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1,721,054 research outputs found

Electrochemical nucleation and growth of copper

Author: Radisic Alex
Publication venue
Publication date: 31/12/9999
Field of study

imec Publications (Interuniversity Microelectronics Centre)

Electrodeposition of interconnects for microelectronics and bio-medical applications

Author: Radisic Alex
Publication venue
Publication date: 01/01/2012
Field of study

imec Publications (Interuniversity Microelectronics Centre)

Direct copper plating

Author: Vereecken Philippe
Radisic Alex
Publication venue
Publication date: 01/01/2014
Field of study

imec Publications (Interuniversity Microelectronics Centre)

Island growth in electrodeposition

Author: Hoffmann Peter
Oskam Gerko
Searson Peter
Guo Lian
Radisic Alex
Publication venue
Publication date: 01/01/2011
Field of study

imec Publications (Interuniversity Microelectronics Centre)

FIB/SEM structural analysis of through-silicon-vias

Author: Drijbooms Chris
Bender Hugo
Radisic Alex
Publication venue
Publication date: 01/01/2011
Field of study

imec Publications (Interuniversity Microelectronics Centre)

FIB/SEM structural analysis of through-silicon-vias

Author: Drijbooms Chris
Bender Hugo
Radisic Alex
Publication venue
Publication date: 01/01/2011
Field of study

imec Publications (Interuniversity Microelectronics Centre)

High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

Author: Druais Gael
Fischer P.
Luhn Ole
Zahraoui S.
Guidotti E.
Dilliway G.
Radisic Alex
Publication venue
Publication date: 01/01/2008
Field of study

imec Publications (Interuniversity Microelectronics Centre)

The bottom-up copper fill of Ø5μm × 40μm vias using 2-component model

Author: Drijbooms Chris
Bender Hugo
Yang Liu
Radisic Alex
Publication venue
Publication date: 01/01/2012
Field of study

imec Publications (Interuniversity Microelectronics Centre)

Differential inhibition during Cu electrodeposition on Ru: combined electrochemical and real-time TEM studies

Author: Vereecken Philippe
Radisic Alex
Ross Frances
Publication venue
Publication date: 01/01/2019
Field of study

imec Publications (Interuniversity Microelectronics Centre)

High aspect ratio via metallization for 3D integration using CVD TiN barrier and electrografted Cu seed

Author: Druais Gael
Palmans Roger
Fischer P.
Dilliway Gabriela
Bureau C.
Guidotti E.
Radisic Alex
Publication venue
Publication date: 01/01/2008
Field of study

imec Publications (Interuniversity Microelectronics Centre)

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