1,720,969 research outputs found

    An RFID-Enabled Wireless Strain Gauge Sensor for Static and Dynamic Structural Monitoring

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    Strain gauge measurements are widely used in structural health monitoring and damage detection of existing infrastructures as well as in laboratory prototyping tests of new structures and materials. Wireless sensing of strain gauge is desirable in many practical applications because of the difficulty to access at the measurement point or to handle wired sensors. In this paper, we show a semi-passive wireless strain gauge sensor, which allows a high level of measurement accuracy comparable with that of wired strain sensors. It overcomes the limits and drawbacks of devices based on wireless sensor networks and those based on similar RFID-based sensors. The ability to perform measurements over long distances and to handle fast time-varying phenomena (e.g., vibration) makes the proposed device practical in realistic scenarios

    High Power, Thermally Efficient, X-band 3D T/R Module With Calibration Capability for Space Radar

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    Earth observation from space radar is based on the active electronically steerable antenna (AESA) whose performances count on reliable and powerful transmit/receive modules (TRM). To this aim, as a follow-up of the successful demonstration of a low-footprint transmit/receive hybrid module concept based on 3-D packaging and interconnect technologies (3DTRM), the interest for carrying out additional development work took a further step aiming at achieving a three-fold module performance improvement as well as at consolidating the novel proposed 3-D technology for space applications. First, the possibility of performing an AESA highly accurate calibration was implemented by embedding a wide band, high directivity directional coupler in the module circuitry without any total module footprint increase. Second, the heat extraction capability of the metal-ceramic hermetic package was enhanced through a re-design of the monolithic microwave integrated circuit (MMIC)-to-sink interface. And finally, the gallium arsenide (GaAs) MMIC high power amplifier (HPA) of the first 3DTRM version was replaced by a gallium nitride (GaN) HPA MMIC, obtaining both a higher transmit output power at 5 dB of compressed gain and an improved power added efficiency (PAE) at module level

    A Procedure to Design Feasible Dual Band Matching Networks with Minimum Complexity

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    Many applications in communication systems require the development of dual band matching networks. A new method to design dual band matching networks was shown, which resorts to closed form equations based on transmission line theory, and has three particular characteristics: (i) it permits the minimum number of elements (two at most three) in the network; (ii) the topology of the network is not fixed but modular; and (iii) it is able to find multiple solutions within a predefined range of feasible characteristic impedances for the elements of the network. An extensive comparison with the results shown in the literature has been reported showing the improvements introduced by the proposed method. Numerical simulations and experimental results confirm the effectiveness of the method
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