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[[alternative]]A Study and Discussion of Three Erhu Textbooks
No full text[[abstract]]二胡在中國傳統樂器中，一直佔有十分重要的地位。但是長久以來對於二
胡的教學方式及其教材的內容一直沒有作過有系統且深入的整理，以致二
胡教學無法在音樂教學上同其它的西洋樂器一般有完整的教學課程。本文
主旨在於有系統的研究《劉天華南胡全集》、張韶的《二胡廣播教學講座
》及王國潼、趙寒陽的《二胡基礎教程》等三本二胡教材的練習曲。分析
各練習曲調性、拍號、節奏、技巧等方面的特色，並就個人多年二胡學習
及教學的經驗，對其提出練習重點的建議，使二胡教學者及學習者得以簡
便、清楚的瞭解此三本教材的重要內容。在分析、整理二胡教材之後，筆
者以多年學習中國傳統樂器（二胡、琵琶）及西洋樂器（鋼琴、小提琴）
的體驗，針對目前二胡教材容易出現缺失之處提出建議，以期能作為二胡
教學者選擇教材的參考。
Erhu has been playing an important role in traditional Chinese
instrumental music. However, during such a long span of time,
there was always a lack of systematic and thorough research in
the teaching method comparison with thatof Western instruments.
The main purposes of this thesis is tack a close examination
towards the three major textbooks of Erhu: The Complete work of
Lieu Tien Hua; A Compiled Lesson for Erhu in Broadcasting
Teaching Program byChang Shao; Fundamental Teaching for Erhu by
Wang Guo Dong and Chao Huan Yang - by analyzing the
characteristics of keys; beats; rhythms; scales; techniques
ineach chosen lesson. Thus leads a better understanding towards
these textbooks and also provides a clearer view for teachers
and students. After examined thoroughly these three textbooks,
the author, with years of learning and teaching experience in
both traditional Chinese and Western instruments, proposes
some of his opinions and solutions toward these exercises; and
hopefully provides a new reference for learners in selecting
their studying materials.
Erhu has been playing an important role in traditional Chinese
Reworkable Epoxy Underfill Encapsulants
No full textA reworkable epoxy underfill encapsulant is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. A preferred embodiment of the encapsulant includes: a cycloaliphatic diepoxide; an organic hardener; a curing accelerator; a silica filler; and an additive, with the additive providing thermal reworkability to the composition. A method is also provided for forming the aforementioned reworkable epoxy underfill encapsulants.Georgia Tech Research Corporatio
Joining Electroconductive Materials With Electroconductive Adhesive Containing Epoxide-modified Polyurethane
No full textA method of joining electrically conductive materials comprises: Applying an electrically conductive adhesive to at least one electrically conductive material(s), wherein the electrically conductive adhesive is prepared from an epoxide-modified polyurethane, a cross-linking agent, an adhesion promotor and a conductive filler; andjoining the electrically conductive material(s) with the applied adhesive to a substrate and curing the adhesive.Georgia Tech Research Corp
Highly Conductive Electrically Conductive Adhesives
No full textThe present invention provides for a relatively simple method to decrease the electrical resistivity of conductive adhesives by in-situ nanoparticle formation and sintering using a reducing agent. The reducing agent was found to cause sintering within the conductive adhesive by facilitating the reduction of the silver salts of fatty acids on the surface of silver flakes, leading to the formation of nano-/submicron-silver necks. These silver necks bridge neighboring silver flakes, decreasing the contact resistance between flakes within the conductive adhesives. The reducing agent also removes at least a portion of the lubricant commonly found on silver flakes used in conductive adhesives, thus reducing the tunneling resistance between the silver flakes.Georgia Tech Research Corporatio
Reworkable High Temperature Adhesives
No full textA reworkable high temperature adhesive, comprising the reaction product of (a) a thermoplastic adhesive selected from the group consisting of polyetherimides, polyamide-imides, polysulfones, polyethersulfones, silicon-carbon thermosets, polyphenylene sulfides and mixtures thereof; (b) a metal acetonate; (c) an epoxy resin; (d) a crosslinker; (e) and a catalyst.Georgia Tech Research Corporatio
Structures Including Carbon Nanotubes, Methods Of Making Structures, And Methods Of Using Structures
No full textEmbodiments of the present disclosure include structures including a layer of carbon nanotubes, methods of making structures including a layer of carbon nanotubes, and the like.Georgia Tech Research Corporatio
High Dielectric Polymer Composites And Methods Of Preparation Thereof
No full textPolymer composites and methods of making the polymer composites are presented. A representative polymer composite includes a polymer resin and a conductive material, wherein the polymer composite is characterized by a dielectric constant greater the 200. A representative method of making the polymer composite can be broadly summarized by the following steps: providing a polymer resin and a conductive material; mixing the polymer resin and the conductive material; and forming the polymer composite, wherein the polymer composite is characterized by a dielectric constant greater than 200.Georgia Tech Research Corporatio
No-flow Reworkable Epoxy Underfills For Flip-chip Applications
No full textA no-flow reworkable epoxy underfill is provided for use in an electronic packaged system which incorporates an integrated circuit, an organic printed wire board, and at least one eutectic solder joint formed therebetween. An exemplary embodiment of the encapsulant includes: a cycloaliphatic epoxide; an organic hardener; a curing accelerator; and a fluxing agent wherein said cycloaliphatic epoxide includes a carbonate or carbamate group. The encapsulant can also include a filler, such as a silica filler. A method is also provided for forming the aforementioned reworkable epoxy underfills.Georgia Tech Research Corp
Process And Material For Low-cost Flip-chip Solder Interconnect Structures
No full textThe present invention provides a novel process and its required fluxable materials for building low-cost flip-chip interconnect structures. The novel process involves two fluxable materials, fluxable wafer-level compressive-flow underfill material (WLCFU) and fluxable tacky film, and applies these two materials on a wafer level. The two materials can provide sufficient fluxing capability during solder reflow and significant improvement of the fatigue life of the formed solder interconnects after fully cured.Georgia Tech Research Corp
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