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1,721,977 research outputs found

3D integration, crossing IC technology, packaging and design barriers

Author: Beyne Eric
Publication venue
Publication date: 01/01/2008
Field of study

imec Publications (Interuniversity Microelectronics Centre)

Heterogeneous device integration as enable of functional diversification for More than Moore

Author: Beyne Eric
Publication venue
Publication date: 01/01/2010
Field of study

imec Publications (Interuniversity Microelectronics Centre)

High density multilayer thin film interconnect technologies for SiP

Author: Beyne Eric
Publication venue
Publication date: 01/01/2004
Field of study

imec Publications (Interuniversity Microelectronics Centre)

Heterogeneous integration

Author: Beyne Eric
Publication venue
Publication date: 31/12/9999
Field of study

imec Publications (Interuniversity Microelectronics Centre)

TSV technology developments

Author: Beyne Eric
Publication venue
Publication date: 01/01/2011
Field of study

imec Publications (Interuniversity Microelectronics Centre)

3D technology – enabling innovative smart systems

Author: Beyne Eric
Publication venue
Publication date: 01/01/2011
Field of study

imec Publications (Interuniversity Microelectronics Centre)

Challenges for the interconnect industry - outsourcing and the interconnect bottleneck

Author: Beyne Eric
Publication venue
Publication date: 01/01/2004
Field of study

imec Publications (Interuniversity Microelectronics Centre)

3D integration technologies at IMEC

Author: Beyne Eric
Publication venue
Publication date: 01/01/2008
Field of study

imec Publications (Interuniversity Microelectronics Centre)

Die requirements for 3D integration

Author: Beyne Eric
Publication venue
Publication date: 01/01/2007
Field of study

imec Publications (Interuniversity Microelectronics Centre)

Challenges and opportunities for stacking ICs

Author: Beyne Eric
Publication venue
Publication date: 01/01/2014
Field of study

imec Publications (Interuniversity Microelectronics Centre)

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