1,721,053 research outputs found
Electrochemical deposition of indium from chloride bath for low-temperature microbump bonding
Full text linkThis research was supported by the MOTIE (Ministry of Trade, Industry, and Energy) in Korea, under the Fostering Global Talents for Innovative Growth Program (P0008745) supervised by the Korea Institute for Advancement of Technology (KIAT)
Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
No full textCobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking
No full textFine-pitch bonding technology with surface-planarized solder micro-bump/polymer hybrid for 3D integration
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Electroless copper bath stability monitoring with UV-VIS spectroscopy, pH, and mixed potential measurements
No full textElectroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias
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