3,313 research outputs found
A 0.25mm<sup>2</sup> Resistor-Based Temperature Sensor with an Inaccuracy of 0.12°C (3σ) from -55°C to 125°C and a Resolution FOM of 32fJK<sup>2</sup>
Temperature sensors based on Wheatstone bridges, e.g. [1,2], have recently achieved higher resolution and greater energy efficiency than conventional BJT-based sensors [3]. However, this comes at the expense of area, making them less attractive in industrial applications. This paper presents a Wheatstone-bridge sensor that uses a zoom-ADC architecture to reduce area (by 3x over [2]) and achieve state-of-the-art energy-efficiency for an integrated temperature sensor. After a 1st-order fit and a systematic non-linearity correction [2,4], it also achieves state-of-the-art inaccuracy: 0.12°C (3σ) over the full military temperature range (-55°C to 125°C).Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.Electronic InstrumentationMicroelectronic
A CMOS Dual-RC frequency reference with ±250ppm inaccuracy from -45°C to 85°C
To comply with wired communication standards such as USB, SATA and PCI/PCI-E, systems-on-chip require frequency references with better than 300ppm accuracy. LC-based references achieve 100ppm accuracy [1], but suffer from high power consumption (∼20mW). Thermal diffusivity (TD) references require less power (∼2mW), at the expense of less accuracy (1000ppm) [2]. RC-based references offer the lowest power consumption, but their accuracy is typically limited to ∼0.1% [3]. In RC relaxation oscillators, comparator offset and delay are the major sources of inaccuracy [4,5]. References based on frequency-locked loops (FLLs) circumvent these by locking an oscillator's frequency to the time-constant of an RC filter, but their accuracy is then limited by the nonlinear temperature dependency of on-chip resistors [3,6].Session 3.3 Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.Electronic Instrumentation(OLD)Applied Quantum ArchitecturesMicroelectronic
A twenty-five-year-old eucalyptus tree in a eucalyptus grove at the L.J. Rose Ranch, ca.1900
Photograph of a twenty-five-year-old eucalyptus tree in a eucalyptus grove at the L.J. Rose Ranch, ca.1900. The barks on the trunk is pealing off to reveal the smooth surface underneath. The ground is littered with fallen leaves. Shrubs and grass cover the area in the background where other trees stand.; "Under the ownership of Leonard John Rose, the Sunny Slope Ranch live location was a showplace of orchards and vineyards, drawing as many as two to three hundred visitors a day. Rose learned how to grow grapes without irrigation, and the ranch became known for its brandy and fine wines." -- unknown author.; "The Old Grapevine holds a small segment of the original vine whose trellised branches once covered 10,000 square feet. It was a popular local gathering place where refreshments were served under the vine. Started as a cutting from the "Mother Vine" at the Mission, many local vineyards began from cuttings of this vine. L.J. Rose of Sunnyslope Ranch, just north and east of San Gabriel, started with such cuttings and grafted on many varieties of grapes new to this area. He later helped begin many a vineyard in Northern California. The San Gabriel Winery was among the worlds largest in the late 1800's, until a blight wiped out the vineyards and oranges became the main agricultural crop of the area. Today the park is once again a popular place for weddings, parties and social gatherings." -- unknown author
Great Expectatrics: Great Papers, Great Journals, Great Econometrics
The paper discusses alternative Research Assessment Measures (RAM), with an emphasis on the Thomson Reuters ISI Web of Science database (hereafter ISI). The various ISI RAM that are calculated annually or updated daily are defined and analysed, including the classic 2-year impact factor (2YIF), 5-year impact factor (5YIF), Immediacy (or zero-year impact factor (0YIF)), Eigenfactor score, Article Influence, C3PO (Citation Performance Per Paper Online), h-index, Zinfluence, and PI-BETA (Papers Ignored - By Even The Authors). The ISI RAM data are analysed for 8 leading econometrics journals and 4 leading statistics journals. The application to econometrics can be used as a template for other areas in economics, for other scientific disciplines, and as a benchmark for newer journals in a range of disciplines. In addition to evaluating high quality research in leading econometrics journals, the paper also compares econometrics and statistics, alternative RAM, highlights the similarities and differences in alternative RAM criteria, finds that several ISI RAM capture similar performance characteristics for the leading econometrics and statistics journals while the new PI-BETA criterion is not highly correlated with any of the other ISI RAM, and hence conveys additional information regarding ISI RAM, highlights major research areas in leading journals in econometrics, and discusses some likely future uses of RAM.Research assessment measures; impact factors; Immediacy; Eigenfactor score; Article influence; h-index; C3PO; Zinfluence; PI-BETA
Failure and Delamination in Microelectronic Packages
