7,552 research outputs found
ACTIVITY DIFFERENCE BETWEEN THE INTERNAL AND EXTERNAL SULFONIC GROUPS OF MACRORETICULAR ION-EXCHANGE RESIN CATALYSTS IN ISOBUTYLENE HYDRATION
No full textExploitation of reagents and treatment methods for the green colour protection of stripe long-shoot bamboo.
No full textEffect of conductive particle properties on the reliability of anisotropic conductive film for Chip-On-Glass (COG) applications
No full textMotion Planning of Bimanual Robot Using Adaptive Model of Assembly
No full textThis paper presents a motion planning method for a bimanual robot for executing assembly tasks. The method employs ail adaptive modeling which can automatically generate, in assembly model and modify the model during actual assembly. Bimanual robotic assembly is modeled at the task-level using contact states of workpieces and their transitions. The lower-level velocity commands of the workpieces are automatically derived by solving optimization problem formulated with assembly constraints, position of the workpieces, and kinematics of manipulators. Motion requirements of the workpieces are transformed to motion commands of the bimanual robot. The proposed approach is evaluated with experiments on peg-in-hole assembly with ail L-shaped peg
Effect of conductive particle properties on the reliability of anisotropic conductive film for chip-on-glass applications
No full textThis paper describes how the material properties of conductive particles in anisotropic conductive films (ACFs) affect the electrical conductivity and the reliability of ACF interconnections for chip-on-glass (COG) applications. For the conductive particles, Au/Ni-coated polymer particles with a 5-mu m diameter were used. Two different types of conductive particles were characterized with respect to their mechanical and electrical properties, such as ball hardness, recovery behavior, and electrical resistance. In addition, two ACFs were fabricated in the form of a double-layered structure, in which the thickness of the ACF and a nonconductive film (NCF) layer were optimized to have as many conductive particles as possible on the bump after COG bonding. The electrical contact resistance of an ACF interconnection in a COG structure depends mainly on the electrical properties of conductive particles in the ACF. The electrical reliability of an ACF interconnection in a COG structure also depends more on the electrical properties than the mechanical properties of conductive particles under a high-temperature and humid condition. Conductive particles with a lower electrical resistance, higher mechanical hardness, and lower recovery rate show better reliability than conductive particles with a higher electrical resistance, lower mechanical hardness, and higher recovery rate. Cross-sectional scanning electron microscopic (SEM) pictures of a COG interconnection show the deformation of two different conductive particles after the reliability tests. The ACF interconnections in the edge or corner of a driver IC show less reliable joints due to high absorption of moisture
Environmentally benign methods for producing green culms of ma bamboo ( Dendrocalamus latifl orus) and moso bamboo ( Phyllostachys pubescens).
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XPRESS: A Queriable Compression for XML Data
Full text linkACM SIGMOD International Conference on Management of Data(San Diego, California
June 9-12, 2003)Information Technology Research Cente
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