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    Equivalent network synthesis for via holes discontinuities

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    A methodology is presented for the synthesis of passive equivalent circuit of via holes in multilayers printed circuit boards. The paper describes the network synthesis starting from the extraction of the poles and residues from the driving point transfer functions for two ports networks. The via hole is partitioned into elementary structures assumed not electromagnetically coupled and the scattering parameters for each one of them are evaluated by using a numerical approach suitably validated by comparison with results computed by other independent numerical methods. The equivalent circuit of the complete via hole is given by the cascading of the circuits of the elementary structures. The proposed technique is validated by comparing the computed scattering parameters with those coming from the measurements for a real test boards

    Cross-SSN analysis in multilayer printed circuit boards

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    As digital circuits became faster and more power is involved, direct coupling in multilayer printed circuit boards (PCBs) among power (PWR) planes becomes a major concern for signal integrity (SI) and electromagnetic interference (EMI). Aim of this paper is to show how an electromagnetic wave can propagate between planes and therefore induce noise on the signals crossing the planes' pairs through vias eventually radiate from the edge of the board. More specifically our study focuses on the analysis of the noise which propagates from a power plane to another power plane due to their proximity, named cross-simultaneous switching noise (X-SSN). This effect can be mitigated by a careful analysis of the location of PWR and ground (GND) planes in the board stack-up which avoid the contiguity of two PWR planes. A test board is built and measurements are performed. These measurements are also compared with three dimensional numerical results
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