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3D heterogeneous integration – enabling functionality improvements through advanced packaging
Overlay challenges in 3D heterogeneous integration
The authors wish to acknowledge the support of their work from ECSEL-JU project IT2 under grant agreement 875999 and the contribution of multiple colleagues at KLA: Oreste Donzella, Chet Lenox, Vinayak Pandey, Kara Sherman, Franz Zach, Motti Penia, Arkady Simkin, Dror Elka, Avner Safrani, Eitan Hajaj, and others
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