132,928 research outputs found

    Preparation and temperature cycling reliability of electroless Ni(P) under bump metallization

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    The reliability of electroless Ni(P) under-bump metallization (UBM) was evaluated via temperature cycling and solder bump shear strength tests. Commercial diodes and dummy dies fabricated in-house were used as substrates for the electroless Ni(P) UBM deposition. Solder bumps were formed after reflowing eutectic 63Sn37Pb solder foils over the Ni(P) UBM. The solder bump shear strength was measured before and after different temperature cycling. The results from this study showed that the UBM thickness and dimension had important effects on the solder bump shear strength and reliability. Both the larger UBM dimension and larger UBM thickness tended to induce higher stress in the UBM, which resulted in the lower solder bump shear strength and lower temperature cycling reliability. A better UBM structure solution for high current electronic packaging application is indicated in this pape

    Bump extraction algorithm for variable amplitude fatigue loading

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    This paper presents the development of a fatigue mission synthesis algorithm, called Wavelet Bump Extraction (WBE), for summarising long records of fatigue road load data. This algorithm is used to extract fatigue damaging events or bumps in the record that cause the majority of the fatigue damage, whilst preserving the load cycle sequences. Bumps are identified from characteristic frequency bands in the load spectrum using the 12th order Daubechies wavelet. The bumps are combined to produce a mission signal which has equivalent signal statistics and fatigue damage to the original signal. The WBE accuracy has been evaluated by observing the cycle sequence effects of the bump loadings. The WBE was compared with the time domain fatigue data editing method, so that the effectiveness of WBE can be verified. Using WBE, a substantial compression of the load-time history could be achieved for the purpose of accelerated fatigue tests in the automotive industry

    Hardware Supported Bump Mapping: A Step towards Ingber Quality Real-Time Rendering

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    Today's high-end Gouraud renderers produce nicely textured scenes by mapping two-dimensional images onto modeled objects in real· time. We present a renderer which textures surfaces in the normal sense of the word using bump textures to simulate wrinkled or dimpled color­ ful surfaces. Using a simplified bump mapping method we first suc­ ceeded in designing a real-time bump mapping renderer based on the high-quality Phong shading model.Applying several improvements to our former Phong shading hard­ ware we are able to walk through perspectively correct bump mapped scenes illuminated by colored lightsources. This paper describes the main building blocks of the overall architec­ ture, including reflectance cubes to support a local viewer, a Taylor­ series based division to calculate homogeneous coordinates and our hardware adapted bump mapping method.Tenth Eurographics Workshop on Graphics Hardwar

    An experimental validation of the fatigue damaging events extracted using the wavelet bump extraction (WBE) algorithm

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    This paper describes an experimental validation of the fatigue damaging events that were identified and extracted using a wavelet-based fatigue data editing technique. This technique, known as the Wavelet Bump Extraction (WBE) algorithm, is specifically designed to summarise a long record of fatigue variable amplitude (VA) loading whilst preserving the original load cycle sequence. Using WBE the fatigue damaging events were identified and extracted in order to produce a mission signal. In order to validate the effectiveness of WBE in practical applications a VA road load time history that was measured on a road vehicle suspension arm was taken as a case study. Uniaxial fatigue tests were performed using the original signal, the WBE mission signal and the individual WBE extracted segments. A mirror polished specimen of SAE 1042 steel was tested using a servo-hydraulic machine. The fatigue lives measured for these VA loadings were then compared to the fatigue lives calculated from a VA strain loading fatigue damage model. The results show a good fatigue life correlation at the coefficient of 0.98 between the prediction and experiment. For the road load time history considered, the WBE mission signal was found to be only 40% the time duration of the original time history while maintaining 60% of the fatigue damage according to analytical calculation and 87% according to experimental testing

    Portrait of Clarence L. and Daniel D. Bump

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    A formal portrait of two young men each wearing a buttoned jacket with a tie and white shirt. Background is a typical studio background.[back] [black printed ink] C. L. Bump and Daniel D. Bump Early 1900’s Picture [black ink] [handwritten] DD & CL Bump; Clarence & Daniel D Bump Daniel first attended Tualatin Academy & graduated from Pacific in 190

    Orlo M. Bump, M. D.

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    Photo of Doctor Orlo M. Bump in 1904. Bump was born in 1832 and died in 1921 in Salisbury, Vermont.[Back] Orlo M. Bump Born 1832; Pho 1904; Pacific University Museum

    R code and data for "Comparing multiple survey and recruitment-mortality models to assess growth rates and population projections"

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    See ReadMe text file for a comprehensive description of all uploaded data files.This collection of files provides data and R code supporting the publication "Comparing survey and multiple recruitment-mortality models to assess growth rates and population projections" in Ecology and Evolution. We provide all necessary data not included in the manuscript to reproduce the analysis of growth rates and population projections of moose in northeastern Minnesota.Minnesota Environmental and Natural Resources Trust FundWildlife Restoration (Pittman-Robertson) ProgramMinnesota Department of Natural Resources Section of Wildlife’s Wildlife Populations and Research UnitMinnesota Deer Hunters AssociationNational Science Foundation NSF ID#1545611National Science Foundation NSF ID#1556676Severud, William J; DelGiudice, Glenn D; Bump, Joseph K. (2019). R code and data for "Comparing multiple survey and recruitment-mortality models to assess growth rates and population projections". Retrieved from the University Digital Conservancy, https://doi.org/10.13020/bd01-3547

    Portrait of Daniel D. Bump

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    A formal portrait of a young man wearing an open coat over a buttoned jacket with a tie and white shirt. He is holding a derby hat in his left hand and his curly hair is parted in the middle. Background looks to be a corner of a room with crown molding at the top.[back] [black printed ink] Picture of Daniel D. Bump, father of Kenneth & Dr. Forrest Bump. Mr. Bump was born July 22, 1881 on the farm owned by his family near Kings Valley, Oregon and located in Polk and Benton Counties. When Daniel was about 19 years of age the family leased the farm and moved to Forest Grove so that he could attend Tualatin Academy from which he graduated and then went on to graduate from Pacific University in 1906. After graduating from Pacific he attended the University of Oregon Law School and graduated with his law degree and passed the Oregon Bar in 1912. He practiced law in Hillsboro with his older brother until 1918 at which time he moved his practice to Forest Grove and practiced there until 1962. He passed away in February of 1966

    Portrait of Daniel Bump

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    Portrait of Daniel D. Bump, Class of 1906. He attended Tualatin Academy before going to Pacific University. After graduating from Pacific, he attended the University of Oregon Law School and practiced law in Hillsboro with his older brother until 1918. He lived from 1881 to 1966.[back] D D Bump 190
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