Archivio della ricerca - Fondazione Bruno Kessler
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Joséphine Bakhita (1869-1947) : la dernière esclave noire en Italie, la première sainte africaine de l’Église catholique
No full textApplication of Agave Silk Fibers in Sustainable and Flexible Electronics
No full textDeveloping novel biodegradable substrates for electronics is crucial for reducing e-waste, minimizing environmental impact, and promoting sustainable resource use. Here, for the first time, we report the use of Agave silk fibers (ASFs) in sustainable and flexible electronics. Morphological characterization was carried out on the obtained ASFs-based substrate, showing an average thickness of 83 μ and an average roughness (Ra) of 2.6 μ, with the silk fibers composing the substrate having an average length and width of 243.8 μ and 26.2 μ respectively. Biodegradability tests showed that the substrate fully degraded after 2 days and 7 hours in water. As a proof of concept, a copperbased resistance temperature detector (RTD) was fabricated and thermally characterized. The electrical characterization showed a sensitivity of 0.26 %° C-1 and 0.24 ° C-1 during heating and cooling, respectively. To evaluate the repeatability of the sensors, 10 cycles of heating (55° C) and cooling (25° C) were carried out, showing stable behavior for 7 h. To confirm the mechanical stability of the device, bending tests were performed, showing a stable resistance of the RTD at different bending radi
Point-of-Care Sensor for the Electrochemical Detection of miRNA Biomarker of Alzheimer’s Disease
No full textThe analysis of microRNA (miRNA or miR-) expression profile is very appealing in the biomedical field since it allows to explore at a molecular level the onset and progression of different human diseases. Numerous miRNAs in literature have been identified as important biomarkers of a series of neurological disorders mostly concerning Alzheimer’s disease (AD), the most diffused neurodegenerative disorder having a tremendous impact on our society. So far, there is no evidence of accurate, sensitive, and non-invasive diagnostic solutions able to provide precise diagnosis and adequate therapies. The study of miRNA profiles, however, opens towards a new frontier of diagnostics by which it would be possible to screen and predict AD at an early stage, making therapies more effective against the pathological onset. Moreover, the importance of using miRNAs as biomarkers is exploited by the fact that many of them are free to circulate in the bloodstream, thus, simplifying the genetic material extraction and facilitating the sensing technology integration into PoC devices and opening to the possibility of decentralizing AD screening. In this work, we present the development and characterization of a portable electrochemical sensor for the accurate and sensitive detection of a microRNA associated with the human AD, in a Point-of-Care (PoC) format
Fabrication of conductive graphitic layers in diamond by multi-species focused ion beam
No full textIn this work, we report a systematic study to produce controlled layers of graphite on ‘electronic grade’ diamonds by ion implantation using a multi-species column FIB equipment. The liquid metal alloy ion source (LMAIS) allowed to select among Au++, Ge++ and Si++ species with implant energy of 70 keV. In particular, the process window was defined for each ion species in terms of ion fluence and thermal annealing recipe, identifying the carbon phases by Raman spectroscopy and measuring the developed topographies by atomic force microscopy, before and after a selective etching. Due to the mass difference, different graphite thicknesses were achieved, ranging from 40 to 90 nm. Another possibility is to exploit the selective etching coupled to FIB irradiation for a direct patterning of the diamond surface6, a process in principle able to create nanometric structures embedding CC
Development and production of advanced 3D pixel sensors at FBK
No full textThe increase in luminosity at the HL-LHC has led to the need for both increased radiation resistance in particle sensors, along with the need for timing capabilities, and lastly, to an increase in the granularity of vertex detectors. 3D detectors have an inherent good resistance to radiation damage that have allowed, after several years of R&D, to push their radiation hardness up to the maximum fluences of interest for HL-LHC (~2×1016 neq/cm2). In recent years, FBK has introduced several technological variations to reduce sensor pitch and improve timing performance. Specifically, regarding the reduction in pitch, the use of stepper-based lithography instead of mask aligner has allowed a significant improvement in the definition of critical details and process yield. This technology is currently used at FBK for the production of 3D pixel detectors for both ATLAS and CMS. To improve time resolution performance, a 3D trench-based detector, rather than one based on columns, has been introduced. Due to a more uniform electric field and weighting field distribution within the active volume, these sensors have indeed shown outstanding results in terms of timing resolution, close to 10 ps. The talk will illustrate an overview of technological aspects as well as initial measurements on 3D-column production batches and a batch of 3D trenches fabricated in the AIDA Innova project
Flexible Techniques of Medium to Small Pitch 3D and 2.5D Integration for Prototypes and Small-Scale Production
No full textIn a research facility, we often face the task of testing a single idea or concept which is especially
challenging in the field of semiconductor microfabrication as the majority of the activities typically require full-wafer processing. The process steps that require the best accuracy can only be performed on an entire wafer, making prototype development complex and resource-intensive. To bridge the gap between initial concepts and full-wafer production, we have established a roadmap to introduce technologies that enable efficient prototype fabrication and small-scale production. In the field of 3D and 2.5D integration technologies, we are focusing on electroless deposition of nickel, palladium, and gold to form under-bump metallization (UBM) layers suitable for solder material deposition. As the next step, we will incorporate two key technologies for solder deposition: (1) Solder ball laser placement system – that deposits preformed solder balls of arbitrary composition, ranging in size from 30 μm to 250 μm; and (2) Solder ink printing system – that dispenses solder ink of arbitrary composition, with a maximum solid particle size of approximately 5 μm. Both systems use single-spot, one-by-one deposition, inherently limiting production to low volumes. However, this limitation is also advantageous when only a small number of prototypes are needed, as neither technology requires
lithography or full-wafer access. Moreover, these technologies support a wide range of bump sizes and interconnection pitches, from 50 μm to approximately 1 mm. The final steps of the planned 3D integration are flip chip bonding (thermocompression or thermo-sonic compression) and finally wire bonding. As a result, our back-end line shall be able to bond chips with highly variable integration sizes - an essential capability for research activities that demand diverse product integration requirements
Investigation of Beta Decays Using a Radioactive Source Deposited on the SDD Surface
No full textThe interest in beta decays has significantly increased over the last decade. The ASPECT-BET project employs a dual-channel spectrometer using Silicon Drift Detectors (SDDs) to perform high precision measurements of these transitions over a broad energy range (from 10 keV up to 1 MeV). The instrument has already been characterized using a 55Fe radioactive source, ensuring a good energy resolution (below 200 eV) at the Mn-Kα (5.9 keV) fluorescence line when properly
cooled