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Scale up of advanced packaging and system integration for hybrid technologies
Get PDFThis paper presents an overview of challenges in system integration for 2.5D/3D assemblies, including copackaged optics and electronics, MEMS and microfluidics. It addresses the gap between early-stage prototypes and volume manufacturing that need true advanced packaging and system integration to realize their complex multi-technology devices. This is done by means of a virtual demonstrator that include both 2.5D/3D assemblies of ASICs and integrated photonic devices, as well as MEMS and microfluidics devices. It also addresses lowering the cost barrier for users accessing these technologies for their products, such that it will enable an increased uptake of system integration by the industry at large
Impact of the barrier/dielectric interface quality on reliability of Cu porous-low-k interconnects
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Comparison of n- and p-type high efficiency silicon solar cell performance under low illumination conditions
No full textIntegrated bio-photonics to revolutionize health care enabled through PIX4life and PIXAPP
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