4,802 research outputs found
image-js/tiff: v6.0.0
No full text<h2><a href="https://github.com/image-js/tiff/compare/v5.0.3...v6.0.0">6.0.0</a> (2024-04-08)</h2>
<h3>⚠ BREAKING CHANGES</h3>
<ul>
<li>removed <code>firstImage</code> option, use <code>pages</code> option instead.</li>
</ul>
<h3>Features</h3>
<ul>
<li>add <code>pages</code> option (<a href="https://github.com/image-js/tiff/issues/47">#47</a>) (<a href="https://github.com/image-js/tiff/commit/f0f0bac57a1f8790a9866fb4e476ac0a6e86b345">f0f0bac</a>), closes <a href="https://github.com/image-js/tiff/issues/37">#37</a> <a href="https://github.com/image-js/tiff/issues/46">#46</a></li>
</ul>
<h3>Bug Fixes</h3>
<ul>
<li>Support array sample format (<a href="https://github.com/image-js/tiff/issues/51">#51</a>) (<a href="https://github.com/image-js/tiff/commit/42d778b333764b6e1b74b9af5718416991623fda">42d778b</a>)</li>
</ul>
Chosen logistics processes in Škoda JS
No full textThis master thesis deals with the purchase and sale process in Škoda JS company. The aim of this work is to assess whether the setting of the purchase and sale process is met by the company also within a real business case, in compliance with set controls, and whether the degree of perfect delivery is sufficient. In the introduction, the author specifies the basic terms: logistics, logistic chain, customer benefits, information systems in logistics, buying and selling. The following chapter introduces Škoda JS company, including the sphere of its entrepreneurial activity. This chapter also deals with the nuclear power industry. In the crucial chapter, the author describes the process of purchase and sale in Škoda JS company and compares it with a real business case. In conclusion, the author evaluates discrepancies and suggests recommendations to avoid them
A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps
No full textAlloys of lead-tin system are the most common solder alloys used today. However, there are environmental and health issues concerning the toxicity of lead present in these lead-tin solder alloys. Also, the flux residue removal is mandatory and leads to environmental threats. More importantly, the use of flux may contaminate the optically active surface by organic residue leftover, and a conventional cleaning method may not be effective for optoelectronic assemblies. Therefore, it is necessary to look for fluxless soldering processes for soldering optoelectronic systems. In the present study, we have conducted low-temperature flip-chip bonding of vertical-cavity surface-emitting laser (VCSEL) arrays on a glass substrate that provides propagation paths of laser beams and also supports a polymeric waveguide. Considering both the die shear test and the spreading test, the appropriate bonding temperature and pressure using indium solder bump were found to be about 150 degreesC/500 gf. The fracture occured between the indium solder bump and the VCSEL chip pad during the die shear test. It is inferred that both the low bonding temperature and the oxide layer which is formed on the surface of the indium solder prevented the bump from interacting with the chip pad. We expect the thin silver layer coating on the indium bump to protect the inner indium solder from oxidation and to decrease the melting temperature of the indium solder. Thus, we try coating a thin silver layer onto the indium surface. An eutectic reaction occurs at 97 wt.% of In with an eutectic point of 144 degreesC and the outer silver layer interacts with indium to form a AgIn2 compound layer due to the high interdiffusion coefficient. As a result, the thin silver layer coated on the solder bump is very effective to enhance the adhesion strength between the indium bump and the VCSEL chip pads by decreasing the melting temperature of the indium solder bump locally.This work was supported by the Korea Science and Engineering Foundation, the Electronic Packaging Research Center at the Korea Advanced Institute of Science and Technology, by the Center for Electronic Packaging Materials of the Korea Science and Engineering Foundation, and in part by the national program for teralevel nanodevices as one of the "21st century frontier R&D projects" funded by the Korea Ministry of Science and Technology
Formation of fine pitch solder bumps on polytetrafluoroethylene printed circuit board using dry film photoresist
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Improvement of Adhesion and Microwave Transmission Characteristics of Indium Bump by Silver Coating for Low Temperature Flip-Chip Application
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