Thin layers of dissimilar materials are used in most microelectronic components in order to achieve special functional requirements. Generally, the interface between two adjacent materials forms a weak link, not only because of the relatively low delamination strength, but also because of the existing mismatch in thermo-mechanical properties, such as Young’s modulus, coefficient of thermal expansion, hygro-swelling, and vapor pressure induced expansion. Residual stresses from the production processes and initial strains due to the changing thermal and humidity conditions together with acting mechanical loading form the crack driving factors for interface delamination. Failure of interface induces decreased reliability of microelectronic components. Nowadays, interfacial delamination forms one of the key reliability issues in the microelectronic industry and therefore is getting more and more attention. The analysis of a laminate structure with a crack along the interface is central to the characterization of the delamination toughness. The delamination toughness is highly dependent to temperature, moisture and mode mixity. In recent years, several studies were directed at the determination of the delamination behavior of Cu-EMC interfaces. In the event that moisture sensitivity was included in these studies, the temperature had to be limited to below 100oC. This limitation reduces the applicability of the toughness data obtained in a number of reliability studies of micro-electronic components. This is due to the fact that, in preconditioned (humid) micro-electronic components the interface delamination often occurs above this temperature limit. In many cases the damage is initiated during heating up in subsequent production steps, where temperatures can reach far above 100oC. Therefore the present research focuses on interface delamination measurements, especially interested in harsh environment (humidity combined with temperatures above the 100oC limit). In this thesis the thermal-mechanical properties of epoxy molding compounds in dry conditions are first investigated. The coefficient of thermal expansion and bulk modulus were measured via a dilatometer (PVT apparatus). DMA experiments in relaxation mode as well as in multi frequency mode were employed for obtaining the viscoelastic master curve and corresponding shift factors. Secondly, the thermo-mechanical properties of EMC during cure were studied. The volumetric contraction of the material during the curing period was measured via a PVT test. Furthermore the increasing shear modulus of the EMC because of the progressing cure was established through DMA experiments. For the dry state, the previous two-material characterization steps are sufficient to be able to interpret the measurement results of delamination tests via FEM simulation. For the humid state with T> 100 °C, in the delamination measurements the effect of (trapped) steam at the interface should be compensated by performing the measurements in a pressure chamber. Therefore, in a third step a pressure vessel surrounding the delamination test setup is designed and built. For the sake of simplicity the humid delamination measurements with T> 100 °C were only performed under full steam pressure (=relative humidity is 100%). The functionality of the setup has been verified by the measurement of the viscoelastic creep compliance of an EMC in dry state and to compare this with the result from measurements obtained from a commercially available measurement instrument. In order to be able to perform delamination measurements a mixed-mode bending setup is installed in the pressure vessel. Interfacial delamination measurements for a EMC-Cu lead frame interface (as obtained from a real production process) are subsequently performed for dry conditions as well as under pressurized steam conditions(= relative humidity 100%). A (I / II) mixed mode mechanical load is applied to the test sample, in which the initial stress state due to the manufacturing and the steam pressure (relative humidity 100%) is already present, in order to initiate and propagate the delamination. In conclusion: This dissertation shows that the temperature, the mix mode and the humidity under these conditions (T> 100 °C and 100% relative humidity) results in a significant effect on the delamination properties of interfaces. As far as known to the author, here for the first time a good insight on the impact of this harsh environment on the delamination properties is presented.Precision and Microsystems EngineeringMechanical, Maritime and Materials Engineerin
Great Expectatrics: Great Papers, Great Journals, Great Econometrics
