10,515 research outputs found
Study On The Wetting Properties, Interfacial Reactions And Mechanical Properties Of Sn-Zn And Sn-Zn-Bi Solders On Copper Metallization [TK7870. R165 2007 f rb].
Secara praktiknya kesemua pemasangan elektronik masa kini menggunakan pateri eutektik Sn-Pb pada antara penyambung. Akibat pertambahan penggunaan peranti elektronik dalam industri serta untuk kegunaan peribadi, maka penggunaan pateri penyambung juga bertambah.
Practically all microelectronic assemblies in use today utilize Sn-Pb eutectic solder for interconnection. Due to the increase in the use of electronic devices within the industry as well as personal use, the usage of solder connections has increased
Isolation and partial characterization of vitellin from the egg of the giant tiger prawn, Penaeus-monodon.
Enzyme-linked-immunosorbent-assay (ELISA) for the detection of antibodies to angiostrongylus-cantonensis.
Blood and cerebrospinal-fluid findings in eosinophilic meningitis and antibody to Angiostrongylus-cantonensis.
Pyruvate kinase and phosphoenolpyruvate carboxykinase activities in adult Angiostrongylus cantonensis.
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