151,645 research outputs found

    Strain-relaxed, high Ge content, SiGe layers grown on Si (100) substrate by reduced pressure - chemical vapour deposition (RP-CVD)

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    A different approach was taken to relieve strain from a high Germanium (Ge) content, Silicon-Germanium (SiGe) layers on a Silicon (Si) (100) substrate by growing a thin Ge under-layer between substrate and layer. The Ge under-layer acts as a strain reliving platform for further growth of a high Ge content SiGe layer to improve the structural quality of the sample by reducing the Root Mean Squared Roughness (RRMS) and threading dislocation density (TDD). The proposed structure involves the growth of thin Si0.3Ge0.7 and Si0.5Ge0.95 buffer layers of an average thickness of 350 nm grown on a Si (100) substrate and their structural qualities assessed. Experimental techniques include High Resolution X-Ray Diffraction, Atomic Force Microscopy, Transmission Electron Microscopy, and Defect Etching. All samples were shown to be fully relaxed and have a surface roughness between 1-8 nm. However, a threading dislocation density of 109 cm-2 was witnessed. Although these results are the first of their kind, further research into improving structural qualities is to be investigated in the future

    High quality Schottky contacts for limiting leakage currents in Ge-based Schottky barrier MOSFETs

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    Schottky barrier (SB) Ge channel MOSFETs suffer from high drain-body leakage at the required elevated substrate doping concentrations to suppress source-drain leakage. Here we show that electrodeposited Ni-Ge and NiGe/Ge Schottky diodes on highly doped Ge show low off current, which might make them suitable for SB p-MOSFETs. The Schottky diodes showed rectification of up to 5 orders in magnitude. At low forward biases the overlap of the forward current density curves for the as deposited Ni/n-Ge and NiGe/n-Ge Schottky diodes indicates Fermi-level pinning in the Ge band gap. The SB height for electrons remains virtually constant at 0.52 eV (indicating a hole barrier height of 0.14 eV) under various annealing temperatures. The series resistance decreases with increasing annealing temperature in agreement with four point probe measurements indicating the lower specific resistance of NiGe as compared to Ni, which is crucial for high drive current in SB p-MOSFETs. We show by numerical simulation that by incorporating such high quality Schottky diodes in the source/drain of a Ge channel PMOS, highly doped substrate could be used to minimize the subthreshold source to drain leakage current

    Ge-on-Si single-photon avalanche diode detectors: design, modeling, fabrication, and characterization at wavelengths 1310 and 1550 nm

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    The design, modeling, fabrication, and characterization of single-photon avalanche diode detectors with an epitaxial Ge absorption region grown directly on Si are presented. At 100 K, a single-photon detection efficiency of 4% at 1310 nm wavelength was measured with a dark count rate of ~ 6 megacounts/s, resulting in the lowest reported noise-equivalent power for a Ge-on-Si single-photon avalanche diode detector (1×10-14 WHz-1/2). The first report of 1550 nm wavelength detection efficiency measurements with such a device is presented. A jitter of 300 ps was measured, and preliminary tests on after-pulsing showed only a small increase (a factor of 2) in the normalized dark count rate when the gating frequency was increased from 1 kHz to 1 MHz. These initial results suggest that optimized devices integrated on Si substrates could potentially provide performance comparable to or better than that of many commercially available discrete technologies

    Fe/Ge catalyzed carbon nanotube growth on HfO<sub>2</sub> for nano-sensor applications