The paper discusses alternative Research Assessment Measures (RAM), with an emphasis on the Thomson Reuters ISI Web of Science database (hereafter ISI). The various ISI RAM that are calculated annually or updated daily are defined and analysed, including the classic 2-year impact factor (2YIF), 5-year impact factor (5YIF), Immediacy (or zero-year impact factor (0YIF)), Eigenfactor score, Article Influence, C3PO (Citation Performance Per Paper Online), h-index, Zinfluence, and PI-BETA (Papers Ignored - By Even The Authors). The ISI RAM data are analysed for 8 leading econometrics journals and 4 leading statistics journals. The application to econometrics can be used as a template for other areas in economics, for other scientific disciplines, and as a benchmark for newer journals in a range of disciplines. In addition to evaluating high quality research in leading econometrics journals, the paper also compares econometrics and statistics, alternative RAM, highlights the similarities and differences in alternative RAM criteria, finds that several ISI RAM capture similar performance characteristics for the leading econometrics and statistics journals while the new PI-BETA criterion is not highly correlated with any of the other ISI RAM, and hence conveys additional information regarding ISI RAM, highlights major research areas in leading journals in econometrics, and discusses some likely future uses of RAM.Research assessment measures, impact factors, Immediacy, Eigenfactor score, Article influence, h-index, C3PO, Zinfluence, PI-BETA
A 280μW dynamic-zoom ADC with 120dB DR and 118dB SNDR in 1kHz BW
Micro-power ADCs with high linearity and dynamic range (DR) are required in several applications, such as smart sensors, biomedical imaging, and portable instrumentation. Since the signals of interest are then often small (tens of μν) and slow (<1kHz BW), such ADCs should also exhibit low offset and flicker noise. Noise-shaping SAR [1] and incremental ADCs [2] have been proposed for such applications, but their DR is limited to about 100dB. Although the ΔΣ modulator (ΔΣM) proposed in [3] achieves 136dB DR, it is at the expense of high power consumption (12.7mW). The incremental zoom ADC proposed in [4] combines a coarse SAR ADC and a fine ΔΣ ADC to efficiently achieve 119.8dB DR, but is limited to DC signals. The dynamic zoom ADC in [5] solves this problem, but requires external filtering to cope with out-of-band interference. This paper describes an interferer-robust dynamic zoom ADC that consumes 280μW while achieving 120.3dB DR and 118.1dB SNDR in 1kHz BW, resulting in a Schreier FoM of 185.8dB. It also achieves a maximum offset of 30μν and a 1/f corner of 7Hz. These advances are achieved by the combination of dynamic error-correction techniques, an asynchronous SAR ADC and a fully differential inverter-based ΔΣ ADC.Session 14.5 Green Open Access added to TU Delft Institutional Repository ‘You share, we take care!’ – Taverne project https://www.openaccess.nl/en/you-share-we-take-care Otherwise as indicated in the copyright section: the publisher is the copyright holder of this work and the author uses the Dutch legislation to make this work public.Electronic Instrumentation(OLD)Applied Quantum ArchitecturesMicroelectronic
L.J. Emory Publishing Co.: Expansion to U.S. Regional Midwest and The Netherlands
National bestselling author Serena B. Miller owns the rights to her published works in Amish fiction, historical romance, mystery and children’s works. The L.J. Emory publishing company partnered with a marketing class in an agency project to develop marketing research instruments. The company deployed the instruments, gathered the data and approached the SSU Marketing program in the School of Business for participation in a second agency project to use the data to build a strategic plan. BUMK 4000 Marketing Management students evaluated the data and presented a package and live proposal to the company owners suggesting new ways to expand in the U.S. Midwest and a pilot project to expand internationally, targeting The Netherlands. The proposal included sample social media posts, email drip campaign messages and related promotional materials in English and Dutch
Two men with their arms wrapped around a 25-years-old eucalyptus tree at the L.J. Rose Ranch, ca.1900
Photograph of two men with their arms wrapped around a 25-years-old eucalyptus tree at the L.J. Rose Ranch, ca.1900. The men, leaning against the tree and holding hands, have their free arm wrapped around the large tree. The barks on the trunk is pealing off and revealing the smooth surface underneath. The ground is littered with fallen leaves. Shrubs and trees are visible in the background.; "Under the ownership of Leonard John Rose, the Sunny Slope Ranch live location was a showplace of orchards and vineyards, drawing as many as two to three hundred visitors a day. Rose learned how to grow grapes without irrigation, and the ranch became known for its brandy and fine wines." -- unknown author.; "The Old Grapevine holds a small segment of the original vine whose trellised branches once covered 10,000 square feet. It was a popular local gathering place where refreshments were served under the vine. Started as a cutting from the "Mother Vine" at the Mission, many local vineyards began from cuttings of this vine. L.J. Rose of Sunnyslope Ranch, just north and east of San Gabriel, started with such cuttings and grafted on many varieties of grapes new to this area. He later helped begin many a vineyard in Northern California. The San Gabriel Winery was among the worlds largest in the late 1800's, until a blight wiped out the vineyards and oranges became the main agricultural crop of the area. Today the park is once again a popular place for weddings, parties and social gatherings." -- unknown author
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