces the planner with real UAV platforms via the MAVLink protocol, supporting real-time deployment and feedback. Simulation studies and indoor flight experiments validate the effectiveness of the proposed method in constrained 3D environments, demonstrating reliable obstacle avoidance and smooth, feasible trajectories across both position and orientation. The open-source implementation is available at https://github.com/Domattee/DroneManager

    Sintering for High Power Optoelectronic Devices

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    Residual-free eutectic Au80Sn20 soldering is still the dominant assembly technology for optoelectronic devices such as high-power lasers, LEDs, and photodiodes. Due to the high cost of gold, alternatives are desirable. This paper investigates the thermal performance of copper-based sintering for optoelectronic submodules on first and second level to obtain thermally efficient thin bondlines. Sintered interconnects obtained by a new particle-free copper ink, based on complexed copper salt, are compared with copper flake and silver nanoparticle sintered interconnects and benchmarked against AuSn solder interconnects. The copper ink is dispensed and predried at 130 °C to facilitate in situ generation of Cu nanoparticles by thermal decomposition of the metal salt before sintering. Submounts are then sintered at 275 °C for 15 min under nitrogen with 30 MPa pressure, forming uniform 2–5 µm copper layers achieving shear strengths above 31 MPa. Unpackaged LEDs are bonded on first level using the copper ink but applying only 10 MPa to avoid damaging the semiconductor dies. Thermal performance is evaluated via transient thermal analysis. Results show that copper ink interfaces approach the performance of thin AuSn joints and match silver interconnects at second level. However, at first level, AuSn and sintered interconnects of commercial silver and copper pastes remained superior due to the relative inhomogeneous thickness of the thin Cu copper layer after predrying, requiring higher bonding pressure to equalize surface inhomogeneities

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