61 research outputs found
Systematic Analysis of the Signal Integrity Performances of Surface Integrated Waveguides
No full textAnalysis of Radiated Emissions and Shielding Effectiveness for a metallic enclosure with Shielding Springs
No full textNoise coupling mitigation in PWR/GND plane pair by means of photonic crystal fence: Sensitivity analysis and design parameters extraction
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Signal and Power Integrity Analysis of Single Ended and Differential Lines in Multilayer PCBs with Embedded EBG Structures
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Characterization of via holes discontinuities by means of numerical de-embedding
No full textA method for de-embedding scattering parameters S of via hole in multilayer printed circuit board is presented. By assuming that the via hole is not electromagnetically coupled with the adjacent lines, the scattering parameters are evaluated starting from the calculation of the transfer scattering matrix T obtained by a three dimensional full wave analysis of the test structure. The numerical approach used to obtain S and T parameters has been validated by comparison with results computed by other independent numerical methods and measurements. The proposed methodology allows a computational time saving and gives useful results for a CAD modeling of via hole discontinuities
Cross-SSN analysis in multilayer printed circuit boards
No full textAs digital circuits became faster and more power is involved, direct coupling in multilayer printed circuit boards (PCBs) among power (PWR) planes becomes a major concern for signal integrity (SI) and electromagnetic interference (EMI). Aim of this paper is to show how an electromagnetic wave can propagate between planes and therefore induce noise on the signals crossing the planes' pairs through vias eventually radiate from the edge of the board. More specifically our study focuses on the analysis of the noise which propagates from a power plane to another power plane due to their proximity, named cross-simultaneous switching noise (X-SSN). This effect can be mitigated by a careful analysis of the location of PWR and ground (GND) planes in the board stack-up which avoid the contiguity of two PWR planes. A test board is built and measurements are performed. These measurements are also compared with three dimensional numerical results
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