1,721,012 research outputs found
Measurement of creep and relaxation behaviors of wafer-level CSP assembly using Moire interferometry
No full textIn this paper the creep and relaxation behaviors of a wafer-level CSP assembly under two types of thermal loading conditions were investigated using high sensitivity moire interferometry. One is a thermal load from 100degreesC to room temperature and the other is from room temperature to 100degreesC. In the second case, the real-time technique was used to monitor and measure the shear deformations of solder joints and the warpage of the assembly during the test. For the real-time measurements of thermal deformations, a small-sized thermal chamber having an optical window was developed. In addition, the test results obtained from the moire interferometry measurements were compared with the predicted values obtained from finite element analysis. It is shown that the deformation values predicted from finite element analysis have a good agreement with those obtained from the tests
Experimental study for reliability of electronic packaging under vibration
No full textAn automated fatigue-testing system was developed for an experimental study on the integrity of the electronic packaging subjected to mechanical vibration. The fatigue-testing machine utilized the electromagnetic device as an actuator. A data acquisition system was developed for the fatigue test of the electronic board, The fixture for the specimen was designed to be suitable for measuring the fatigue life of a typical module/lead/card electronic system subjected to vibration. With this automated fatigue-testing machine, the mechanical integrity of surface mount component with the spider gullwing leads has been studied by a mechanical flexural fatigue test. An experimental method was developed to measure the changes in electrical resistance in the lead, which is used to indicate a fatigue failure. Finally, a relationship between the loading force and the fatigue life of high-cycle region was discussed for the lead of spider gullwing type surface-mounted component, With the relation, the fatigue life of the surface-mounted component (SMC) subjected to vibration environment was predicted successfully
An Experimental Study on the Integrity of the Electronic Pakaging Subjected to Environmental Vibration
No full text
Reliability Assessments of Flip Chip Solder Joints with experimental and Numerical Methods
No full textDeformation mechanism and its effect on electrical conductivity of ACF flip chip package under thermal cycling condition: An experimental study
No full textIn this study, experimental works are performed to investigate the deformation mechanism and electrical reliability of the anisotropic conductive adhesive film (ACF) joint subjected to temperature cycling for flip chip on organic board (FCOB) assemblies. This paper presents some dominant deformation parameters governing the electrical degradation in an ACF joint between a chip and a substrate when flip chip assembly is heated and cooled. The deformation mechanism of ACF flip chip assemblies during the temperature cycling are investigated using in situ high sensitivity moire interferometry. A four-point probe method is conducted to measure the real-time contact resistance of ACF joint subjected to the cyclic temperature variation. As the temperature increases below T-g of ACF, the bending displacement of assembly decreases linearly. At the temperature higher than T-g of ACF, there is no further change in bending behavior and in-plane deformations of a chip and a substrate become approximately free thermal expansion. It is because that soft-rubbery ACF at the temperature above T-g cannot provide the mechanical coupling between a chip and a substrate. The effect of bump location on the temperature dependent contact resistance is evident. A characteristic hysteresis in bending curves is observed and discussed. The contact resistance of the corner bumps increases with increasing temperature at a higher rate when compared to that of the middle. Failure analysis is performed to examine the ACF interconnections before and after thermal cycling test. The results indicate that during the thermal loading, the shear deformation is more detrimental to the electrical degradation of ACF joints than normal strain. (c) 2005 Elsevier Ltd. All rights reserved.This work was supported by Center for Electronic
Packaging Materials of Korea Science and Engineering
Foundation. The authors would like to thank Dr. S.B.
Lee at Korea Advanced Institute of Science and Technology
for his valuable advices on a moire´ analysis
- …
