1,720,980 research outputs found
Narrow pitch dual damascene patterning using EUV lithography in association with a spin-on trilayer resist system
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Patterning of 25nm contact holes at 90nm pitch: combination of L/S double exposure immersion lithography and plasma-assisted shrink technology
No full textEtch challenges of a spin-on trilayer resist system for narrow pitch dual damascene patterning
No full textPatterning capabilities of 40-nm contact holes at 80-nm pitch: EUV vs. Line/Space double exposure immersion lithography
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Printing the contact and metal layers for the 32 and 22 nm node: comparing positive and negative development process
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