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    A carbon nanotube (CNT) growth process on HfO2 is reported for the first time for application in nano-sensors. The process uses a combination of Ge nanoparticles and ferric nitrate dispersion and achieves an increase in CNT density from 0.15 to 6.2 μm length/ μm2 compared with the use of ferric nitrate dispersion alone. The growth process is validated by the fabrication of back-gate CNT field-effect transistors (CNTFETs) using Al source/drain (S/D) contacts and a H2 anneal at 400 degrees C. The transistors exhibit p-FET behavior with an Ion/Ioff ratio of 105 and a steep sub-threshold slope of 130 mV/dec. These results are rather surprising, as earlier research in the literature on CNTFETs with Al S/D electrodes showed n-FET behavior. The p-FET behavior is shown to be due to the H2 anneal, which we ascribe to the smaller electron affinity of hydrogenised CNTs. Measurements of the temperature dependence of the drain current show low Schottky barrier height Al S/D contacts after a H2 anneal, which tends to confirm this explanation

    Mechanism of vertical Ge nanowire nucleation on Si (111) during subeutectic annealing and growth

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    The direct integration of Ge nanowires with silicon is of interest in multiple applications. In this work, we describe the growth of high-quality, vertically oriented Ge nanowires on Si (111) substrates utilizing a completely sub-Au-Si-eutectic annealing and growth procedure. With all other conditions remaining identical, annealing below the Au-Si eutectic results in successful heteroepitaxial nucleation and growth of Ge nanowires on Si substrate while annealing above the Au-Si eutectic leads to randomly oriented growth. A model is presented to elucidate the effect of the annealing temperature, in which we hypothesized that sub-Au-Si-eutectic annealing leads to the formation of a single and well-oriented interface, essential to template heteroepitaxial nucleation. These results are critically dependent on substrate preparation and lead to the creation of integrated nanowire systems with a low thermal budget process

    He Shisun shou shu shi gao: 4 juan. v.1

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    何詩孫.線裝,一函He Shisun.Detailed notes in vernacular field only

    Photoluminescence and Raman studies on Ge-based complexes in Si-doped GaInP epilayers grown on Germanium

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    <p>Photoluminescence and Raman scattering measurements were performed on Si-doped GaInP grown on Ge. The deep broadband photoluminescence (PL) emission centered around 1.4&thinsp;eV exhibits a strong dependence of strength on Si dopants, which is suggested to be due to [Ge(Ga,In)-V(Ga,In)] complexes. A strong evidence to support the existence of [Ge(Ga,In)-Si(Ga,In)] complexes in Si-doped GaInP is shown by Raman spectra. The blue shift of broad PL emission and the increased recombination life time with increased temperatures were explained by the competition between [Ge(Ga,In)-V(Ga,In)] and [Ge(Ga,In)-Si(Ga,In)] complexes.</p

    The Assembly-Disassembly-Organization-Reassembly mechanism for 3D-2D-3D transformation of germanosilicate IWW zeolite

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    This research was part funded by EPSRC grant number EP/K025112/1. The article processing charge for this article was funded through the RCUK open access block grant.Hydrolysis of germanosilicate zeolites with the IWW structure shows two different outcomes depending on the composition of the starting materials. Ge-rich IWW (Si/Ge=3.1) is disassembled into a layered material (IPC-5P), which can be reassembled into an almost pure silica IWW on treatment with diethoxydimethylsilane. Ge-poor IWW (Si/Ge=6.4) is not completely disassembled on hydrolysis, but retains some 3D connectivity. This structure can be reassembled into IWW by incorporation of Al to fill the defects left when the Ge is removed.Peer reviewe

    Bai mao nü: liu mu ge ju.

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    賀敬之等編劇 ; 馬可等作曲.He Jingzhi deng bian ju ; Ma Ke deng zuo qu

    Lun yu zhu shu jie jing: [20 juan]. v.133

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    何晏集解 ; 邢昺疏.綫裝.框17.9 x 12.5 公分, 9行21字, 小字雙行同, 白口, 無魚尾, 左右雙邊, 版心下刻"汲古閣".Xian zhuang.Kuang 17.9 x 12.5 gong fen, 9 hang 21 zi, xiao zi shuang hang tong, bai kou, wu yu wei, zuo you shuang bian, ban xin xia ke "Ji gu ge".He Yan ji jie ; Xing Bing shu
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