1,721,020 research outputs found
Noise coupling mitigation in PWR/GND plane pair by means of photonic crystal fence: Sensitivity analysis and design parameters extraction
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Analysis of Radiated Emissions and Shielding Effectiveness for a metallic Enclosure with Shielding Springs
No full textThe high speed digital processing in modern electronic products has made more difficult the achievement of conformity about limits emissions. To verify the requirements of standards on these emissions the use of a metallic enclosure is often necessary: in this way the power radiated by the system is reduced. In this paper the radiated emissions and the shielding performance of a metallic rack with shielding springs are studied both by dedicated experiments and by simulations. An internal source represented by a loaded monopole antenna is used to investigate the radiated emissions at 3 meters from the box. A simplified model of the antenna is proposed in the numerical model and a good agreement over a frequency range up to 1 GHz is achieved between measured results and simulated results. Shielding Effectiveness is finally evaluated by means of two different kinds of source: 1) near field (internal source) and 2) far field (plane wave source)
Experimental validation of circuit models for bulk current injection (BCI) test on shielded coaxial cables
No full textIn order to validate, by means of measurement, some existing equivalent circuit models for the bulk current injection (BCI) test, a procedure is proposed to develop a proper circuit model for the injection clamp and the obtained circuit is introduced into the global one representing the overall cable. A suitable experimental set-up has been built and used. The measured induced voltages at the terminations of shielded coaxial cables are compared with those computed by the equivalent circuit. Upper and lower bounds are quantified in order to assess the order of accuracy of the predicted result
Characterization of via holes discontinuities by means of numerical de-embedding
No full textA method for de-embedding scattering parameters S of via hole in multilayer printed circuit board is presented. By assuming that the via hole is not electromagnetically coupled with the adjacent lines, the scattering parameters are evaluated starting from the calculation of the transfer scattering matrix T obtained by a three dimensional full wave analysis of the test structure. The numerical approach used to obtain S and T parameters has been validated by comparison with results computed by other independent numerical methods and measurements. The proposed methodology allows a computational time saving and gives useful results for a CAD modeling of via hole discontinuities
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