1,720,983 research outputs found
Failure mechanisms and analysis of very large scale integrated circuits
The failure mechanisms affecting advanced Silicon integrated circuits are reviewed
L'affidabilità dei dispositivi a semiconduttore - parte seconda
In questa seconda parte vengono presentati i fenomeni chimico-fisici che causano i guasti dei componenti elettronici
La fisica dei meccanismi di guasto nella microelettronica
This paper is a tutorial on failure mechanisms and reliability physics of Si semiconductor devices and circuit
L'affidabilità dei dispositivi a semiconduttore
The paper is a tutorial on the basic concepts of semiconductor device reliability, with particular emphasis on accelerated testing procedures, definition of reliability, calculation of failure rates etc
L'affidabilità dei dispositivi a semiconduttore - parte prima
In questo articolo, dopo aver definito l'affidabilità come disciplina e come proprietà degli oggetti, vengono introdotte le funzioni statistiche più usate per l'analisi dei dati e la misura dell'affidabilità
Updating of CMOS reliability
Updated results of massive life tests on CMOS are reported. The failure rate derived from laboratory conditions is extrapolated for long life use and compared with field results. Failure mechanism distribution is also reported
CONDUCTIVE FIBER MATERIALS
The present invention relates to a fiber material, in particular a textile which is conductive. The fiber material includes a base textile material on the surface of which a plurality of nanoparticles are deposited and a conductive polymer layer on top of the nanoparticles
Il circolo dell'affidabilità sui componenti elettronici
The paper describes the activities of an alliance between Italian companies and government laboratories, aimed at sharing data, procedures and at promoting actions concerning the reliability of integrated circuits and electronic component
Reliability evaluation of plastic packaged devices for long life applications by THB test
The reliability of transistors, bipolar and CMOS integrated circuits encapsulated in different types of plastic packages was investigated by using the 85°C/85%R.H. test with applied bias and thr results compared with a long term operating life test
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