1,721,049 research outputs found
Solid state diffusion of Cu-Sn and Ni-Sn diffusion couples with-flip chip scale dimensions
No full textImpact of intermetallic formation and electro-migration on the integrity of bumped Cu/low-k Die
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Nanohardness study of CoSn2 intermetallics layers formed between Co UBM and Sn flip-chip solder joints
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