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3 research outputs found
Direct evidence for a Cu-enriched region at the boundary between Cu6Sn5 and Cu3Sn during Cu/Sn reaction
Author
Chung C.Key;Duh, Jenq-Gong;Kao, C.R.
Publication venue
Publication date
2012
Field of study
No full text
National Taiwan University Repository
The critical oxide thickness for Pb-free reflow soldering on Cu substrate
Author
Chung C.Key;Chen, Y.J.;Li, C.C.;Kao, C.R.
Publication venue
Publication date
2012
Field of study
No full text
National Taiwan University Repository
Origin and evolution of voids in electroless Ni during soldering reaction
Author
Chung C.Key;Chen, Y.J.;Chen, W.M.;Kao, C.R.
Publication venue
Publication date
2012
Field of study
No full text
National Taiwan University Repository
No full text
No full text
No full text
