12 research outputs found
Identification and recovery of rare earth elements from electronic waste: Material characterization and recovery strategies
The sustained growth of the electronic and electrical industries necessitates not only efficient energy utilization throughout all manufacturing stages but also the recycling of end-of-life electric and electronic components. However, rapid advancements, miniaturization, and added value have led to a significant accumulation of e-waste, posing environmental concerns. Rare Earth Elements (REE) are considered critical raw materials that face a risk of global supply shortage due to their highly desirable performance-enhancing properties such as corrosion resistance. This study focuses on identification and exploring the recycling possibilities of different types of electronic waste for Rare Earth Materials. The electronic waste is first disassembled and categorized, after which material characterization techniques are employed to identify Rare Earth Elements (REEs). X-Ray Diffraction, X-ray fluorescence spectroscopy, Scanning Electron Microscopy, and Energy-dispersive X-ray spectroscopy are utilized for this identification. Subsequently, an in-depth review of existing literature is conducted to ascertain the most appropriate method for recovering these REEs. Neodymium and Dysprosium are among the REEs identified in the electronic waste samples.</p
Design, Development, and Performance Evaluation of a Lightweight Short Shifter for Enhanced Gear-Shifting Quality in Automobile
The quality of gear shifting is a crucial factor that determines customer acceptance and vehicle quality evaluation, whether it is for manual or automatic transmissions. This study focuses on the design and development of a short shifter for the Honda Civic Type R EK9 chassis. This study uses a blend of structural analysis and 3D printing technology. A short shifter is a modified version of the standard shifter lever, requiring less movement input to change gears. The design parameters for the short shifter were chosen, and an OEM shifter was obtained as a reference. A throw measuring stand was created using Catia V5 and 3D printed with an Ender 3 Pro 3D FDM printer to measure the throw of both the OEM shifter and the short shifter prototype. The resulting values were compared, and the percentile increase in throw was determined. Additionally, FEA simulations were conducted to evaluate the structural integrity of the redesigned part. The final prototype of the short shifter is significantly lighter than that of the OEM shifter, weighing only 253 g or 3.875 times lighter
Computational Analysis of Heat Dissipation Strategies in Li-Ion Battery System Using Aluminium 7075 and Aluminium 6061
This study examines the thermal behaviour of batteries by doing a computational fluid dynamics (CFD) analysis on them using ANSYS. The analysis focuses on various heat sink configurations, including situations without heat sinks as well as those with aluminium alloys 7075 and 6061 of varying thicknesses. The purpose of this study is to determine how effective various setups are in preventing thermal runaway and maintaining temperature rises that are acceptable within predetermined parameters. The findings demonstrate that thicker heat sinks are more effective in improving heat dissipation and the overall performance of battery cooling systems. The comparisons made between the various materials and thicknesses provide insights into the most effective design for heat management systems. In the end, this research contributes to enhanced battery safety, performance, and longevity. Additionally, it serves as a vital reference for engineers and researchers working to advance energy storage technology across a variety of applications
EBSD characterization of Ag<sub>3</sub>Sn phase transformation in Sn–Ag lead-free solder alloys:a comparative study before and after heat treatment
The phase transformation and microstructural evolution of Sn–Ag solder alloys under heat treatment, with a focus on the Ag3Sn phase, were investigated to address the need for reliable lead-free solder alternatives in electronic packaging. Initially, the solder alloy exhibited a fine eutectic structure with well-dispersed Ag3Sn particles and a polycrystalline grain structure devoid of any strong crystallographic texture. Following heat treatment, significant microstructural changes were observed, including the coarsening of the Ag3Sn phase and the development of a preferred grain orientation, suggesting recrystallization and grain growth. XRD analysis revealed a decrease in the intensity of the Sn phase peaks and an increase in the coarseness of the Ag3Sn peaks post-heat treatment, indicating phase evolution and redistribution of silver within the alloy. The EBSD results supported the SEM findings, showing elongation and growth of grains and a shift in texture. These changes imply that heat treatment can significantly alter the mechanical properties of Sn–Ag solders, particularly affecting creep resistance and hardness due to the evolution of anisotropic mechanical properties. The study provides essential insights into the selection and optimization of solder materials for high-reliability applications in the electronics industry
Microstructural Evolution and Phase Transformation on Sn–Ag Solder Alloys under High‐Temperature Conditions Focusing on Ag<sub>3</sub>Sn Phase
