1,721,003 research outputs found
TiN metal hardmask etch residues removal on advanced porous low-k and Cu device with corner rounding scheme
No full textDevelopment of an all-in one wet single wafer process for 3D-SIC bump integration and its monitoring
No full textOne micron damascene redistribution for fan-out wafer level packaging using a photosensitive dielectric material
No full textESH solvent for stripping positive and negative photoresists in 3D-WLP and 3D-SIC applications
No full textESH friendly solvent for stripping positive and negative photoresists in 3D-wafer level packaging and 3D-stacked IC applications
No full textScaling the 3D bumps pitch from 20 to 10 μm, focusing on the wet Cu seed etch process development
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Screening and evaluation of different wet cleaning solution for post etch residue removal in BEOL applications
No full textAll-wet removal of post-etch photoresist and sidewall residues: Electrical characterization of 90 nm and 30 nm ½ pitch structures
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