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3,442 research outputs found

Complex conjugate eigenvalues in the spectrum of an operator for resonant activation

Author: Klik Ivo;Chang, C.R.
Publication venue
Publication date: 2012
Field of study

National Taiwan University Repository

Instabilities of a spin-valve system with perpendicular polarizer and in-plane bias field

Author: Chang J.H.;Chen, H.H.;Chang, C.R.
Publication venue
Publication date: 2012
Field of study

National Taiwan University Repository

Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

Author: Yang S.C.; Ho, C.E.; Chang, C.W.; Kao, C.R.
Publication venue
Publication date: 2008
Field of study

National Taiwan University Repository

Modulated room temperature magnetoresistance in manganite superlattices

Author: Song M.Y.;Chen, W.C.;Hsu, Daniel;Chang, C.R.;Lin, J.G.
Publication venue
Publication date: 2012
Field of study

National Taiwan University Repository

Effect of Cu concentration, solder volume, and temperature on the reaction between SnAgCu solders and Ni

Author: Yang S.C.;Chang, C.C.;Tsai, M.H.;Kao, C.R.
Publication venue
Publication date: 2012
Field of study

National Taiwan University Repository

Measuring dc susceptibility of particulate media

Author: Yang J.S.; Lee, J.; Klik, I.; Chang, C.R.
Publication venue
Publication date: 2009
Field of study

National Taiwan University Repository

Thermal effects in highly packed recording media

Author: Chang C.R.; Klik, I.; Yao, Y.D.; Yang, J.-S.
Publication venue
Publication date: 2009
Field of study

National Taiwan University Repository

Effects of Ni Additions on the Growth of Cu3Sn in High-Lead Solders

Author: Wang Y.W.;Chang, C.C.;Chen, W.M.;Kao, C.R.
Publication venue
Publication date: 2012
Field of study

National Taiwan University Repository

Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints

Author: Chang C.C.;Wang, Y.W.;Lai, Y.S.;Kao, C.R.
Publication venue
Publication date: 2012
Field of study

National Taiwan University Repository

Consumption of Cu pad during multiple reflows of Ni-doped SnAgCu solder

Author: Chang C.C.;Yang, S.C.;Chen, Y.J.;Kao, C.R.
Publication venue
Publication date: 2012
Field of study

National Taiwan University Repository

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