This study investigates the microstructural and phase transformations in Sn–Ag solder alloys under high‐temperature conditions, utilizing X‐ray diffraction, scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) analyses. Analytical techniques are employed pre‐ and postcontrolled thermal cycling from 30 to 180 °C, aimed at emulating solder reflow processes. The analysis at room temperature demonstrates pronounced crystalline peaks, suggesting a preferred orientation within the crystal structure. Upon heating, peak broadening suggests grain growth and the onset of recrystallization. SEM and energy‐dispersive spectroscopy analyses corroborate these findings, displaying a fine‐grained, well‐distributed microstructure with a homogenous composition of Sn and Ag elements. EBSD provides insights into the orientation and texture of grains, revealing a weak‐to‐moderate texture across the phases. Postexperiment data indicate a dominant presence of larger grains and significant variation in grain size, with an area‐weighted mean grain size of 68.47 μm and a standard deviation of 8.68 μm; this suggests significant grain growth and coarsening of the Ag3Sn intermetallic compounds. These structural evolutions have crucial implications for the mechanical properties and reliability of the solder alloy in electronic assemblies, underscoring the need for further exploration of lead‐free solder materials in the electronics industry
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Experimental Evaluation of Turning AISI 304 Using Minimum Quantity Lubrication With Vegetable‐Based Green Cutting Fluids
Cutting fluids play a crucial role in dissipating the heat generated during machining operations, contributing to improved service life and machinability of tools and workpieces. Even though commercially available conventional cutting fluids are effective in serving their intended roles during the machining process, they are non‐biodegradable. Previous researchers have introduced a variety of environmentally friendly alternatives, among which green cutting fluids stand out due to their biodegradability and availability. The present study focuses on a comparative assessment of the machining performance of green cutting fluids, made from oil‐water emulsions derived from coconut oil, sunflower oil, and palm oil, with a conventional cutting fluid (MAK Sherol B) during the turning operation of AISI 304 stainless steel. Tween 20 is used as the emulsifying agent for preparing oil‐water emulsion. The machining performance was investigated by examining the impact of these cutting fluids on cutting speed, feed rate, and depth of cut on tool tip interface temperature, surface roughness, and cutting force during the turning process. Surface roughness values are determined using surface profilometry and Atomic Force Microscopy (AFM). The results indicate that palm oil has rendered the lowest cutting force and cutting temperature with improved surface quality under higher feed rates, cutting speeds, and depths of cut as compared with sunflower oil, coconut oil, and conventional cutting fluid
Small-angle neutron scattering analysis in Sn-Ag Lead-free solder alloys:A focus on the Ag<sub>3</sub>Sn intermetallic phase
This study addresses the critical need for lead-free solder alternatives in electronic manufacturing by investigating the microstructural characteristics of Sn-Ag solder alloys, focusing on the Ag3Sn intermetallic phase. Utilizing Small-Angle Neutron Scattering (SANS), the study explored the phase interface and grain structure within Sn-Ag alloy to identify attributes that influence mechanical stability and performance. The research was structured around a comprehensive SANS analysis, complemented by Electron Backscatter Diffraction (EBSD) to expose the morphology and orientation of crystalline phases within the material. The investigation revealed distinct scattering patterns indicative of a multi-phase structure with a homogeneous distribution of fine Ag3Sn precipitates within a β-Sn matrix. EBSD data confirmed these findings, showing a wide range of grain sizes and a random orientation distribution that matches theoretical models for polycrystalline materials. Notably, the SANS data uncovered a specific size distribution of the Ag3Sn phase, which was characterized by a sharp interface contrast against the β-Sn matrix, pivotal for understanding the solder's mechanical properties. Interpretation of the SANS and EBSD data sets suggests that the Sn-Ag alloy's performance is significantly influenced by the dispersion and morphology of the Ag3Sn phase. The presence of nanoscale Ag3Sn structures, exhibiting a needle-like surface, implies a material optimized for mechanical reinforcement, which is essential for robust electronic connections. The integrated approach offers a novel perspective on the nano structural arrangement of lead-free solders, contributing to the advancement of safer, more reliable electronic materials. The findings have significant implications for the development of next-generation electronic components, reinforcing the transition to environmentally benign manufacturing processes.</p
Experimental Evaluation of Turning AISI 304 Using Minimum Quantity Lubrication With Vegetable‐Based Green Cutting Fluids
Cutting fluids play a crucial role in dissipating the heat generated during machining operations, contributing to improved service life and machinability of tools and workpieces. Even though commercially available conventional cutting fluids are effective in serving their intended roles during the machining process, they are non‐biodegradable. Previous researchers have introduced a variety of environmentally friendly alternatives, among which green cutting fluids stand out due to their biodegradability and availability. The present study focuses on a comparative assessment of the machining performance of green cutting fluids, made from oil‐water emulsions derived from coconut oil, sunflower oil, and palm oil, with a conventional cutting fluid (MAK Sherol B) during the turning operation of AISI 304 stainless steel. Tween 20 is used as the emulsifying agent for preparing oil‐water emulsion. The machining performance was investigated by examining the impact of these cutting fluids on cutting speed, feed rate, and depth of cut on tool tip interface temperature, surface roughness, and cutting force during the turning process. Surface roughness values are determined using surface profilometry and Atomic Force Microscopy (AFM). The results indicate that palm oil has rendered the lowest cutting force and cutting temperature with improved surface quality under higher feed rates, cutting speeds, and depths of cut as compared with sunflower oil, coconut oil, and conventional cutting fluid
