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Scaling the 3D bumps pitch from 20 to 10 μm, focusing on the wet Cu seed etch process development
No full textImpact of NiB and Cu ELD layers on surface morphology and IMC growth rate of CoSn CuSn and NiSn systems
No full textStudy morphology and growth rate of intermetallic compound (IMC) for 3D stacking of fine pitch microbumps
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Surface planarization of Cu and CuNiSn micro-bumps embedded in polymer for below 20μm pitch 3DIC applications
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Thiol based self-assenbled monolayers (SAMs) as an alternative surface finish for 3D Cu microbumps
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