1,720,968 research outputs found

    Optical isolators for 2-micron fibre lasers

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    We report on the development and testing of optical isolators for use in 2-micron fiber laser systems. A variety of potential Faraday rotator materials were characterised to identify the most suitable materials for use in the 1700-2100nm wavelength range. Isolators based on the three best performing materials were then developed and packaged as fiber-in, fiber-out and fiber-in, beam-out devices. The isolators were then tested in CW, pulsed and ultrafast laser systems. The three different designs produced different performance characteristics, but all designs demonstrated isolation >25dB and insertion losses of <1.2 dB

    Large-scale integrated optics using TriPleXTM waveguide technology: from UV to IR

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    We present a new class of low-loss integrated optical waveguide structures as CMOS-compatible industrial standard for photonic integration on silicon or glass. A TriPleXTM waveguide is basically formed by a -preferably rectangular- silicon nitride (Si3N4) shell filled with and encapsulated by silicon dioxide (SiO2). The constituent materials are low-cost stoichiometric LPVCD end products which are very stable in time. Modal characteristics, birefringence, footprint size and insertion loss are controlled by design of the geometry. Several examples of new applications will be presented to demonstrate its high potential for large-scale integrated optical circuits for telecommunications, sensing and visible light applications

    Polymer-based optical interconnects using nanoimprint lithography

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    The increasing request for higher data speeds in the information and communication technology leads to continuously increasing performance of microprocessors. This has led to the introduction of optical data transmission as a replacement of electronic data transmission in most transmission applications longer than 10 meters. However, a need remains for optical data transmission for shorter distances inside the computer. This paper gives an overview of the Joint European project FIREFLY, in which new polymer based single mode waveguides are developed for integration with VCSELs, splitters and fibers that will be manufactured using multi-layer nanoimprint lithography (NIL). Innovative polymers, new applications of nano-technology, new methods for optical coupling between components, and the integration of all these new components are the technical ingredients of this ambitious project

    Optical transceivers for interconnections in satellite payloads

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    The increasing data rates and processing on board satellites call for the use of photonic interconnects providing high-bitrate performance as well as valuable savings in mass and volume. Therefore, optical transmitter and receiver technology is developed for aerospace applications. The metal-ceramic-packaging with hermetic fiber pigtails enables robustness for the harsh spacecraft environment, while the 850-nm VCSEL-based transceiver technology meets the high bit-rate and low power requirements. The developed components include 6 Gbps SpaceFibre duplex transceivers for intra-satellite data links and 40 Gbps parallel optical transceivers for board-to-board interconnects. Also, integration concept of interchip optical interconnects for onboard processor ICs is presented

    Optical attachment for spatial transformation of excimer laser beam

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    The optical attachment for transformation the spatial characteristics of excimer laser has been experimentally investigated. The laser beam of rectangular section with sizes of 3 x 20 mm and divergence of 2 x 5 mrad after passage of an optical attachment got the square form 20 x 20 mm and equal divergence of 5 x 5 mrad orthogonal directions. It is shown, that application of such unit in the facilities for microprocessing of materials simplifies an optical path of illumination module, allows to receive the optimum uniformity of irradiation (within 2 %) at reproductive image with micron accuracy in plane of processed material and to mitigate the beam load on optical elements due to suppression of influence of "hot" points

    Packaging of opto-electronic devices for flexible applications

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    This paper presents the latest results on the development of a thin flexible package of commercially available optoelectronics with polymer multimode waveguides. The GaAs VCSELs and Photodiodes are thinned down to 20 μ m thickness, resulting in packages which can be bended to a bending radius of 2 mm with high reliability. With these actives, also waveguides and out-of-plane coupling structures are embedded inside the foil. Flexible Polyimide micromirrors were fabricated, characterized and embedded inside the foil. An embedded VCSEL to Photodiode optical waveguide link was demonstrated at a speed of 1.2 Gbs with open eye diagram. Temperature (-40 to 125 degrees Celsius) and humidity (85 rh/85 degrees C for 1000 hours) reliability was tested with good results. The total thickness of the completed foil containing actives, waveguides and coupling elements is only 145 μm

    Dynamic polymer ribbon couplers for card-to-backplane optical interconnects

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    Polymeric waveguides with dynamic coupler array are fabricated by vacuum assisted microfluidic technique for card-to-backplane optical interconnect applications. The dynamic optical coupler on backplane consists of 45° integrated waveguide mirrors and a perpendicular microfluidic channel for flow motion of index matching liquid and air bubbles. Controlled positioning of the air bubble or index matching liquid in contact with the integrated mirror can effectively turn on or off each surface normal waveguide coupler for card-to-backplane optical interconnection. The size of the integrated mirror determines the coupler efficiency. Effective surface normal optical coupling is demonstrated

    Packaging technology enabling flexible optical interconnections

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    This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials. Electrical circuits on flexible substrates are a very fast growing segment in electronics, but opto-electronics and optics should be able to follow these upcoming trends. This paper presents the back-thinning and packaging of single opto-electronic devices resulting in highly flexible and reliable packages. Optical waveguides and optical out-of-plane coupling structures are integrated inside the same layer stack, resulting in complete VCSEL-to-PD links with low total optical losses and high resistance to heat cycling and moisture exposure

    Polymer waveguide with tunable optofluidic couplers for card-to-backplane optical interconnects

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    Polymeric waveguides with tunable optofluidic couplers are fabricated by the vacuum assisted microfluidic technique for card-to-backplane optical interconnect applications. The optofluidic coupler on a backplane consists of polymer waveguides and a perpendicular microfluidic channel with inclined sidewalls. An index matching liquid and air bubbles are located in the microfluidic hollow channel. The activation or deactivation of the surface normal coupling of the optofluidic coupler is accomplished by setting air bubbles or index matching liquid to be in contact with the waveguide mirrors. 10 Gbps eye diagrams of the card-to-backplane optical interconnect link have been demonstrated showing the high performance of the interconnect system
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