1,721,115 research outputs found
Reliability problems with VLSI
The extraordinary development of the integrated circuits has gone hand in hand with an increase in reliability; however the speed of evolution itself brings about greater reliability risks, due to strong competition in the market, and the reduction in the dimensions of the devices causes an increase in the electric fields and current densities.The failure mechanisms that are expected to be most dangerous are thin oxide breakdown, hot electron effects, metal-semiconductor interactions, electromigration and soft errors
Affidabilità e fisica dei guasti nei circuiti integrati in silicio
L'affidabilità dei circuiti integrati riveste un'importanza crescente: ne vengono richiamati definizione e metodi di calcolo. Sono quindi esaminati i meccanismi di guasto principali, classificandoli secondo la localizzazione nella tessera di silicio
Problemi connessi alla valutazione ed all'impiego di contenitori plastici in applicazioni a vita utile molto lunga
Rimangono seri dubbi che i contenitori plastici possano assicurare l'affidabilità richiesta per un lungo periodo di tempo, in un'ampia varietà di condizioni climatiche. E' questo l'aspetto considerato nel presente lavoro
Failure mechanisms and analysis of very large scale integrated circuits
The failure mechanisms affecting advanced Silicon integrated circuits are reviewed
Design and screening of highly reliable 980nm pump lasers
Presents a design and screening approach that can be adopted to improve reliability of high-power 980-nm semiconductor lasers. Flared-ridge waveguide chips were realized on GRIN-SCH single-quantum-well structures. Without any screening, flared devices, thanks to the reduced peak power and current density, showed a 20% reduction in failure rate with respect to devices with straight waveguide. By adopting extended screening criteria, a more reliable population was selected, showing a reduction by a factor of two in the failure rate extrapolated at standard operating conditions
Failure modes and mechanisms for VLSI ICs
Knowledge of the electrical failure modes and of the physical mechanisms that cause faults is fundamental to implementing realistic fault models. Therefore, failure physics is the basis of effectual test sequence generation, and can give guidelines also for the design of testable and reliable integrated circuits. In the paper the failure modes and mechanisms of complex integrated circuits are reviewed. Faults are classified with respect to their allocation in the devices. Bulk defects, and failures in the dielectric layers, metallisation and package interconnections are then examined. Special attention is devoted to failures spurred by the reduction of dimensions for VLSI (scaling)
Principi di Qualità
Il testo contiene i principi base relativi alla qualità, con particolare attenzione alle norme della famiglia ISO 9000 e al miglioramento
Appunti di Microelettronica
Il testo fornisce un quadro sintetico delle tecnologie impiegate in microelettronica
On the use of matrix algebra for the description of EPROM failures
A description of EPROM failures based on the use of Boolean matrices and operators is offered. It overcomes a number of problems which made previously available theories inapplicable to practical devices, and provides a useful tool for the analysis of test pattern efficiency
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