4 research outputs found
Middle powers in Mongolia : a comparative perspective
No full textAuthor: Mendee Jargalsaikhan (PhD), Sainbuyan Munkhbat (MA) ; Friedrich-Ebert-Stiftung Mongolia & Mongolian Institute for Innovative Policie
Divergence of East Asians and Europeans Estimated Using Male- and Female-Specific Genetic Markers
No full textTo study themale and female lineages of East Asian and European humans, we have sequenced 25 short tandem repeat markers on 453 Y-chromosomes and collected sequences of 72 complete mitochondrial genomes to construct independent phylogenetic trees for male and female lineages. The results indicate that East Asian individuals fall into two clades, one that includes East Asian individuals only and a second that contains East Asian and European individuals. Surprisingly, the European individuals did not form an independent clade, but branched within in the East Asians. We then estimated the divergence time of the root of the European clade as ~41,000 years ago. These data indicate that, contrary to traditional views, Europeans diverged from East Asians around that time. We also address the origin of the Ainu lineage in northern Japan. © The Author(s) 2014.1
Communication-Fabrication of a Uniformly Tin-Coated Three-Dimensional Copper Nanostructured Architecture by Electrodeposition
No full textA three-dimensional copper nanostructure architecture (3DC1) coated uniformly with a tin film was fabricated by electrodeposition. In these trials, a pyrophosphate bath was used for tin plating, and the effects of polyethylene glycol and formaldehyde additives on the morphology of the deposited tin were investigated. Relatively large tin particles were electrodeposited in an inhomogeneous manner over the 3DC1 surface when using a plating bath without additives. In contrast, 3DC1 coated with a uniformly thick tin film was fabricated by employing a bath with the additives. (C) The Author(s) 2015. Published by ECS.ArticleJOURNAL OF THE ELECTROCHEMICAL SOCIETY. 163(2):D54-D56 (2016)journal articl
Communication-Fabrication of a Uniformly Tin-Coated Three-Dimensional Copper Nanostructured Architecture by Electrodeposition
No full textA three-dimensional copper nanostructure architecture (3DC1) coated uniformly with a tin film was fabricated by electrodeposition. In these trials, a pyrophosphate bath was used for tin plating, and the effects of polyethylene glycol and formaldehyde additives on the morphology of the deposited tin were investigated. Relatively large tin particles were electrodeposited in an inhomogeneous manner over the 3DC1 surface when using a plating bath without additives. In contrast, 3DC1 coated with a uniformly thick tin film was fabricated by employing a bath with the additives. (C) The Author(s) 2015. Published by ECS.ArticleJOURNAL OF THE ELECTROCHEMICAL SOCIETY. 163(2):D54-D56 (2016)journal articl
