1,121 research outputs found
D. D. Leslie. The Survival of the Chinese Jews
De Menasce J. D. D. Leslie. The Survival of the Chinese Jews. In: Revue de l'histoire des religions, tome 184, n°2, 1973. pp. 237-238
D. D. Leslie. The Survival of the Chinese Jews
De Menasce J. D. D. Leslie. The Survival of the Chinese Jews. In: Revue de l'histoire des religions, tome 184, n°2, 1973. pp. 237-238
Incidence and cost of perioperative red blood cell transfusion for elective spine fusion in a high-volume center for spine surgery
Background: Spine fusion is a surgical procedure characterized by a significant perioperative bleeding, which often requires red blood cell (RBC) transfusion.
Methods: The incidence and the cost of RBC transfusion were evaluated in all patients undergoing elective surgery for spine fusion in our Institution, a high-volume center for spine surgery, over a period of 3 years. The analysis specifically addressed the RBC transfusion need in all the different spine fusion procedures (atlanto-axial, cervical, dorsal, lumbar, revisions) with the different surgical approaches (anterior, posterior).
Results: During the 3 years of observation, a total of 1.882 elective spine fusions were performed. More than half of the procedures (n = 964) were posterior lumbar fusions. Overall, 5% of the patients (n = 103) required RBC transfusion. The cervical fusions were the procedures with the lowest percentage of RBC need (0-5%), while the dorsal and the lumbar ones, with the anterior approach, represented the procedures with the highest rate of transfusion (29% and 25% respectively). More than 60 % of the RBC units were employed in the instance of posterior lumbar fusion, while a variable 1-10% of the units was used in each of the other procedures. The overall transfusion cost was of 46.000 euros, with a distribution of costs that paralleled the amount of units transfused for each procedure.
Conclusions: Several surgical and patient factors may contribute to the perioperative blood loss. An accurate patient blood management, may efficiently decrease transfusion requirements and ultimately healthcare costs
Photoproduction of D Mesons
Preliminary results are presented using the Wide Band photon beam at Fermilab
to measure the cross-section of D*+/- and D+/- photoproduction on a Be target over the
photon enera rsngs from 100 GeV to 350 GeV. Preliminary results are also presented
on the xF and pT2 distributions and the ratios of D0/D*+ and D*-/D*+. The energy
dependence of the total open charm cross-section of photoproduction was compared
with the predictions by the photon-gluon fusion model and a higher order QCD radiative
correction based on perturbative QCD. The prediction by the QCD radiative
correction with Mc = 1.5GeV agrees well with the observed data within the theoretical
uncertainties of the QCD parameters
The INFN R&D: New pixel detector for the High Luminosity upgrade of the LHC
The high Luminosity upgrade of the CERN-LHC (TIL-LHC) demands for a new high-radiation tolerant solid-state pixel sensor capable of surviving fluencies up to a few 10(16) particles/cm(2) at similar to 3 cm from the interaction point. To this extent the TNFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler-FBK, is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC. The R&D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct \Vafer Bonding technique, which allows for the production of sensors with 100 mu m and 130 mu m active thickness for planar sensors, and 130 mu m for 3D sensors, the thinnest ones ever produced so far. The first prototypes of hybrid modules bump-bonded to the present CMS and ATLAS readout chips have been tested in beam tests. The preliminary results on their performance before and after irradiation are presented
Pixel Detector Developments for Tracker Upgrades of the High Luminosity LHC
This paper reports on the INFN (Istituto Nazionale di Fisica Nucleare, Italy) research activity in collaboration with FBK foundry, which is aiming at the development of new pixel detectors for the LHC Phase-2 upgrades. The R&D covers both planar pixel devices and 3D detectors built using columnar technology. All sensors are low thickness n-in-p type, as this is the general direction envisaged for the High Luminosity LHC pixel detector upgrades. Hybrid modules with 100 μ
m and 130 μ
m active thickness, connected to the PSI46dig readout chip, have been tested on beam test experiments. Selected preliminary results from test beams are described for both planar and 3D devices. The results on the 3D pixel sensors before irradiation are very satisfactory and support the conclusion that columnar devices are very good candidates for the inner layers of the upgrade pixel detectors
Pixel detector developments for tracker upgrades of the high luminosity LHC
This paper reports on the INFN (Istituto Nazionale di Fisica Nucleare, Italy) research activity in collaboration with FBK foundry, which is aiming at the development of new pixel detectors for the LHC Phase-2 upgrades. The R&D covers both planar pixel devices and 3D detectors built using columnar technology. All sensors are low thickness n-in-p type, as this is the general direction envisaged for the High Luminosity LHC pixel detector upgrades. Hybrid modules with 100 μ m and 130 μ m active thickness, connected to the PSI46dig readout chip, have been tested on beam test experiments. Selected preliminary results from test beams are described for both planar and 3D devices. The results on the 3D pixel sensors before irradiation are very satisfactory and support the conclusion that columnar devices are very good candidates for the inner layers of the upgrade pixel detectors
Performance of new radiation tolerant thin n-in-p Silicon pixel sensors for the CMS experiment at High Luminosity LHC
The High Luminosity upgrade of the CERN-LHC (HL-LHC) demands for a new high-radiation tolerant solid- state pixel sensor capable of surviving fluencies up to a few 10 16 particles cm 2 at ∼3 cm from the interaction point. To this extent the INFN ATLAS-CMS joint research activity, in collaboration with Fondazione Bruno Kessler, is aiming at the development of thin n-in-p type pixel sensors for the HL-LHC. The R D covers both planar and single-sided 3D columnar pixel devices made with the Si-Si Direct Wafer Bonding technique, which allows for the production of sensors with 100μm and 130μm active thickness for planar sensors, and 130μm for 3D sensors, the thinnest ones ever produced so far. First prototypes of hybrid modules bump-bonded to the present CMS readout chips have been tested in beam tests. Preliminary results on their performance before and after irradiation are presented
Study of the D°---> pi- pi+ pi- pi+ decay
Using data from the FOCUS (E831) experiment at Fermilab, we present new measurements for the Cabibbo-suppressed decay mode . We measure the branching ratio . An amplitude analysis has been performed, a first for this channel, in order to determine the resonant substructure of this decay mode. The dominant component is the decay , accounting for 60% of the decay rate. The second most dominant contribution comes from the decay , with a fraction of 25%. We also study the line shape and resonant substructure. Using the helicity formalism for the angular distribution of the decay , we measure a longitudinal polarization of %
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