3,465 research outputs found
Development and evaluation of a-SiCO:H films as Cu and moisture diffusion barriers with a low dielectric constant, for advanced interconnects
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Impact of wavelength of UV light and UV cure time on chemical and mechanical properties of PECVD deposited porous ultra low-k films
No full textInfluence of the UV cure on advanced plasma enhanced chemical vapour deposition low-k materials
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Impact of UV cure time and wavelength on chemical, mechanical and electrical properties of PECVD deposited porous ultra low-k films
No full textDevelopment and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects
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